JP2011190260A5 - - Google Patents

Download PDF

Info

Publication number
JP2011190260A5
JP2011190260A5 JP2011055905A JP2011055905A JP2011190260A5 JP 2011190260 A5 JP2011190260 A5 JP 2011190260A5 JP 2011055905 A JP2011055905 A JP 2011055905A JP 2011055905 A JP2011055905 A JP 2011055905A JP 2011190260 A5 JP2011190260 A5 JP 2011190260A5
Authority
JP
Japan
Prior art keywords
ester
acid
mercapto
sodium
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011055905A
Other languages
English (en)
Japanese (ja)
Other versions
JP6054594B2 (ja
JP2011190260A (ja
Filing date
Publication date
Priority claimed from US12/661,301 external-priority patent/US20110220512A1/en
Application filed filed Critical
Publication of JP2011190260A publication Critical patent/JP2011190260A/ja
Publication of JP2011190260A5 publication Critical patent/JP2011190260A5/ja
Application granted granted Critical
Publication of JP6054594B2 publication Critical patent/JP6054594B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011055905A 2010-03-15 2011-03-14 めっき浴および方法 Active JP6054594B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/661301 2010-03-15
US12/661,301 US20110220512A1 (en) 2010-03-15 2010-03-15 Plating bath and method

Publications (3)

Publication Number Publication Date
JP2011190260A JP2011190260A (ja) 2011-09-29
JP2011190260A5 true JP2011190260A5 (OSRAM) 2016-04-14
JP6054594B2 JP6054594B2 (ja) 2016-12-27

Family

ID=43984124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011055905A Active JP6054594B2 (ja) 2010-03-15 2011-03-14 めっき浴および方法

Country Status (6)

Country Link
US (2) US20110220512A1 (OSRAM)
EP (1) EP2366692B1 (OSRAM)
JP (1) JP6054594B2 (OSRAM)
KR (1) KR101739410B1 (OSRAM)
CN (2) CN102250319A (OSRAM)
TW (1) TWI428326B (OSRAM)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8454815B2 (en) 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method
IN2015DN00149A (OSRAM) * 2012-07-09 2015-06-12 Shikoku Chem
KR20140092626A (ko) 2013-01-16 2014-07-24 삼성전자주식회사 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법
US20140238868A1 (en) 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
US20140262801A1 (en) * 2013-03-14 2014-09-18 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US9598787B2 (en) * 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US9403762B2 (en) * 2013-11-21 2016-08-02 Rohm And Haas Electronic Materials Llc Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
US9273407B2 (en) 2014-03-17 2016-03-01 Hong Kong Applied Science and Technology Research Institute Company Limited Additive for electrodeposition
CN104005061B (zh) * 2014-06-05 2016-05-18 中节能太阳能科技有限公司 一种用于太阳能电池前电极电镀铜的负整平剂
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
CN105002527B (zh) * 2015-07-31 2017-06-16 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
EP3135709B1 (en) * 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10512174B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
CN109952390A (zh) * 2016-09-22 2019-06-28 麦克德米德乐思公司 在微电子件中的铜的电沉积
US10718059B2 (en) 2017-07-10 2020-07-21 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with cationic polymers and methods of electroplating nickel
CN107236976B (zh) * 2017-07-25 2018-11-16 上海新阳半导体材料股份有限公司 整平剂、含其的金属电镀组合物及制备方法、应用
CN107217283B (zh) * 2017-07-25 2018-11-16 上海新阳半导体材料股份有限公司 整平剂、含其的金属电镀组合物、制备方法及应用
CN111892706A (zh) * 2020-07-23 2020-11-06 中国科学院大学温州研究院(温州生物材料与工程研究所) 一种peg偶联杂环化合物及其在酸性光亮镀铜中的应用
JPWO2022172823A1 (OSRAM) 2021-02-15 2022-08-18
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
KR102339867B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
CN115894908B (zh) * 2021-09-30 2025-06-06 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
CN114381769B (zh) * 2021-12-24 2023-06-09 广州市慧科高新材料科技有限公司 一种超速填孔镀铜整平剂的合成方法以及应用
US20230279577A1 (en) 2022-03-04 2023-09-07 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (OSRAM) * 1968-03-04 1969-05-09
DE2007968A1 (de) * 1970-01-16 1971-07-22 R.T. Vanderbilt Company, Inc., New York, N.Y. (V.St.A.) Propy lenoxid-Imidazol-Reaktionsprodukte, Verfahren zu ihrer Herstellung und ihre Verwendung als Hartungsmittel fur Epoxidharze
US3954575A (en) * 1972-11-10 1976-05-04 Dipsol Chemicals Co., Ltd. Zinc electroplating
US3843667A (en) * 1973-09-12 1974-10-22 M Cupery N-imidazole compounds and their complex metal derivatives
DE2525264C2 (de) * 1975-06-04 1984-02-16 Schering AG, 1000 Berlin und 4709 Bergkamen Alkalisches cyanidfreies Zinkbad und Verfahren zur galvanischen Abscheidung von Zinküberzügen unter Verwendung dieses Bades
DE2725930C2 (de) * 1976-06-12 1986-06-12 Mitsubishi Petrochemical Co., Ltd., Tokio/Tokyo Verfahren zur Herstellung eines Anionenaustauscherharzes und Verwendung derselben zur Herstellung einer Anionenaustauschermembran
JPS607652B2 (ja) * 1976-06-12 1985-02-26 三菱油化株式会社 陰イオン交換体の製造法
US4169772A (en) * 1978-11-06 1979-10-02 R. O. Hull & Company, Inc. Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits
CA1151182A (en) * 1979-08-10 1983-08-02 Marvin L. Kaufman Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them
US4397717A (en) * 1981-02-10 1983-08-09 Elektro-Brite Gmbh & Co. Kg. Alkaline zinc electroplating bath with or without cyanide content
JPS604524A (ja) * 1983-06-22 1985-01-11 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
JPS59138228A (ja) * 1983-01-27 1984-08-08 Mitsubishi Petrochem Co Ltd 新規な高分子四級塩
EP0145654B2 (de) * 1983-11-09 1992-05-13 Ciba-Geigy Ag Verfahren zum Innenauskleiden von Rohren oder Rohrteilstücken
US4536261A (en) * 1984-08-07 1985-08-20 Francine Popescu Alkaline bath for the electrodeposition of bright zinc
JPS61286369A (ja) * 1985-06-11 1986-12-16 Shikoku Chem Corp ２―フェニル―４，５―ジベンジルイミダゾール及び該化合物の合成方法
US4730022A (en) * 1987-03-06 1988-03-08 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths
US4792383A (en) * 1987-10-27 1988-12-20 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths and processes
JPH01219188A (ja) * 1988-02-26 1989-09-01 Okuno Seiyaku Kogyo Kk 亜鉛−ニッケル合金めっき浴
DE4010548A1 (de) * 1990-04-02 1991-10-10 Schering Ag Imidazolylderivate, ihre verwendung als haertungsmittel in epoxidharzzusammensetzungen, sie enthaltende haertbare epoxidharzzusammensetzungen und epoxidharzformkoerper
JPH03277631A (ja) * 1990-08-31 1991-12-09 Mitsubishi Petrochem Co Ltd 新規な高分子四級塩の製造方法
SU1743158A1 (ru) * 1990-09-04 1998-02-20 Институт физико-органической химии и углехимии АН УССР 1-глицидилимидазолы в качестве соотвердителей эпоксидных смол
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
JPH1030015A (ja) * 1996-07-15 1998-02-03 Kansai Paint Co Ltd エポキシ樹脂用硬化触媒及びそれを用いてなる熱硬化性塗料組成物
ES2154013T3 (es) * 1997-10-02 2001-03-16 Hexcel Corp Agentes de curado para resinas epoxidicas.
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6515237B2 (en) * 2000-11-24 2003-02-04 Hitachi Chemical Company, Ltd. Through-hole wiring board
JP4392168B2 (ja) * 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
TW200401848A (en) * 2002-06-03 2004-02-01 Shipley Co Llc Leveler compounds
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
JP4183999B2 (ja) * 2002-07-29 2008-11-19 日鉱金属株式会社 イミダゾールアルコールを有効成分とする表面処理剤
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
KR100804293B1 (ko) * 2004-03-31 2008-02-18 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지용 경화제 및 에폭시 수지 조성물
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1741804B1 (en) * 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
CN1931889A (zh) * 2006-09-27 2007-03-21 蓝星化工新材料股份有限公司无锡树脂厂 固态咪唑固化剂的改性方法及该方法得到的固化剂
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
WO2008087985A1 (ja) 2007-01-18 2008-07-24 Nippon Chemical Industrial Co., Ltd. 改質ペロブスカイト型複合酸化物、その製造方法及び複合誘電体材料
JP2009034846A (ja) 2007-07-31 2009-02-19 Chisso Corp 転写フィルム
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Similar Documents

