TW201125674A - Solder, electronic part, and method of fabricating electronic part - Google Patents

Solder, electronic part, and method of fabricating electronic part Download PDF

Info

Publication number
TW201125674A
TW201125674A TW100101821A TW100101821A TW201125674A TW 201125674 A TW201125674 A TW 201125674A TW 100101821 A TW100101821 A TW 100101821A TW 100101821 A TW100101821 A TW 100101821A TW 201125674 A TW201125674 A TW 201125674A
Authority
TW
Taiwan
Prior art keywords
flux
powder
solder
alloy
component
Prior art date
Application number
TW100101821A
Other languages
English (en)
Chinese (zh)
Inventor
Toshimasa Tsuda
Mitsuo Hori
Original Assignee
Nihon Dempa Kogyo Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co filed Critical Nihon Dempa Kogyo Co
Publication of TW201125674A publication Critical patent/TW201125674A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/285—Alignment aids, e.g. alignment marks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW100101821A 2010-01-22 2011-01-18 Solder, electronic part, and method of fabricating electronic part TW201125674A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010012423A JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
TW201125674A true TW201125674A (en) 2011-08-01

Family

ID=44308099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100101821A TW201125674A (en) 2010-01-22 2011-01-18 Solder, electronic part, and method of fabricating electronic part

Country Status (3)

Country Link
US (1) US20110180311A1 (enExample)
JP (1) JP2011147982A (enExample)
TW (1) TW201125674A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
FR3014339B1 (fr) * 2013-12-06 2016-01-08 Snecma Procede de fabrication d'une piece par fusion selective de poudre
DE102014211497A1 (de) * 2014-06-16 2015-12-17 Siemens Aktiengesellschaft Lötverfahren
CN105834610A (zh) * 2015-02-04 2016-08-10 日本电波工业株式会社 焊料材料及电子零件
JP6780994B2 (ja) * 2016-09-22 2020-11-04 日本電波工業株式会社 はんだ材料及び電子部品
CN110961831B (zh) * 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
DE112019005431T5 (de) * 2018-10-31 2021-07-15 Robert Bosch Gmbh Mischlegierungslotpaste, verfahren zur herstellung derselben und lötverfahren

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
JPH0417994A (ja) * 1990-05-10 1992-01-22 Asahi Chem Ind Co Ltd はんだ組成物
US20030007885A1 (en) * 1999-03-16 2003-01-09 Shinjiro Domi Lead-free solder
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP4617485B2 (ja) * 2004-12-13 2011-01-26 ナノジョイン株式会社 はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
JP4692479B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合材料およびモジュール構造体

Also Published As

Publication number Publication date
US20110180311A1 (en) 2011-07-28
JP2011147982A (ja) 2011-08-04

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