JPS556317B2 - - Google Patents

Info

Publication number
JPS556317B2
JPS556317B2 JP6880273A JP6880273A JPS556317B2 JP S556317 B2 JPS556317 B2 JP S556317B2 JP 6880273 A JP6880273 A JP 6880273A JP 6880273 A JP6880273 A JP 6880273A JP S556317 B2 JPS556317 B2 JP S556317B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6880273A
Other versions
JPS5016866A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6880273A priority Critical patent/JPS556317B2/ja
Priority to CA187,913A priority patent/CA1033871A/en
Priority to US423708A priority patent/US3896076A/en
Priority to AU63554/73A priority patent/AU465064B2/en
Priority to DE19732363259 priority patent/DE2363259C3/de
Priority to SU731988255A priority patent/SU1114341A3/ru
Priority to GB5877573A priority patent/GB1424269A/en
Priority to IT54458/73A priority patent/IT1000374B/it
Priority to FR7345797A priority patent/FR2234360B1/fr
Priority to CH1775673A priority patent/CH587884A5/xx
Priority to US05/530,986 priority patent/US3962520A/en
Publication of JPS5016866A publication Critical patent/JPS5016866A/ja
Priority to SU752167215A priority patent/SU843762A3/ru
Publication of JPS556317B2 publication Critical patent/JPS556317B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6880273A 1973-06-20 1973-06-20 Expired JPS556317B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP6880273A JPS556317B2 (ja) 1973-06-20 1973-06-20
CA187,913A CA1033871A (en) 1973-06-20 1973-12-11 Adhesive composition for flexible printed circuit and method for using the same
US423708A US3896076A (en) 1973-06-20 1973-12-11 Adhesive composition for flexible printed circuit and method for using the same
AU63554/73A AU465064B2 (en) 1973-06-20 1973-12-13 Adhesive composition for flexible printed circuit and method for using the same
DE19732363259 DE2363259C3 (de) 1973-06-20 1973-12-19 Klebemasse auf der Basis von Polyesterharz, einer Isocyanatverbindung und Epoxyharz und Verwendung derselben
SU731988255A SU1114341A3 (ru) 1973-06-20 1973-12-19 Клеева композици дл соединени полимерных пленок с металлической фольгой
GB5877573A GB1424269A (en) 1973-06-20 1973-12-19 Adhesive composition for flexible printed circuit and method for using the same
IT54458/73A IT1000374B (it) 1973-06-20 1973-12-20 Composizione adesiva per circuiti stampati e procedimento per produr re laminati con essa
FR7345797A FR2234360B1 (ja) 1973-06-20 1973-12-20
CH1775673A CH587884A5 (ja) 1973-06-20 1973-12-20
US05/530,986 US3962520A (en) 1973-06-20 1974-12-09 Adhesive composition for flexible printed circuit and method for using the same
SU752167215A SU843762A3 (ru) 1973-06-20 1975-08-20 Способ получени слоистого материала

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6880273A JPS556317B2 (ja) 1973-06-20 1973-06-20

Publications (2)

Publication Number Publication Date
JPS5016866A JPS5016866A (ja) 1975-02-21
JPS556317B2 true JPS556317B2 (ja) 1980-02-15

Family

ID=13384202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6880273A Expired JPS556317B2 (ja) 1973-06-20 1973-06-20

Country Status (9)

Country Link
US (1) US3896076A (ja)
JP (1) JPS556317B2 (ja)
AU (1) AU465064B2 (ja)
CA (1) CA1033871A (ja)
CH (1) CH587884A5 (ja)
FR (1) FR2234360B1 (ja)
GB (1) GB1424269A (ja)
IT (1) IT1000374B (ja)
SU (2) SU1114341A3 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578212U (ja) * 1980-06-16 1982-01-16
JPS5733751U (ja) * 1980-07-31 1982-02-22
JPS5829712U (ja) * 1981-08-21 1983-02-26 旭化成株式会社 二重パネル
JPS59132818U (ja) * 1983-02-26 1984-09-05 アコス工業株式会社 壁板
JPS6244004Y2 (ja) * 1980-12-23 1987-11-18
JPS6336095Y2 (ja) * 1980-07-31 1988-09-26

