TWI446992B - 利用由彎曲資料的反饋之奈米形貌控制及最佳化 - Google Patents

利用由彎曲資料的反饋之奈米形貌控制及最佳化 Download PDF

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Publication number
TWI446992B
TWI446992B TW097151687A TW97151687A TWI446992B TW I446992 B TWI446992 B TW I446992B TW 097151687 A TW097151687 A TW 097151687A TW 97151687 A TW97151687 A TW 97151687A TW I446992 B TWI446992 B TW I446992B
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TW
Taiwan
Prior art keywords
wafer
grinding
nanotopography
double
processor
Prior art date
Application number
TW097151687A
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English (en)
Chinese (zh)
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TW200946284A (en
Inventor
Sumeet S Bhagavat
Roland R Vandamme
Tomomi Komura
Tomohiko Kaneko
Takuto Kazama
Original Assignee
Memc Electronic Materials
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Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of TW200946284A publication Critical patent/TW200946284A/zh
Application granted granted Critical
Publication of TWI446992B publication Critical patent/TWI446992B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW097151687A 2007-12-31 2008-12-31 利用由彎曲資料的反饋之奈米形貌控制及最佳化 TWI446992B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/967,743 US7930058B2 (en) 2006-01-30 2007-12-31 Nanotopography control and optimization using feedback from warp data

Publications (2)

Publication Number Publication Date
TW200946284A TW200946284A (en) 2009-11-16
TWI446992B true TWI446992B (zh) 2014-08-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW097151687A TWI446992B (zh) 2007-12-31 2008-12-31 利用由彎曲資料的反饋之奈米形貌控制及最佳化

Country Status (7)

Country Link
US (2) US7930058B2 (enExample)
EP (1) EP2225070B1 (enExample)
JP (1) JP2011507719A (enExample)
KR (1) KR20100110803A (enExample)
CN (1) CN101909817A (enExample)
TW (1) TWI446992B (enExample)
WO (1) WO2009088832A1 (enExample)

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JP6447472B2 (ja) * 2015-11-26 2019-01-09 株式会社Sumco ウェーハ研磨方法
TWI779986B (zh) * 2016-11-30 2022-10-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP6443520B1 (ja) * 2017-10-02 2018-12-26 株式会社Sumco 半導体ウェーハの評価方法および該方法を用いた半導体ウェーハの製造方法
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CN110193776B (zh) * 2019-06-11 2020-07-03 英特尔半导体(大连)有限公司 晶圆抛光的抛光压力控制方法、装置和设备
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TWI763112B (zh) * 2020-04-22 2022-05-01 財團法人工業技術研究院 研磨拋光模擬方法、系統及研磨拋光製程轉移方法
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CN112071765B (zh) * 2020-08-18 2024-07-30 中环领先(徐州)半导体材料有限公司 确定晶圆加工参数的方法和晶圆的加工方法
CN112259442B (zh) * 2020-09-11 2024-05-24 中环领先(徐州)半导体材料有限公司 晶圆双面减薄的方法和装置、存储介质
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Also Published As

Publication number Publication date
US20080166948A1 (en) 2008-07-10
US7930058B2 (en) 2011-04-19
TW200946284A (en) 2009-11-16
JP2011507719A (ja) 2011-03-10
EP2225070B1 (en) 2014-02-12
EP2225070A1 (en) 2010-09-08
KR20100110803A (ko) 2010-10-13
CN101909817A (zh) 2010-12-08
US20110045740A1 (en) 2011-02-24
US8145342B2 (en) 2012-03-27
WO2009088832A1 (en) 2009-07-16

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