JP2011505073A - オプトエレクトロニクス半導体ボディおよびオプトエレクトロニクス半導体ボディの製造方法 - Google Patents

オプトエレクトロニクス半導体ボディおよびオプトエレクトロニクス半導体ボディの製造方法 Download PDF

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Publication number
JP2011505073A
JP2011505073A JP2010535212A JP2010535212A JP2011505073A JP 2011505073 A JP2011505073 A JP 2011505073A JP 2010535212 A JP2010535212 A JP 2010535212A JP 2010535212 A JP2010535212 A JP 2010535212A JP 2011505073 A JP2011505073 A JP 2011505073A
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JP
Japan
Prior art keywords
semiconductor body
layer
recess
buffer layer
optoelectronic semiconductor
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JP2010535212A
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English (en)
Japanese (ja)
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JP2011505073A5 (OSRAM
Inventor
ギド ヴァイス
ベルトホールド ハーン
ウルリヒ ゼンダー
アンドレアス ヴァイマル
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2011505073A publication Critical patent/JP2011505073A/ja
Publication of JP2011505073A5 publication Critical patent/JP2011505073A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP2010535212A 2007-11-30 2008-11-26 オプトエレクトロニクス半導体ボディおよびオプトエレクトロニクス半導体ボディの製造方法 Pending JP2011505073A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007057756.9A DE102007057756B4 (de) 2007-11-30 2007-11-30 Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers
PCT/DE2008/001957 WO2009068006A2 (de) 2007-11-30 2008-11-26 Optoelektronischer halbleiterkörper und verfahren zur herstellung eines optoelektronischen halbleiterkörpers

Publications (2)

Publication Number Publication Date
JP2011505073A true JP2011505073A (ja) 2011-02-17
JP2011505073A5 JP2011505073A5 (OSRAM) 2012-01-05

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JP2010535212A Pending JP2011505073A (ja) 2007-11-30 2008-11-26 オプトエレクトロニクス半導体ボディおよびオプトエレクトロニクス半導体ボディの製造方法

Country Status (7)

Country Link
US (1) US20110204322A1 (OSRAM)
JP (1) JP2011505073A (OSRAM)
KR (1) KR20100097188A (OSRAM)
CN (1) CN101878546B (OSRAM)
DE (1) DE102007057756B4 (OSRAM)
TW (1) TWI474501B (OSRAM)
WO (1) WO2009068006A2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016036037A (ja) * 2011-09-29 2016-03-17 マヌティウス アイピー インコーポレーテッド 発光素子

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Publication number Priority date Publication date Assignee Title
JP5052636B2 (ja) 2010-03-11 2012-10-17 株式会社東芝 半導体発光素子
KR101646664B1 (ko) * 2010-05-18 2016-08-08 엘지이노텍 주식회사 발광 소자, 발광 소자의 제조방법 및 발광 소자 패키지
DE102010032497A1 (de) 2010-07-28 2012-02-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips
CN102694096A (zh) * 2011-03-21 2012-09-26 华新丽华股份有限公司 发光二极管及其制造方法
DE102018111324A1 (de) * 2018-05-11 2019-11-14 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102020126442A1 (de) * 2020-10-08 2022-04-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische vorrichtung mit einer kontaktschicht und einer darüber angeordneten aufrauschicht sowie herstellungsverfahren

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JP2007067454A (ja) * 1997-01-09 2007-03-15 Nichia Chem Ind Ltd 窒化物半導体素子
JP2004343139A (ja) * 2001-11-19 2004-12-02 Sanyo Electric Co Ltd 化合物半導体発光素子
JP2003174193A (ja) * 2001-12-04 2003-06-20 Sharp Corp 窒化物系化合物半導体発光素子およびその製造方法
JP2007116192A (ja) * 2002-03-26 2007-05-10 Sanyo Electric Co Ltd 窒化物系半導体装置
JP2005072585A (ja) * 2003-08-20 2005-03-17 Shogen Koden Kofun Yugenkoshi 窒化物系高効率発光素子
JP2005085932A (ja) * 2003-09-08 2005-03-31 Toyoda Gosei Co Ltd 発光ダイオード及びその製造方法
JP2005150675A (ja) * 2003-11-18 2005-06-09 Itswell Co Ltd 半導体発光ダイオードとその製造方法
JP2005197573A (ja) * 2004-01-09 2005-07-21 Sharp Corp Ｉｉｉ族窒化物半導体発光素子
JP2005259832A (ja) * 2004-03-10 2005-09-22 Sanyo Electric Co Ltd 窒化物系半導体発光素子
JP2006066903A (ja) * 2004-07-29 2006-03-09 Showa Denko Kk 半導体発光素子用正極
JP2006135311A (ja) * 2004-10-08 2006-05-25 Mitsubishi Cable Ind Ltd 窒化物半導体を用いた発光ダイオード
WO2006109760A1 (ja) * 2005-04-08 2006-10-19 Mitsubishi Cable Industries, Ltd. 半導体素子およびその製造方法
JP2006351596A (ja) * 2005-06-13 2006-12-28 Sumitomo Electric Ind Ltd 発光装置
JP2007096090A (ja) * 2005-09-29 2007-04-12 Sanyo Electric Co Ltd 半導体発光素子及び半導体発光素子の製造方法
JP2007150259A (ja) * 2005-11-02 2007-06-14 Sharp Corp 窒化物半導体発光素子およびその製造方法
JP2007150076A (ja) * 2005-11-29 2007-06-14 Rohm Co Ltd 窒化物半導体発光素子
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016036037A (ja) * 2011-09-29 2016-03-17 マヌティウス アイピー インコーポレーテッド 発光素子

Also Published As

Publication number Publication date
TW200933936A (en) 2009-08-01
KR20100097188A (ko) 2010-09-02
CN101878546A (zh) 2010-11-03
TWI474501B (zh) 2015-02-21
DE102007057756A1 (de) 2009-06-04
WO2009068006A2 (de) 2009-06-04
DE102007057756B4 (de) 2022-03-10
CN101878546B (zh) 2012-05-23
WO2009068006A3 (de) 2009-09-11
US20110204322A1 (en) 2011-08-25

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