JPS54107985A - Copper laminate with metal foil release type sheet and manufacture therefor - Google Patents

Copper laminate with metal foil release type sheet and manufacture therefor

Info

Publication number
JPS54107985A
JPS54107985A JP1432178A JP1432178A JPS54107985A JP S54107985 A JPS54107985 A JP S54107985A JP 1432178 A JP1432178 A JP 1432178A JP 1432178 A JP1432178 A JP 1432178A JP S54107985 A JPS54107985 A JP S54107985A
Authority
JP
Japan
Prior art keywords
metal foil
release type
type sheet
copper laminate
manufacture therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1432178A
Other languages
Japanese (ja)
Inventor
Noriyuki Shimizu
Akiji Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikkan Industries Co Ltd
Original Assignee
Nikkan Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikkan Industries Co Ltd filed Critical Nikkan Industries Co Ltd
Priority to JP1432178A priority Critical patent/JPS54107985A/en
Publication of JPS54107985A publication Critical patent/JPS54107985A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP1432178A 1978-02-10 1978-02-10 Copper laminate with metal foil release type sheet and manufacture therefor Pending JPS54107985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1432178A JPS54107985A (en) 1978-02-10 1978-02-10 Copper laminate with metal foil release type sheet and manufacture therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1432178A JPS54107985A (en) 1978-02-10 1978-02-10 Copper laminate with metal foil release type sheet and manufacture therefor

Publications (1)

Publication Number Publication Date
JPS54107985A true JPS54107985A (en) 1979-08-24

Family

ID=11857809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1432178A Pending JPS54107985A (en) 1978-02-10 1978-02-10 Copper laminate with metal foil release type sheet and manufacture therefor

Country Status (1)

Country Link
JP (1) JPS54107985A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115439A (en) * 1983-11-28 1985-06-21 松下電工株式会社 Manufacture of metallic foil lined laminated board
JPH01150541A (en) * 1987-12-07 1989-06-13 Matsushita Electric Works Ltd Laminated plate for electric use
US20160338194A1 (en) * 2015-05-12 2016-11-17 Samsung Electro-Mechanics Co., Ltd. Copper clad laminates and method for manufacturing a printed circuit board using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4884182A (en) * 1972-02-14 1973-11-08
JPS5016866A (en) * 1973-06-20 1975-02-21
JPS5018579A (en) * 1973-06-20 1975-02-27
JPS5076565A (en) * 1973-11-12 1975-06-23

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4884182A (en) * 1972-02-14 1973-11-08
JPS5016866A (en) * 1973-06-20 1975-02-21
JPS5018579A (en) * 1973-06-20 1975-02-27
JPS5076565A (en) * 1973-11-12 1975-06-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115439A (en) * 1983-11-28 1985-06-21 松下電工株式会社 Manufacture of metallic foil lined laminated board
JPH0433620B2 (en) * 1983-11-28 1992-06-03 Matsushita Electric Works Ltd
JPH01150541A (en) * 1987-12-07 1989-06-13 Matsushita Electric Works Ltd Laminated plate for electric use
US20160338194A1 (en) * 2015-05-12 2016-11-17 Samsung Electro-Mechanics Co., Ltd. Copper clad laminates and method for manufacturing a printed circuit board using the same
US10952329B2 (en) * 2015-05-12 2021-03-16 Samsung Electro-Mechanics Co., Ltd. Copper clad laminates and method for manufacturing a printed circuit board using the same

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