JP2011513954A5 - - Google Patents
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- Publication number
- JP2011513954A5 JP2011513954A5 JP2010547942A JP2010547942A JP2011513954A5 JP 2011513954 A5 JP2011513954 A5 JP 2011513954A5 JP 2010547942 A JP2010547942 A JP 2010547942A JP 2010547942 A JP2010547942 A JP 2010547942A JP 2011513954 A5 JP2011513954 A5 JP 2011513954A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- growth substrate
- epitaxial layer
- optoelectronic device
- layer sequence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 10
- 230000005693 optoelectronics Effects 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 3
- 238000000059 patterning Methods 0.000 claims 3
- 238000005253 cladding Methods 0.000 claims 2
- -1 nitride compound Chemical class 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000006748 scratching Methods 0.000 claims 1
- 230000002393 scratching effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008011864 | 2008-02-29 | ||
| DE102008019268A DE102008019268A1 (de) | 2008-02-29 | 2008-04-17 | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| PCT/DE2009/000116 WO2009106028A1 (de) | 2008-02-29 | 2009-01-28 | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011513954A JP2011513954A (ja) | 2011-04-28 |
| JP2011513954A5 true JP2011513954A5 (enExample) | 2012-03-01 |
Family
ID=40911434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010547942A Pending JP2011513954A (ja) | 2008-02-29 | 2009-01-28 | オプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8711893B2 (enExample) |
| EP (1) | EP2248235B1 (enExample) |
| JP (1) | JP2011513954A (enExample) |
| DE (1) | DE102008019268A1 (enExample) |
| TW (1) | TWI426674B (enExample) |
| WO (1) | WO2009106028A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2243866A1 (en) * | 2008-01-16 | 2010-10-27 | National University Corporation Tokyo University of Agriculture and Technology | Process for producing laminate comprising al-based group iii nitride single crystal layer, laminate produced by the process, process for producing al-based group iii nitride single crystal substrate using the laminate, and aluminum nitride single crystal substrate |
| FR2953328B1 (fr) * | 2009-12-01 | 2012-03-30 | S O I Tec Silicon On Insulator Tech | Heterostructure pour composants electroniques de puissance, composants optoelectroniques ou photovoltaiques |
| DE102010046793B4 (de) | 2010-09-28 | 2024-05-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Kantenemittierende Halbleiterlaserdiode und Verfahren zu dessen Herstellung |
| DE102011113775B9 (de) | 2011-09-19 | 2021-10-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| TWI495163B (zh) * | 2011-12-09 | 2015-08-01 | 中華電信股份有限公司 | A method for manufacturing a resonant cavity light emitting diode |
| EP2618385A1 (de) | 2012-01-20 | 2013-07-24 | AZUR SPACE Solar Power GmbH | Halbzeug einer Mehrfachsolarzelle und Verfahren zur Herstellung einer Mehrfachsolarzelle |
| CN103400912B (zh) * | 2013-08-22 | 2015-10-14 | 南京大学 | 日盲紫外dbr及其制备方法 |
| US11200997B2 (en) * | 2014-02-17 | 2021-12-14 | City Labs, Inc. | Semiconductor device with epitaxial liftoff layers for directly converting radioisotope emissions into electrical power |
| JP6723723B2 (ja) * | 2015-10-22 | 2020-07-15 | スタンレー電気株式会社 | 垂直共振器型発光素子及びその製造方法 |
| GB2549703B (en) * | 2016-04-19 | 2019-11-06 | Toshiba Kk | An optical device and method for its fabrication |
| DE102016110790B4 (de) * | 2016-06-13 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
| JP6846730B2 (ja) * | 2016-07-22 | 2021-03-24 | 学校法人 名城大学 | 半導体多層膜反射鏡及び垂直共振器型発光素子の製造方法 |
| DE102018002426A1 (de) | 2018-03-26 | 2019-09-26 | Azur Space Solar Power Gmbh | Stapelförmiges III-V-Halbleiterzeug und Herstellungsverfahren |