Publication Publication Date Title
JP2011190260A5 (OSRAM)
JP2011207878A5 (OSRAM)
JP2011213717A5 (OSRAM)
JP2018009012A5 (OSRAM)
JP2015179672A5 (OSRAM)
JP2013539448A5 (OSRAM)
MX2009009492A (es) Compuestos organicos biciclicos adecuados para el tratamiento de condiciones inflamatorias o alergicas.
JP2018506543A5 (OSRAM)
JP2012111953A5 (OSRAM)
EA201101089A1 (ru) Производные оксадиазола в качестве агонистов рецептора s1p1
AR065876A1 (es) Compuestos activos para 11 beta -hsd1
JP2012522729A5 (OSRAM)
WO2009057515A1 (ja) スルホン酸フェニル化合物、それを用いた非水電解液及びリチウム電池
MA32246B1 (fr) Dérivés polysubstitues de 2-aryl-6-phenyl-imidazo[1,2- a]pyridines, leur préparation et leur application en thérapeutique
JP2016520672A5 (OSRAM)
JP2012121883A5 (ja) オキサジアゾール誘導体
JP2015063518A5 (ja) 有機化合物
PE20142282A1 (es) Nuevos derivados de aril-quinolina
JP2013060411A5 (ja) カルバゾール化合物
WO2011136594A3 (ko) 구리와 티타늄을 포함하는 금속막용 식각액 조성물
JP2013534909A5 (OSRAM)
CY1113148T1 (el) Χρηση υποκατεστημενων παραγωγων πυρανονικου οξεος για τη θεραπευτικη αντιμετωπιση του μεταβολικου συνδρομου
EA201071012A1 (ru) Производные азетидинов, способ их получения и применение их в терапии
JP2012254971A5 (ja) カルバゾール化合物
AR086451A1 (es) Derivados de 2-amino-3-(imidazol-2-il)piridin-4-ona, preparacion de los mismos y una composicion farmaceutica en base al compuesto