JP4771028B2 - 金属板と圧電体との接着構造及び接着方法 - Google Patents
金属板と圧電体との接着構造及び接着方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 96
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- 241000872198 Serjania polyphylla Species 0.000 abstract 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0032—Processes of manufacture formation of the dielectric layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
(a)カーボンブラック凝集体が柔軟に変形するため、接着剤の厚み増加への影響が少ない。
(b)加圧接着時にカーボンブラック凝集体が柔軟に変形するため、圧電体へのダメージが少ない。
(c)カーボンブラックが凝集体(塊状)で存在するため、カーボンブラック同士の接触確率が飛躍的に向上し、同量のカーボンブラックが非凝集(一次粒子)の状態で存在する場合に比べて、高い導電効果(異方導電性)を得ることができる。
(d)接着状態において導電性接着剤が異方導電性を有するので、圧電体の周囲に形成されたフィレットの一部が表面側の電極まで回りこんでも、短絡を防止することができる。
(e)湿中試験での接着剤膨潤に対して、カーボンブラック凝集体の柔軟な変形によって対応できるので、導通信頼性が向上する。
(f)カーボンブラックの一次粒子が樹脂中へ分散している状態と比較して、樹脂流動性が高く、大幅に粘度・チクソ性への影響を抑えることができる。
2 圧電体
3,4 電極
10 導電性接着剤
11 無溶剤系樹脂
12 凝集体
12a カーボンブラック
Claims (6)
- 金属板と、前記金属板と対向する面に電極を有する圧電体と、導電補助剤としてカーボンブラックを含み、前記金属板と圧電体の電極とを電気的導通性をもって接着した導電性接着剤と、を有する接着構造において、
硬化前の前記導電性接着剤は、平均粒径がナノレベルのカーボンブラックを含み、かつ当該カーボンブラックが平均粒径1μm〜50μmの凝集体となるように、無溶剤系又は溶剤系樹脂中に含有されたペースト状であり、
前記金属板と圧電体の電極との間に前記ペースト状の導電性接着剤を塗布し、前記金属板と圧電体とを加熱・加圧することにより、前記カーボンブラックの凝集体を変形させた状態で前記導電性接着剤を硬化させてなることを特徴とする接着構造。 - 前記金属板と圧電体の電極との間の距離が、前記凝集体の平均粒径より小さくなるように、前記金属板と圧電体とが加圧されていることを特徴とする、請求項1に記載の接着構造。
- 硬化状態における前記導電性接着剤は異方導電性を有することを特徴とする、請求項1又は2に記載の接着構造。
- 前記導電性接着剤中のカーボンブラックの量は、カーボンブラックと樹脂との合計量に対して1〜10重量%であることを特徴とする、請求項1乃至3のいずれか1項に記載の接着構造。
- 金属板と、前記金属板と対向する面に電極を有する圧電体とを、導電補助剤としてカーボンブラックを含む導電性接着剤を用いて、前記金属板と圧電体の電極との電気的導通性をもって接着する接着方法において、
平均粒径がナノレベルのカーボンブラックを含み、かつ当該カーボンブラックが平均粒径1μm〜50μmの凝集体となるように、無溶剤系又は溶剤系樹脂中に含有されたペースト状の前記導電性接着剤を、前記金属板と圧電体の電極との間に塗布する工程と、
前記導電性接着剤を塗布した後、前記金属板と圧電体とを加熱・加圧することにより、前記カーボンブラックの凝集体を変形させた状態で前記導電性接着剤を硬化させる工程と、を含む接着方法。 - 前記金属板と圧電体の電極との間の距離が、前記凝集体の平均粒径より小さくなるように、前記金属板と圧電体とを加圧することを特徴とする、請求項5に記載の接着方法。
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JP2011514572A JP4771028B2 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
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PCT/JP2010/060516 WO2011007646A1 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
JP2011514572A JP4771028B2 (ja) | 2009-07-17 | 2010-06-22 | 金属板と圧電体との接着構造及び接着方法 |
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WO2011007646A1 (ja) * | 2009-07-17 | 2011-01-20 | 株式会社村田製作所 | 金属板と圧電体との接着構造及び接着方法 |
JP5900155B2 (ja) * | 2011-09-06 | 2016-04-06 | 株式会社村田製作所 | 流体制御装置 |
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WO2019130862A1 (ja) * | 2017-12-27 | 2019-07-04 | パナソニックIpマネジメント株式会社 | 発電装置 |
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JP2002033022A (ja) * | 2000-07-13 | 2002-01-31 | Mitsui Takeda Chemicals Inc | 導電性多層構造樹脂粒子およびそれを用いた異方導電性接着剤 |
WO2003078528A1 (fr) * | 2002-03-18 | 2003-09-25 | Ntn Corporation | Moule en résine conductrice |
WO2005026260A1 (ja) * | 2003-09-12 | 2005-03-24 | Asahi Kasei Chemicals Corporation | 導電性樹脂組成物および成形体 |
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CN102473837B (zh) | 2013-12-25 |
US20130276977A1 (en) | 2013-10-24 |
US9276194B2 (en) | 2016-03-01 |
JPWO2011007646A1 (ja) | 2012-12-27 |
US20120091863A1 (en) | 2012-04-19 |
JP2011179015A (ja) | 2011-09-15 |
WO2011007646A1 (ja) | 2011-01-20 |
CN102473837A (zh) | 2012-05-23 |
JP5333523B2 (ja) | 2013-11-06 |
US8492959B2 (en) | 2013-07-23 |
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