JP2011179015A - 金属板と圧電体との接着構造 - Google Patents
金属板と圧電体との接着構造 Download PDFInfo
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- JP2011179015A JP2011179015A JP2011129234A JP2011129234A JP2011179015A JP 2011179015 A JP2011179015 A JP 2011179015A JP 2011129234 A JP2011129234 A JP 2011129234A JP 2011129234 A JP2011129234 A JP 2011129234A JP 2011179015 A JP2011179015 A JP 2011179015A
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- 239000002184 metal Substances 0.000 title claims abstract description 59
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- 230000001070 adhesive effect Effects 0.000 claims abstract description 70
- 239000002245 particle Substances 0.000 claims abstract description 39
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229910052799 carbon Inorganic materials 0.000 description 10
- 239000011164 primary particle Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
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- 239000000446 fuel Substances 0.000 description 1
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- 230000009974 thixotropic effect Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0032—Processes of manufacture formation of the dielectric layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
【解決手段】金属板1と圧電体2の電極3とを導電性接着剤10で電気的導通性をもって接着した接着構造において、導電性接着剤10は平均粒径がナノレベルのカーボンブラック粒子12aを含み、そのカーボンブラック粒子を平均粒径1μm〜50μmの凝集体12としたものであり、カーボンブラック凝集体12は金属板1及び電極3の表面の凹凸に倣うように変形して挟み込まれている。カーボンブラック凝集体12は、金属板1と電極3の間で島状に複数箇所存在している。
【選択図】 図3
Description
(a)カーボンブラック凝集体が柔軟に変形するため、接着剤の厚み増加への影響が少ない。
(b)加圧接着時にカーボンブラック凝集体が柔軟に変形するため、圧電体へのダメージが少ない。
(c)カーボンブラックが凝集体(塊状)で存在するため、カーボンブラック同士の接触確率が飛躍的に向上し、同量のカーボンブラックが非凝集(一次粒子)の状態で存在する場合に比べて、高い導電効果(異方導電性)を得ることができる。
(d)接着状態において導電性接着剤が異方導電性を有するので、圧電体の周囲に形成されたフィレットの一部が表面側の電極まで回りこんでも、短絡を防止することができる。
(e)湿中試験での接着剤膨潤に対して、カーボンブラック凝集体の柔軟な変形によって対応できるので、導通信頼性が向上する。
(f)カーボンブラックの一次粒子が樹脂中へ分散している状態と比較して、樹脂流動性が高く、大幅に粘度・チクソ性への影響を抑えることができる。
2 圧電体
3,4 電極
10 導電性接着剤
11 無溶剤系樹脂
12 カーボンブラック凝集体
12a カーボンブラック粒子
Claims (1)
- 金属板と、前記金属板と対向する面に電極を有する圧電体と、導電補助剤としてカーボンブラックを含み、前記金属板と圧電体の電極とを電気的導通性をもって接着した導電性接着剤と、を有する接着構造において、
前記カーボンブラックは、平均粒径がナノレベルのカーボンブラック粒子を平均粒径が1μm〜50μmのカーボンブラック凝集体としたものであり、
前記カーボンブラック凝集体は前記金属板及び前記電極の表面の凹凸に倣うように変形して挟み込まれており、かつ前記金属板と前記電極の間で島状に複数箇所存在していることを特徴とする接着構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011129234A JP5333523B2 (ja) | 2009-07-17 | 2011-06-09 | 金属板と圧電体との接着構造 |
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JP2009168633 | 2009-07-17 | ||
JP2009168633 | 2009-07-17 | ||
JP2011129234A JP5333523B2 (ja) | 2009-07-17 | 2011-06-09 | 金属板と圧電体との接着構造 |
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JP2011514572A Division JP4771028B2 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
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JP2011179015A true JP2011179015A (ja) | 2011-09-15 |
JP5333523B2 JP5333523B2 (ja) | 2013-11-06 |
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JP2011514572A Active JP4771028B2 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
JP2011129234A Active JP5333523B2 (ja) | 2009-07-17 | 2011-06-09 | 金属板と圧電体との接着構造 |
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JP2011514572A Active JP4771028B2 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
