TWI438438B - 具有高頻內插器之測試系統 - Google Patents

具有高頻內插器之測試系統 Download PDF

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Publication number
TWI438438B
TWI438438B TW098105383A TW98105383A TWI438438B TW I438438 B TWI438438 B TW I438438B TW 098105383 A TW098105383 A TW 098105383A TW 98105383 A TW98105383 A TW 98105383A TW I438438 B TWI438438 B TW I438438B
Authority
TW
Taiwan
Prior art keywords
conductive
interposer
outer casing
contact
contacts
Prior art date
Application number
TW098105383A
Other languages
English (en)
Chinese (zh)
Other versions
TW200937017A (en
Inventor
Cartier, Jr
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of TW200937017A publication Critical patent/TW200937017A/zh
Application granted granted Critical
Publication of TWI438438B publication Critical patent/TWI438438B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
TW098105383A 2008-02-21 2009-02-20 具有高頻內插器之測試系統 TWI438438B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/070,864 US7816932B2 (en) 2008-02-21 2008-02-21 Test system with high frequency interposer

Publications (2)

Publication Number Publication Date
TW200937017A TW200937017A (en) 2009-09-01
TWI438438B true TWI438438B (zh) 2014-05-21

Family

ID=40801937

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098105383A TWI438438B (zh) 2008-02-21 2009-02-20 具有高頻內插器之測試系統

Country Status (7)

Country Link
US (1) US7816932B2 (enExample)
JP (2) JP2011514519A (enExample)
KR (1) KR101547890B1 (enExample)
CN (1) CN102027380B (enExample)
DE (1) DE112009000415B4 (enExample)
TW (1) TWI438438B (enExample)
WO (1) WO2009105222A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
CH705740B1 (de) 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
CN102809696B (zh) * 2012-08-17 2015-04-15 福建南平南孚电池有限公司 金属夹具、具有该金属夹具的设备及其使用方法
US9435855B2 (en) * 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US20190045632A1 (en) * 2018-08-01 2019-02-07 Intel Corporation Connector, board assembly, computing system, and methods thereof
WO2021261285A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ 検査装置
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

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JPS5367084U (enExample) * 1976-11-09 1978-06-06
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US4837507A (en) 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
US4881905A (en) 1986-05-23 1989-11-21 Amp Incorporated High density controlled impedance connector
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JPH11248748A (ja) * 1998-03-05 1999-09-17 Advantest Corp プローブカード
US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6352436B1 (en) 2000-06-29 2002-03-05 Teradyne, Inc. Self retained pressure connection
US6344684B1 (en) 2000-07-06 2002-02-05 Advanced Micro Devices, Inc. Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint
US6544072B2 (en) 2001-06-12 2003-04-08 Berg Technologies Electrical connector with metallized polymeric housing
JP3742324B2 (ja) * 2001-10-17 2006-02-01 アンリツ株式会社 電極プローバー
US6686732B2 (en) 2001-12-20 2004-02-03 Teradyne, Inc. Low-cost tester interface module
EP1482313B1 (en) 2002-02-07 2007-11-21 Yokowo Co., Ltd Capacity load type probe, and test jig using the same
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JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
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JP2004325306A (ja) 2003-04-25 2004-11-18 Yokowo Co Ltd 検査用同軸プローブおよびそれを用いた検査ユニット
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JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
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JP5024861B2 (ja) * 2006-08-01 2012-09-12 日本電子材料株式会社 プローブカード

Also Published As

Publication number Publication date
DE112009000415B4 (de) 2024-07-11
US20090212802A1 (en) 2009-08-27
JP2016053588A (ja) 2016-04-14
WO2009105222A3 (en) 2009-12-17
US7816932B2 (en) 2010-10-19
WO2009105222A2 (en) 2009-08-27
TW200937017A (en) 2009-09-01
CN102027380B (zh) 2014-03-12
JP2011514519A (ja) 2011-05-06
KR20100122086A (ko) 2010-11-19
CN102027380A (zh) 2011-04-20
KR101547890B1 (ko) 2015-08-27
DE112009000415T5 (de) 2011-01-13

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