JP2011147982A - はんだ、電子部品、及び電子部品の製造方法 - Google Patents

はんだ、電子部品、及び電子部品の製造方法 Download PDF

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Publication number
JP2011147982A
JP2011147982A JP2010012423A JP2010012423A JP2011147982A JP 2011147982 A JP2011147982 A JP 2011147982A JP 2010012423 A JP2010012423 A JP 2010012423A JP 2010012423 A JP2010012423 A JP 2010012423A JP 2011147982 A JP2011147982 A JP 2011147982A
Authority
JP
Japan
Prior art keywords
solder
powder
mass
solder material
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010012423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011147982A5 (enExample
Inventor
Toshimasa Tsuda
稔正 津田
Mitsuo Hori
光男 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANOJOIN KK
Nihon Dempa Kogyo Co Ltd
Original Assignee
NANOJOIN KK
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANOJOIN KK, Nihon Dempa Kogyo Co Ltd filed Critical NANOJOIN KK
Priority to JP2010012423A priority Critical patent/JP2011147982A/ja
Priority to TW100101821A priority patent/TW201125674A/zh
Priority to US13/009,445 priority patent/US20110180311A1/en
Publication of JP2011147982A publication Critical patent/JP2011147982A/ja
Publication of JP2011147982A5 publication Critical patent/JP2011147982A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2010012423A 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法 Pending JP2011147982A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010012423A JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法
TW100101821A TW201125674A (en) 2010-01-22 2011-01-18 Solder, electronic part, and method of fabricating electronic part
US13/009,445 US20110180311A1 (en) 2010-01-22 2011-01-19 Solder, electronic part, and method of fabricating electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010012423A JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2011147982A true JP2011147982A (ja) 2011-08-04
JP2011147982A5 JP2011147982A5 (enExample) 2011-11-04

Family

ID=44308099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010012423A Pending JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法

Country Status (3)

Country Link
US (1) US20110180311A1 (enExample)
JP (1) JP2011147982A (enExample)
TW (1) TW201125674A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
FR3014339B1 (fr) * 2013-12-06 2016-01-08 Snecma Procede de fabrication d'une piece par fusion selective de poudre
DE102014211497A1 (de) * 2014-06-16 2015-12-17 Siemens Aktiengesellschaft Lötverfahren
CN105834610A (zh) * 2015-02-04 2016-08-10 日本电波工业株式会社 焊料材料及电子零件
JP6780994B2 (ja) * 2016-09-22 2020-11-04 日本電波工業株式会社 はんだ材料及び電子部品
CN110961831B (zh) * 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
WO2020089258A1 (en) * 2018-10-31 2020-05-07 Robert Bosch Gmbh Mixed alloy solder paste, method of making the same and soldering method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417994A (ja) * 1990-05-10 1992-01-22 Asahi Chem Ind Co Ltd はんだ組成物
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP2008031550A (ja) * 2006-06-26 2008-02-14 Hitachi Cable Ltd ＰｂフリーのＳｎ系材料及び配線用導体並びに端末接続部並びにＰｂフリーはんだ合金
JP2008161881A (ja) * 2006-12-27 2008-07-17 Matsushita Electric Ind Co Ltd 接合材料およびモジュール構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
US20030007885A1 (en) * 1999-03-16 2003-01-09 Shinjiro Domi Lead-free solder
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
JP4617485B2 (ja) * 2004-12-13 2011-01-26 ナノジョイン株式会社 はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417994A (ja) * 1990-05-10 1992-01-22 Asahi Chem Ind Co Ltd はんだ組成物
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP2008031550A (ja) * 2006-06-26 2008-02-14 Hitachi Cable Ltd ＰｂフリーのＳｎ系材料及び配線用導体並びに端末接続部並びにＰｂフリーはんだ合金
JP2008161881A (ja) * 2006-12-27 2008-07-17 Matsushita Electric Ind Co Ltd 接合材料およびモジュール構造体

Also Published As

Publication number Publication date
TW201125674A (en) 2011-08-01
US20110180311A1 (en) 2011-07-28

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