DE112009000415B4 - Testsystem mit Hochfrequenzinterposer - Google Patents

Testsystem mit Hochfrequenzinterposer Download PDF

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Publication number
DE112009000415B4
DE112009000415B4 DE112009000415.6T DE112009000415T DE112009000415B4 DE 112009000415 B4 DE112009000415 B4 DE 112009000415B4 DE 112009000415 T DE112009000415 T DE 112009000415T DE 112009000415 B4 DE112009000415 B4 DE 112009000415B4
Authority
DE
Germany
Prior art keywords
conductive
interposer
conductive housing
contact
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112009000415.6T
Other languages
German (de)
English (en)
Other versions
DE112009000415T5 (de
Inventor
Cartier Marc B.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE112009000415T5 publication Critical patent/DE112009000415T5/de
Application granted granted Critical
Publication of DE112009000415B4 publication Critical patent/DE112009000415B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
DE112009000415.6T 2008-02-21 2009-02-19 Testsystem mit Hochfrequenzinterposer Active DE112009000415B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/070,864 2008-02-21
US12/070,864 US7816932B2 (en) 2008-02-21 2008-02-21 Test system with high frequency interposer
PCT/US2009/001045 WO2009105222A2 (en) 2008-02-21 2009-02-19 Test system with high frequency interposer

Publications (2)

Publication Number Publication Date
DE112009000415T5 DE112009000415T5 (de) 2011-01-13
DE112009000415B4 true DE112009000415B4 (de) 2024-07-11

Family

ID=40801937

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112009000415.6T Active DE112009000415B4 (de) 2008-02-21 2009-02-19 Testsystem mit Hochfrequenzinterposer

Country Status (7)

Country Link
US (1) US7816932B2 (enExample)
JP (2) JP2011514519A (enExample)
KR (1) KR101547890B1 (enExample)
CN (1) CN102027380B (enExample)
DE (1) DE112009000415B4 (enExample)
TW (1) TWI438438B (enExample)
WO (1) WO2009105222A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
CH705740B1 (de) 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
CN102809696B (zh) * 2012-08-17 2015-04-15 福建南平南孚电池有限公司 金属夹具、具有该金属夹具的设备及其使用方法
US9435855B2 (en) * 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US20190045632A1 (en) * 2018-08-01 2019-02-07 Intel Corporation Connector, board assembly, computing system, and methods thereof
WO2021261285A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ 検査装置
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837507A (en) 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
US5427535A (en) 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US20070152689A1 (en) 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card

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JPS5367084U (enExample) * 1976-11-09 1978-06-06
US4451107A (en) 1982-08-23 1984-05-29 Amp Incorporated High speed modular connector for printed circuit boards
US4881905A (en) 1986-05-23 1989-11-21 Amp Incorporated High density controlled impedance connector
US5178549A (en) * 1991-06-27 1993-01-12 Cray Research, Inc. Shielded connector block
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
JP2792494B2 (ja) * 1996-01-17 1998-09-03 日本電気株式会社 集積回路の実装構造
JPH11248748A (ja) * 1998-03-05 1999-09-17 Advantest Corp プローブカード
US6352436B1 (en) 2000-06-29 2002-03-05 Teradyne, Inc. Self retained pressure connection
US6344684B1 (en) 2000-07-06 2002-02-05 Advanced Micro Devices, Inc. Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint
US6544072B2 (en) 2001-06-12 2003-04-08 Berg Technologies Electrical connector with metallized polymeric housing
JP3742324B2 (ja) * 2001-10-17 2006-02-01 アンリツ株式会社 電極プローバー
US6686732B2 (en) 2001-12-20 2004-02-03 Teradyne, Inc. Low-cost tester interface module
EP1482313B1 (en) 2002-02-07 2007-11-21 Yokowo Co., Ltd Capacity load type probe, and test jig using the same
DE60310739T2 (de) * 2002-08-27 2007-10-11 Jsr Corp. Anisotrope leitfähige folie und impedanzmesssonde
US6784679B2 (en) 2002-09-30 2004-08-31 Teradyne, Inc. Differential coaxial contact array for high-density, high-speed signals
JP2004138405A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置測定用プローブ
JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
JP2004325306A (ja) 2003-04-25 2004-11-18 Yokowo Co Ltd 検査用同軸プローブおよびそれを用いた検査ユニット
CN1265685C (zh) * 2003-05-27 2006-07-19 建汉科技股份有限公司 具信号撷取垫的高频电路板及其测量工具
JP4689196B2 (ja) 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット
JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
EP1768214B1 (en) * 2004-07-15 2012-03-14 JSR Corporation Inspection equipment for circuit device with anisotropic conductive connector
JP4405358B2 (ja) 2004-09-30 2010-01-27 株式会社ヨコオ 検査ユニット
JP4535828B2 (ja) 2004-09-30 2010-09-01 株式会社ヨコオ 検査ユニットの製法
US7180321B2 (en) 2004-10-01 2007-02-20 Teradyne, Inc. Tester interface module
US7046027B2 (en) 2004-10-15 2006-05-16 Teradyne, Inc. Interface apparatus for semiconductor device tester
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
US7279911B2 (en) * 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
JP2007311092A (ja) * 2006-05-17 2007-11-29 Yazaki Corp 印刷配線板組立体及び該印刷配線板組立体の製造方法
JP5008005B2 (ja) * 2006-07-10 2012-08-22 東京エレクトロン株式会社 プローブカード
JP5024861B2 (ja) * 2006-08-01 2012-09-12 日本電子材料株式会社 プローブカード

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837507A (en) 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
US5427535A (en) 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US20070152689A1 (en) 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card

Also Published As

Publication number Publication date
US20090212802A1 (en) 2009-08-27
JP2016053588A (ja) 2016-04-14
WO2009105222A3 (en) 2009-12-17
US7816932B2 (en) 2010-10-19
TWI438438B (zh) 2014-05-21
WO2009105222A2 (en) 2009-08-27
TW200937017A (en) 2009-09-01
CN102027380B (zh) 2014-03-12
JP2011514519A (ja) 2011-05-06
KR20100122086A (ko) 2010-11-19
CN102027380A (zh) 2011-04-20
KR101547890B1 (ko) 2015-08-27
DE112009000415T5 (de) 2011-01-13

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R082 Change of representative

Representative=s name: FISH & RICHARDSON P.C., DE

R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: G01R0001067000

Ipc: G01R0031280000

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final