JP2011511453A - 太陽電池及びその製造方法 - Google Patents
太陽電池及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 230000001681 protective effect Effects 0.000 claims abstract description 101
- 238000000034 method Methods 0.000 claims description 27
- 230000000903 blocking effect Effects 0.000 claims description 14
- 229910004205 SiNX Inorganic materials 0.000 claims description 12
- 229910020286 SiOxNy Inorganic materials 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 239000006117 anti-reflective coating Substances 0.000 claims description 3
- 210000004027 cell Anatomy 0.000 description 31
- 238000005530 etching Methods 0.000 description 17
- 239000012535 impurity Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 210000002381 plasma Anatomy 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- -1 PH 3 or POCl 3 Chemical compound 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
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Abstract
【解決手段】前記太陽電池は第1導電型を有する基板、前記基板に形成されていて、第1導電型と逆の第2導電型を有するエミッタ層、前記エミッタ層上に順次に形成されている第1 及び第2反射防止膜、前記エミッタ層に電気的に接続されている第1電極、前記基板の上に順次に位置し複数の露出部を有する第1ないし第3保護膜、そして前記複数の露出部を通じて露出された前記基板と電気的に接続されている第2電極を含む。
【選択図】図6
Description
しかし、これとは異なり、基板110は n型導電型であることができるし、シリコン以外の他の半導体物質からなることもできる。基板110がn型の導電型を有する場合、基板110はりん(P)、砒素(As)、アンチモン(Sb)などのように5価元素の不純物を含むことができる。
Claims (19)
- エミッタ層を備えた基板の一部分に選択的に形成され、前記基板の一部を露出した少なくとも一層の保護膜を形成する段階と、
前記エミッタ層と電気的に接続される第1電極を形成する段階と、
前記露出した前記基板の上に形成され、前記基板と電気的に接続される複数の第2電極を形成する段階、
を含む太陽電池の電極形成方法。 - 前記保護膜は光が入射されない前記基板の表面に形成される、請求項1に記載の太陽電池の電極形成方法。
- 前記保護膜形成段階は、
前記基板上に複数の開口部と複数の遮断部を備えたマスクを位置させる段階と、
前記開口部と向い合う前記基板の部分に膜を形成し、前記遮断部と向い合う前記基板の部分を露出した複数の露出部が形成し、前記複数の露出部を有する前記保護膜を形成する段階と、
を含み、
前記第2電極は前記複数の露出部を通じて前記基板と電気的に接続される、請求項1に記載の太陽電池の電極形成方法。 - 第1導電型の基板と、
前記基板上の、前記第1導電型と逆の第2導電型のエミッタ層と、
前記エミッタ層上に順次に形成されている第1及び第2反射防止膜と、
前記エミッタ層に電気的に接続されている第1電極と、
前記基板の上に順次に位置し複数の露出部を有する第1乃至第3保護膜であって、第1から第3の保護膜はそれぞれ複数の露出部を備えるものと、
前記複数の露出部を通じて露出される前記基板と電気的に接続されている複数の第2電極と、
を含む太陽電池。 - 前記第1反射防止膜はシリコン窒化膜(SiNx:H)からなり、前記第2反射防止膜はシリコン酸化窒化膜(SiOxNy)からなる、請求項4に記載の太陽電池。
- 前記第1反射防止膜の屈折率は、前記第2反射防止膜の屈折率より大きい、請求項4に記載の太陽電池。
- 前記第1反射防止膜は約2.2乃至約2.6の屈折率を有し、
前記第2反射防止膜は約1.3ないし約1.6の屈折率を有する、請求項6に記載の太陽電池。 - 前記第1保護膜はシリコン酸化膜(SiOx)からなり、前記第2保護膜はシリコン窒化膜(SiNx:H)からなり、前記第3保護膜はシリコン酸化窒化膜(SiOxNy)からなる、請求項4に記載の太陽電池。
- 前記第1保護膜が最大の屈折率を有し、前記第3保護膜が最小の屈折率を有している、請求項4に記載の太陽電池。
- 前記第1電極の厚さは前記第1及び第2反射防止膜の合計の厚さより厚い、請求項4に記載の太陽電池。