| DE102019106521A1 (de) * | 2019-03-14 | 2020-09-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Aufwachsstruktur für ein Strahlung emittierendes Halbleiterbauelement und Strahlung emittierendes Halbleiterbauelement |
| DE102021132164A1 (de) | 2021-12-07 | 2023-06-07 | Osram Opto Semiconductors Gmbh | Laserdiodenbauelement und verfahren zur herstellung zumindest eines laserdiodenbauelements |
| DE102022133588A1 (de) * | 2022-12-16 | 2024-06-27 | Ams-Osram International Gmbh | Laserbarrenchip und verfahren zum herstellen eines laserbarrenchips |
| KR102868728B1 (ko) * | 2022-12-27 | 2025-10-17 | (재)한국나노기술원 | 박막형 InGaAs 레이저 셀 제조 방법 및 박막형 InGaAs 레이저 셀 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4605942A (en) * | 1984-10-09 | 1986-08-12 | At&T Bell Laboratories | Multiple wavelength light emitting devices |
| FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
| DE19640594B4 (de) | 1996-10-01 | 2016-08-04 | Osram Gmbh | Bauelement |
| TW398084B (en) * | 1998-06-05 | 2000-07-11 | Hewlett Packard Co | Multilayered indium-containing nitride buffer layer for nitride epitaxy |
| US6320206B1 (en) * | 1999-02-05 | 2001-11-20 | Lumileds Lighting, U.S., Llc | Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks |
| US6280523B1 (en) | 1999-02-05 | 2001-08-28 | Lumileds Lighting, U.S., Llc | Thickness tailoring of wafer bonded AlxGayInzN structures by laser melting |
| US6133589A (en) | 1999-06-08 | 2000-10-17 | Lumileds Lighting, U.S., Llc | AlGaInN-based LED having thick epitaxial layer for improved light extraction |
| JP3866540B2 (ja) * | 2001-07-06 | 2007-01-10 | 株式会社東芝 | 窒化物半導体素子およびその製造方法 |
| DE10208171A1 (de) | 2002-02-26 | 2003-09-18 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit vertikaler Emissionsrichtung und Herstellungsverfahren dafür |
| US6835957B2 (en) | 2002-07-30 | 2004-12-28 | Lumileds Lighting U.S., Llc | III-nitride light emitting device with p-type active layer |
| TWI240969B (en) * | 2003-06-06 | 2005-10-01 | Sanken Electric Co Ltd | Nitride semiconductor device and method for manufacturing same |
| WO2005011007A1 (ja) | 2003-07-28 | 2005-02-03 | Toyoda Gosei Co., Ltd. | 発光ダイオード及びその製造方法 |
| JP4110222B2 (ja) | 2003-08-20 | 2008-07-02 | 住友電気工業株式会社 | 発光ダイオード |
| KR20060127845A (ko) | 2003-12-05 | 2006-12-13 | 파이오니아 가부시키가이샤 | 반도체 레이저 장치의 제조 방법 |
| AU2003296426A1 (en) * | 2003-12-09 | 2005-07-21 | The Regents Of The University Of California | Highly efficient gallium nitride based light emitting diodes via surface roughening |
| DE102004062290A1 (de) * | 2004-12-23 | 2006-07-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterchips |
| DE102005035722B9 (de) | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| DE102005052358A1 (de) * | 2005-09-01 | 2007-03-15 | Osram Opto Semiconductors Gmbh | Verfahren zum lateralen Zertrennen eines Halbleiterwafers und optoelektronisches Bauelement |
| JP2007080896A (ja) * | 2005-09-12 | 2007-03-29 | Sanyo Electric Co Ltd | 半導体素子 |
| DE102006023685A1 (de) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| KR100756841B1 (ko) * | 2006-03-13 | 2007-09-07 | 서울옵토디바이스주식회사 | AlxGa1-xN 버퍼층을 갖는 발광 다이오드 및 이의제조 방법 |
| DE102006061167A1 (de) * | 2006-04-25 | 2007-12-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
-
2008
- 2008-04-17 DE DE102008019268A patent/DE102008019268A1/de not_active Withdrawn
-
2009
- 2009-01-28 US US12/920,312 patent/US8711893B2/en active Active
- 2009-01-28 JP JP2010547942A patent/JP2011513954A/ja active Pending
- 2009-01-28 WO PCT/DE2009/000116 patent/WO2009106028A1/de not_active Ceased
- 2009-01-28 EP EP09715490.0A patent/EP2248235B1/de not_active Not-in-force
- 2009-02-09 TW TW098103997A patent/TWI426674B/zh not_active IP Right Cessation
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