Country Status (4)
Country | Link |
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US (2) | US8492959B2 (ja) |
JP (2) | JP4771028B2 (ja) |
CN (1) | CN102473837B (ja) |
WO (1) | WO2011007646A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011007646A1 (ja) * | 2009-07-17 | 2011-01-20 | 株式会社村田製作所 | 金属板と圧電体との接着構造及び接着方法 |
JP5900155B2 (ja) * | 2011-09-06 | 2016-04-06 | 株式会社村田製作所 | 流体制御装置 |
DE102013211596A1 (de) * | 2013-06-20 | 2014-12-24 | Robert Bosch Gmbh | Verfahren zum elektrischen Kontaktieren einer Piezokeramik |
EP3078703B1 (en) * | 2013-12-02 | 2020-02-12 | Dexerials Corporation | Polymer element, electronic device, camera module, and imaging device |
CN104050892A (zh) * | 2014-06-26 | 2014-09-17 | 上海和辉光电有限公司 | Oled显示模组的制备方法以及用于该方法的复合材料 |
JP6387289B2 (ja) * | 2014-09-29 | 2018-09-05 | 新科實業有限公司SAE Magnetics(H.K.)Ltd. | 薄膜圧電体素子およびその製造方法並びにそれを有するヘッドジンバルアセンブリ、ハードディスク装置、インクジェットヘッド、可変焦点レンズおよびセンサ |
US10522383B2 (en) | 2015-03-25 | 2019-12-31 | International Business Machines Corporation | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
DE102015016702A1 (de) * | 2015-12-22 | 2017-06-22 | Man Truck & Bus Ag | Partikelteilchen aufweisendes Klebemittel zur Verbindung zweier Fahrzeugteile |
WO2018070221A1 (ja) * | 2016-10-11 | 2018-04-19 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
JP7000036B2 (ja) * | 2017-04-28 | 2022-01-19 | キヤノン株式会社 | 振動子、振動子の製造方法、および電子機器 |
WO2019130862A1 (ja) * | 2017-12-27 | 2019-07-04 | パナソニックIpマネジメント株式会社 | 発電装置 |
CN214748552U (zh) * | 2018-06-20 | 2021-11-16 | 株式会社村田制作所 | 按压传感器和按压检测装置 |
JP6831435B2 (ja) * | 2019-10-25 | 2021-02-17 | 日本特殊陶業株式会社 | 複合部材 |
WO2023105565A1 (ja) * | 2021-12-06 | 2023-06-15 | 日本電信電話株式会社 | マイクロダイアフラムポンプ |
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JP2007329431A (ja) * | 2006-06-09 | 2007-12-20 | Citizen Electronics Co Ltd | 圧電型エキサイタ |
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WO2011007646A1 (ja) * | 2009-07-17 | 2011-01-20 | 株式会社村田製作所 | 金属板と圧電体との接着構造及び接着方法 |
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2010
- 2010-06-22 WO PCT/JP2010/060516 patent/WO2011007646A1/ja active Application Filing
- 2010-06-22 CN CN2010800290080A patent/CN102473837B/zh active Active
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2011
- 2011-06-09 JP JP2011129234A patent/JP5333523B2/ja active Active
- 2011-12-27 US US13/337,331 patent/US8492959B2/en active Active
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002033022A (ja) * | 2000-07-13 | 2002-01-31 | Mitsui Takeda Chemicals Inc | 導電性多層構造樹脂粒子およびそれを用いた異方導電性接着剤 |
JP2007329431A (ja) * | 2006-06-09 | 2007-12-20 | Citizen Electronics Co Ltd | 圧電型エキサイタ |
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Publication number | Publication date |
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CN102473837B (zh) | 2013-12-25 |
US20130276977A1 (en) | 2013-10-24 |
JP4771028B2 (ja) | 2011-09-14 |
US9276194B2 (en) | 2016-03-01 |
JPWO2011007646A1 (ja) | 2012-12-27 |
US20120091863A1 (en) | 2012-04-19 |
WO2011007646A1 (ja) | 2011-01-20 |
CN102473837A (zh) | 2012-05-23 |
JP5333523B2 (ja) | 2013-11-06 |
US8492959B2 (en) | 2013-07-23 |
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