- 第1導電型の基板に前記第1導電型と逆の第2導電型のエミッタ層を形成する段階と、
複数のチャンバーに前記基板を順次に位置させ、前記エミッタ層上に反射防止膜を形成し、前記入射面と対向する前記基板の裏面に少なくとも一つの露出部を備えた保護膜を形成する段階と、
前記反射防止膜の上に第1ペーストを塗布して第1電極パターンを形成する段階と、
前記保護膜と前記露出部を通じて露出した前記基板の一部の上に第2ペーストを塗布して第2電極用導電層パターンを形成する段階と、
前記第1電極パターンと前記第2電極用導電層パターンを備えた前記基板を熱処理して、前記エミッタ層と電気的に接続される複数の第1電極を形成し、前記基板と電気的に接続される少なくとも一つの第2電極を備えた第2電極用導電層を形成する段階と、
を含む太陽電池の製造方法。 - 複数のチャンバーの個数は前記反射防止膜の層数と前記保護膜の層数の合わせた層数と等しく、前記複数のチャンバーのそれぞれに異なる原料ガスが注入される、請求項11に記載の太陽電池の製造方法。
- 前記反射防止膜は互いに異なる屈折率を有する第1反射防止膜と第2反射防止膜を備える、請求項12に記載の太陽電池の製造方法。
- 前記第1反射防止膜はSiNx:Hからなり、前記第2反射防止膜はSiOxNyからなる、請求項13に記載の太陽電池の製造方法。
- 前記保護膜は互いに異なる屈折率を有する第1保護膜、第2保護膜及び第3保護膜を備える、請求項12に記載の太陽電池の製造方法。
- 前記基板から一番近くに位置する第1保護膜が最大の屈折率を持ち、前記基板から一番遠い所に位置する第3保護膜が最小の屈折率を持つ、請求項15に記載の太陽電池の製造方法。
- 第1保護膜はSiOxからなり、第2保護膜はSiNx:からなり、第3保護膜はSiOxNyからなる、請求項15に記載の太陽電池の製造方法。
- 前記反射防止膜及び前記保護膜の形成段階は、複数のチャンバーのそれぞれで成膜の実施が独立的に行われる、請求項15に記載の太陽電池の製造方法。
- 前記反射防止膜及び保護膜形成段階は、少なくとも一つの開口部と少なくとも一つの遮断部を備えたマスクを前記基板の上に位置させる段階と、前記第1ないし第3保護膜を形成して、前記第1ないし第3保護膜を形成するために同一のマスクを用いて前記基板上で成膜を実施する段階とを備える、請求項18に記載の太陽電池の製造方法。
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KR1020080075780A KR100984701B1 (ko) | 2008-08-01 | 2008-08-01 | 태양 전지의 제조 방법 |
PCT/KR2009/004290 WO2010013972A2 (en) | 2008-08-01 | 2009-07-31 | Solar cell and method for manufacturing the same |
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US (2) | US20100024880A1 (ja) |
EP (1) | EP2212921A4 (ja) |
JP (1) | JP2011511453A (ja) |
KR (1) | KR100984701B1 (ja) |
CN (1) | CN101911313A (ja) |
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Cited By (3)
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---|---|---|---|---|
JP2013128095A (ja) * | 2011-12-16 | 2013-06-27 | Lg Electronics Inc | 太陽電池及びその製造方法 |
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CN109673170A (zh) * | 2016-07-28 | 2019-04-23 | 京瓷株式会社 | 太阳能电池元件及太阳能电池元件的制造方法 |
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Also Published As
Publication number | Publication date |
---|---|
CN101911313A (zh) | 2010-12-08 |
WO2010013972A3 (en) | 2010-06-03 |
WO2010013972A2 (en) | 2010-02-04 |
KR100984701B1 (ko) | 2010-10-01 |
US8759140B2 (en) | 2014-06-24 |
KR20100014006A (ko) | 2010-02-10 |
EP2212921A2 (en) | 2010-08-04 |
US20100024880A1 (en) | 2010-02-04 |
EP2212921A4 (en) | 2013-02-06 |
US20130122635A1 (en) | 2013-05-16 |
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