JP2011507719A - ゆがみデータからのフィードバックを用いたナノトポグラフィーの制御及び最適化 - Google Patents

ゆがみデータからのフィードバックを用いたナノトポグラフィーの制御及び最適化 Download PDF

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Publication number
JP2011507719A
JP2011507719A JP2010540928A JP2010540928A JP2011507719A JP 2011507719 A JP2011507719 A JP 2011507719A JP 2010540928 A JP2010540928 A JP 2010540928A JP 2010540928 A JP2010540928 A JP 2010540928A JP 2011507719 A JP2011507719 A JP 2011507719A
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JP
Japan
Prior art keywords
wafer
nanotopography
ground
double side
grinding
Prior art date
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Pending
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JP2010540928A
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English (en)
Japanese (ja)
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JP2011507719A5 (enExample
Inventor
スメート・エス・バガバト
ロナルド・アール・バンダム
朋美 小村
智彦 金子
沢登 風間
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SunEdison Inc
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MEMC Electronic Materials Inc
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Publication date
Application filed by MEMC Electronic Materials Inc filed Critical MEMC Electronic Materials Inc
Publication of JP2011507719A publication Critical patent/JP2011507719A/ja
Publication of JP2011507719A5 publication Critical patent/JP2011507719A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2010540928A 2007-12-31 2008-12-29 ゆがみデータからのフィードバックを用いたナノトポグラフィーの制御及び最適化 Pending JP2011507719A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/967,743 US7930058B2 (en) 2006-01-30 2007-12-31 Nanotopography control and optimization using feedback from warp data
PCT/US2008/088452 WO2009088832A1 (en) 2007-12-31 2008-12-29 Nanotopography control and optimization using feedback from warp data

Publications (2)

Publication Number Publication Date
JP2011507719A true JP2011507719A (ja) 2011-03-10
JP2011507719A5 JP2011507719A5 (enExample) 2011-05-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010540928A Pending JP2011507719A (ja) 2007-12-31 2008-12-29 ゆがみデータからのフィードバックを用いたナノトポグラフィーの制御及び最適化

Country Status (7)

Country Link
US (2) US7930058B2 (enExample)
EP (1) EP2225070B1 (enExample)
JP (1) JP2011507719A (enExample)
KR (1) KR20100110803A (enExample)
CN (1) CN101909817A (enExample)
TW (1) TWI446992B (enExample)
WO (1) WO2009088832A1 (enExample)

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JP2016505214A (ja) * 2012-12-28 2016-02-18 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ エピタキシャル後反りの予測および制御方法
JP2019067952A (ja) * 2017-10-02 2019-04-25 株式会社Sumco 半導体ウェーハの評価方法および該方法を用いた半導体ウェーハの製造方法
JP2023513276A (ja) * 2020-02-10 2023-03-30 グローバルウェーハズ カンパニー リミテッド 強化されたウエハ製造のためのシステムおよび方法

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US8815110B2 (en) * 2009-09-16 2014-08-26 Cabot Microelectronics Corporation Composition and method for polishing bulk silicon
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US8697576B2 (en) * 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
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JP5862492B2 (ja) * 2012-07-09 2016-02-16 信越半導体株式会社 半導体ウェーハの評価方法及び製造方法
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US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
CN104108062B (zh) * 2014-06-17 2017-06-06 北京石晶光电科技股份有限公司济源分公司 一种超薄晶片纳米级抛光方法
JP6447472B2 (ja) * 2015-11-26 2019-01-09 株式会社Sumco ウェーハ研磨方法
TWI779986B (zh) * 2016-11-30 2022-10-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP6436255B1 (ja) * 2018-02-27 2018-12-12 株式会社Sumco シリコンウェーハの反り量の予測方法およびシリコンウェーハの製造方法
CN108493116A (zh) * 2018-03-13 2018-09-04 英特尔产品（成都）有限公司 置球模块的制造方法及该方法制造的置球模块
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CN110193776B (zh) * 2019-06-11 2020-07-03 英特尔半导体(大连)有限公司 晶圆抛光的抛光压力控制方法、装置和设备
TWI763112B (zh) * 2020-04-22 2022-05-01 財團法人工業技術研究院 研磨拋光模擬方法、系統及研磨拋光製程轉移方法
US12174596B2 (en) * 2020-04-22 2024-12-24 Industrial Technology Research Institute Grinding and polishing simulation method and system and grinding and polishing process transferring method
CN112071765B (zh) * 2020-08-18 2024-07-30 中环领先(徐州)半导体材料有限公司 确定晶圆加工参数的方法和晶圆的加工方法
CN112259442B (zh) * 2020-09-11 2024-05-24 中环领先(徐州)半导体材料有限公司 晶圆双面减薄的方法和装置、存储介质
US12386340B2 (en) 2022-02-25 2025-08-12 Globalwafers Co., Ltd. Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
CN115194639B (zh) * 2022-06-30 2023-12-29 江西兆驰半导体有限公司 一种蓝宝石衬底片切割后的分类加工方法及外延片
CN116175397A (zh) * 2022-12-13 2023-05-30 西安奕斯伟材料科技有限公司 一种用于研磨硅片的设备和方法

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
KR20150084764A (ko) * 2012-11-13 2015-07-22 신에쯔 한도타이 가부시키가이샤 양면 연마 방법
KR102004701B1 (ko) * 2012-11-13 2019-07-29 신에쯔 한도타이 가부시키가이샤 양면 연마 방법
JP2016505214A (ja) * 2012-12-28 2016-02-18 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ エピタキシャル後反りの予測および制御方法
JP2019067952A (ja) * 2017-10-02 2019-04-25 株式会社Sumco 半導体ウェーハの評価方法および該方法を用いた半導体ウェーハの製造方法
JP2023513276A (ja) * 2020-02-10 2023-03-30 グローバルウェーハズ カンパニー リミテッド 強化されたウエハ製造のためのシステムおよび方法
JP7661348B2 (ja) 2020-02-10 2025-04-14 グローバルウェーハズ カンパニー リミテッド 強化されたウエハ製造のためのシステムおよび方法

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Publication number Publication date
US20080166948A1 (en) 2008-07-10
US7930058B2 (en) 2011-04-19
TW200946284A (en) 2009-11-16
EP2225070B1 (en) 2014-02-12
EP2225070A1 (en) 2010-09-08
TWI446992B (zh) 2014-08-01
KR20100110803A (ko) 2010-10-13
CN101909817A (zh) 2010-12-08
US20110045740A1 (en) 2011-02-24
US8145342B2 (en) 2012-03-27
WO2009088832A1 (en) 2009-07-16

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