JP2011514519A5 - - Google Patents

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Publication number
JP2011514519A5
JP2011514519A5 JP2010547635A JP2010547635A JP2011514519A5 JP 2011514519 A5 JP2011514519 A5 JP 2011514519A5 JP 2010547635 A JP2010547635 A JP 2010547635A JP 2010547635 A JP2010547635 A JP 2010547635A JP 2011514519 A5 JP2011514519 A5 JP 2011514519A5
Authority
JP
Japan
Prior art keywords
conductive
interposer
conductive housing
insulator
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010547635A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011514519A (ja
Filing date
Publication date
Priority claimed from US12/070,864 external-priority patent/US7816932B2/en
Application filed filed Critical
Publication of JP2011514519A publication Critical patent/JP2011514519A/ja
Publication of JP2011514519A5 publication Critical patent/JP2011514519A5/ja
Pending legal-status Critical Current

Links

JP2010547635A 2008-02-21 2009-02-19 高周波数介在器をもったテストシステム Pending JP2011514519A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/070,864 US7816932B2 (en) 2008-02-21 2008-02-21 Test system with high frequency interposer
PCT/US2009/001045 WO2009105222A2 (en) 2008-02-21 2009-02-19 Test system with high frequency interposer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015235356A Division JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Publications (2)

Publication Number Publication Date
JP2011514519A JP2011514519A (ja) 2011-05-06
JP2011514519A5 true JP2011514519A5 (enExample) 2013-09-05

Family

ID=40801937

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010547635A Pending JP2011514519A (ja) 2008-02-21 2009-02-19 高周波数介在器をもったテストシステム
JP2015235356A Pending JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015235356A Pending JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Country Status (7)

Country Link
US (1) US7816932B2 (enExample)
JP (2) JP2011514519A (enExample)
KR (1) KR101547890B1 (enExample)
CN (1) CN102027380B (enExample)
DE (1) DE112009000415B4 (enExample)
TW (1) TWI438438B (enExample)
WO (1) WO2009105222A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
CH705740B1 (de) * 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
CN102809696B (zh) * 2012-08-17 2015-04-15 福建南平南孚电池有限公司 金属夹具、具有该金属夹具的设备及其使用方法
US9435855B2 (en) * 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US20190045632A1 (en) * 2018-08-01 2019-02-07 Intel Corporation Connector, board assembly, computing system, and methods thereof
CN215768872U (zh) * 2020-06-22 2022-02-08 株式会社友华 检查装置
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

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JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
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JP4535828B2 (ja) 2004-09-30 2010-09-01 株式会社ヨコオ 検査ユニットの製法
JP4405358B2 (ja) 2004-09-30 2010-01-27 株式会社ヨコオ 検査ユニット
US7180321B2 (en) 2004-10-01 2007-02-20 Teradyne, Inc. Tester interface module
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JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
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JP5024861B2 (ja) 2006-08-01 2012-09-12 日本電子材料株式会社 プローブカード

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