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS54107985A (en) * 1978-02-10 1979-08-24 Nikkan Ind Copper laminate with metal foil release type sheet and manufacture therefor
DE3028496C2 (de) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Haftvermittler für ein Trägermaterial
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
JPS6293991A (ja) * 1985-10-21 1987-04-30 帝人株式会社 フレキシブル回路用基板
JP2933220B2 (ja) * 1988-03-22 1999-08-09 三菱樹脂株式会社 ポリアミド樹脂−金属積層体
EP1009200B1 (en) * 1996-10-05 2006-12-20 Nitto Denko Corporation Circuit member and circuit board
US6274225B1 (en) 1996-10-05 2001-08-14 Nitto Denko Corporation Circuit member and circuit board
JP2000106482A (ja) * 1998-07-29 2000-04-11 Sony Chem Corp フレキシブル基板製造方法
US7147927B2 (en) * 2002-06-26 2006-12-12 Eastman Chemical Company Biaxially oriented polyester film and laminates thereof with copper
US7524920B2 (en) * 2004-12-16 2009-04-28 Eastman Chemical Company Biaxially oriented copolyester film and laminates thereof
US20060275558A1 (en) * 2005-05-17 2006-12-07 Pecorini Thomas J Conductively coated substrates derived from biaxially-oriented and heat-set polyester film
KR100829553B1 (ko) * 2006-11-22 2008-05-14 삼성에스디아이 주식회사 연료전지의 스택 구조체
US8851356B1 (en) * 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
EP2419483B1 (en) * 2009-04-13 2014-08-27 W.R. Grace & Co.-Conn. High ph process resistant coating for metal food containers
JP2012528023A (ja) * 2009-05-29 2012-11-12 バイエル・マテリアルサイエンス・アクチェンゲゼルシャフト フォーム複合材料要素ｉの製造方法
WO2011007646A1 (ja) * 2009-07-17 2011-01-20 株式会社村田製作所 金属板と圧電体との接着構造及び接着方法
TWM374243U (en) * 2009-10-12 2010-02-11 Asia Electronic Material Co Covering film for printed circuit board
CN102634286B (zh) * 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
BR112017009032B1 (pt) * 2014-11-03 2021-10-26 Cytec Industries Inc Métodos para preparação de superfícies antes da ligação adesiva e de ligação
AR102914A1 (es) * 2014-11-12 2017-04-05 Dow Global Technologies Llc Adhesivo de laminación por embutición en frío de bisfenol-a-libre
WO2021128250A1 (en) * 2019-12-27 2021-07-01 3M Innovative Properties Company High temperature resistant b-stageable epoxy adhesive and article manufactured therefrom

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280840A (ja) * 1961-07-12

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578212U (ja) * 1980-06-16 1982-01-16
JPS5733751U (ja) * 1980-07-31 1982-02-22
JPS6336095Y2 (ja) * 1980-07-31 1988-09-26
JPS6244004Y2 (ja) * 1980-12-23 1987-11-18
JPS5829712U (ja) * 1981-08-21 1983-02-26 旭化成株式会社 二重パネル
JPS59132818U (ja) * 1983-02-26 1984-09-05 アコス工業株式会社 壁板

Also Published As

Publication number Publication date
CH587884A5 (ja) 1977-05-13
JPS5016866A (ja) 1975-02-21
SU843762A3 (ru) 1981-06-30
DE2363259A1 (de) 1975-01-16
US3896076A (en) 1975-07-22
FR2234360B1 (ja) 1976-10-08
GB1424269A (en) 1976-02-11
AU6355473A (en) 1975-06-19
SU1114341A3 (ru) 1984-09-15
DE2363259B2 (de) 1977-05-18
IT1000374B (it) 1976-03-30
CA1033871A (en) 1978-06-27
FR2234360A1 (ja) 1975-01-17
AU465064B2 (en) 1975-09-18

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