KR101547890B1 - 고주파수 인터포저를 가진 테스트 시스템 - Google Patents

고주파수 인터포저를 가진 테스트 시스템 Download PDF

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Publication number
KR101547890B1
KR101547890B1 KR1020107019361A KR20107019361A KR101547890B1 KR 101547890 B1 KR101547890 B1 KR 101547890B1 KR 1020107019361 A KR1020107019361 A KR 1020107019361A KR 20107019361 A KR20107019361 A KR 20107019361A KR 101547890 B1 KR101547890 B1 KR 101547890B1
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South Korea
Prior art keywords
conductive
conductive housing
interposer
housing
insulator
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KR1020107019361A
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Korean (ko)
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KR20100122086A (ko
Inventor
마르크 비. 카티에
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테라다인 인코퍼레이티드
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020107019361A 2008-02-21 2009-02-19 고주파수 인터포저를 가진 테스트 시스템 Active KR101547890B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/070,864 2008-02-21
US12/070,864 US7816932B2 (en) 2008-02-21 2008-02-21 Test system with high frequency interposer

Publications (2)

Publication Number Publication Date
KR20100122086A KR20100122086A (ko) 2010-11-19
KR101547890B1 true KR101547890B1 (ko) 2015-08-27

Family

ID=40801937

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019361A Active KR101547890B1 (ko) 2008-02-21 2009-02-19 고주파수 인터포저를 가진 테스트 시스템

Country Status (7)

Country Link
US (1) US7816932B2 (enExample)
JP (2) JP2011514519A (enExample)
KR (1) KR101547890B1 (enExample)
CN (1) CN102027380B (enExample)
DE (1) DE112009000415B4 (enExample)
TW (1) TWI438438B (enExample)
WO (1) WO2009105222A2 (enExample)

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US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
CH705740B1 (de) 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
CN102809696B (zh) * 2012-08-17 2015-04-15 福建南平南孚电池有限公司 金属夹具、具有该金属夹具的设备及其使用方法
US9435855B2 (en) * 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US20190045632A1 (en) * 2018-08-01 2019-02-07 Intel Corporation Connector, board assembly, computing system, and methods thereof
WO2021261285A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ 検査装置
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

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JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
JP2005156530A (ja) 2003-11-05 2005-06-16 Nhk Spring Co Ltd 導電性接触子ホルダ、導電性接触子ユニット
JP2006349692A (ja) 2006-08-01 2006-12-28 Japan Electronic Materials Corp プローブカード

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US4837507A (en) 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
US4881905A (en) 1986-05-23 1989-11-21 Amp Incorporated High density controlled impedance connector
US5178549A (en) * 1991-06-27 1993-01-12 Cray Research, Inc. Shielded connector block
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
US5427535A (en) 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
JP2792494B2 (ja) * 1996-01-17 1998-09-03 日本電気株式会社 集積回路の実装構造
JPH11248748A (ja) * 1998-03-05 1999-09-17 Advantest Corp プローブカード
US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6352436B1 (en) 2000-06-29 2002-03-05 Teradyne, Inc. Self retained pressure connection
US6344684B1 (en) 2000-07-06 2002-02-05 Advanced Micro Devices, Inc. Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint
US6544072B2 (en) 2001-06-12 2003-04-08 Berg Technologies Electrical connector with metallized polymeric housing
JP3742324B2 (ja) * 2001-10-17 2006-02-01 アンリツ株式会社 電極プローバー
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JP2004138405A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置測定用プローブ
JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
JP2005156530A (ja) 2003-11-05 2005-06-16 Nhk Spring Co Ltd 導電性接触子ホルダ、導電性接触子ユニット
JP2006349692A (ja) 2006-08-01 2006-12-28 Japan Electronic Materials Corp プローブカード

Also Published As

Publication number Publication date
DE112009000415B4 (de) 2024-07-11
US20090212802A1 (en) 2009-08-27
JP2016053588A (ja) 2016-04-14
WO2009105222A3 (en) 2009-12-17
US7816932B2 (en) 2010-10-19
TWI438438B (zh) 2014-05-21
WO2009105222A2 (en) 2009-08-27
TW200937017A (en) 2009-09-01
CN102027380B (zh) 2014-03-12
JP2011514519A (ja) 2011-05-06
KR20100122086A (ko) 2010-11-19
CN102027380A (zh) 2011-04-20
DE112009000415T5 (de) 2011-01-13

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