FR2234360B1 - - Google Patents

Info

Publication number
FR2234360B1
FR2234360B1 FR7345797A FR7345797A FR2234360B1 FR 2234360 B1 FR2234360 B1 FR 2234360B1 FR 7345797 A FR7345797 A FR 7345797A FR 7345797 A FR7345797 A FR 7345797A FR 2234360 B1 FR2234360 B1 FR 2234360B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7345797A
Other versions
FR2234360A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of FR2234360A1 publication Critical patent/FR2234360A1/fr
Application granted granted Critical
Publication of FR2234360B1 publication Critical patent/FR2234360B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7345797A 1973-06-20 1973-12-20 Expired FR2234360B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6880273A JPS556317B2 (fr) 1973-06-20 1973-06-20

Publications (2)

Publication Number Publication Date
FR2234360A1 FR2234360A1 (fr) 1975-01-17
FR2234360B1 true FR2234360B1 (fr) 1976-10-08

Family

ID=13384202

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7345797A Expired FR2234360B1 (fr) 1973-06-20 1973-12-20

Country Status (9)

Country Link
US (1) US3896076A (fr)
JP (1) JPS556317B2 (fr)
AU (1) AU465064B2 (fr)
CA (1) CA1033871A (fr)
CH (1) CH587884A5 (fr)
FR (1) FR2234360B1 (fr)
GB (1) GB1424269A (fr)
IT (1) IT1000374B (fr)
SU (2) SU1114341A3 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS54107985A (en) * 1978-02-10 1979-08-24 Nikkan Ind Copper laminate with metal foil release type sheet and manufacture therefor
JPS578212U (fr) * 1980-06-16 1982-01-16
DE3028496C2 (de) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Haftvermittler für ein Trägermaterial
JPS5733751U (fr) * 1980-07-31 1982-02-22
JPS6336095Y2 (fr) * 1980-07-31 1988-09-26
JPS6244004Y2 (fr) * 1980-12-23 1987-11-18
JPS5829712U (ja) * 1981-08-21 1983-02-26 旭化成株式会社 二重パネル
JPS59132818U (ja) * 1983-02-26 1984-09-05 アコス工業株式会社 壁板
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
JPS6293991A (ja) * 1985-10-21 1987-04-30 帝人株式会社 フレキシブル回路用基板
JP2933220B2 (ja) * 1988-03-22 1999-08-09 三菱樹脂株式会社 ポリアミド樹脂−金属積層体
US6274225B1 (en) 1996-10-05 2001-08-14 Nitto Denko Corporation Circuit member and circuit board
EP1009200B1 (fr) * 1996-10-05 2006-12-20 Nitto Denko Corporation Element de circuit et carte de circuit
JP2000106482A (ja) * 1998-07-29 2000-04-11 Sony Chem Corp フレキシブル基板製造方法
US7147927B2 (en) * 2002-06-26 2006-12-12 Eastman Chemical Company Biaxially oriented polyester film and laminates thereof with copper
US7524920B2 (en) * 2004-12-16 2009-04-28 Eastman Chemical Company Biaxially oriented copolyester film and laminates thereof
US20060275558A1 (en) * 2005-05-17 2006-12-07 Pecorini Thomas J Conductively coated substrates derived from biaxially-oriented and heat-set polyester film
KR100829553B1 (ko) * 2006-11-22 2008-05-14 삼성에스디아이 주식회사 연료전지의 스택 구조체
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8851356B1 (en) * 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
EP2419483B1 (fr) * 2009-04-13 2014-08-27 W.R. Grace & Co.-Conn. Revetement resistant a un traitement a ph eleve pour les contenants alimentaires metalliques
US20120121887A1 (en) * 2009-05-29 2012-05-17 Bayer Materialscience Ag Method for preparing a foam composite element
WO2011007646A1 (fr) * 2009-07-17 2011-01-20 株式会社村田製作所 Structure pour le collage d'une plaque métallique sur un corps piézoélectrique, ainsi que procédé de collage
TWM374243U (en) * 2009-10-12 2010-02-11 Asia Electronic Material Co Covering film for printed circuit board
CN102634286B (zh) * 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
CN107207749B (zh) * 2014-11-03 2021-03-16 塞特工业公司 复合材料的结合
AR102914A1 (es) * 2014-11-12 2017-04-05 Dow Global Technologies Llc Adhesivo de laminación por embutición en frío de bisfenol-a-libre
CN114929827A (zh) * 2019-12-27 2022-08-19 3M创新有限公司 耐高温可b阶化环氧粘合剂和由其制造的制品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE620026A (fr) * 1961-07-12

Also Published As

Publication number Publication date
AU6355473A (en) 1975-06-19
IT1000374B (it) 1976-03-30
CA1033871A (fr) 1978-06-27
US3896076A (en) 1975-07-22
JPS5016866A (fr) 1975-02-21
SU1114341A3 (ru) 1984-09-15
DE2363259B2 (de) 1977-05-18
JPS556317B2 (fr) 1980-02-15
SU843762A3 (ru) 1981-06-30
GB1424269A (en) 1976-02-11
DE2363259A1 (de) 1975-01-16
FR2234360A1 (fr) 1975-01-17
AU465064B2 (en) 1975-09-18
CH587884A5 (fr) 1977-05-13

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Legal Events

Date Code Title Description
ST Notification of lapse