JP2011147982A5 - - Google Patents

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Publication number
JP2011147982A5
JP2011147982A5 JP2010012423A JP2010012423A JP2011147982A5 JP 2011147982 A5 JP2011147982 A5 JP 2011147982A5 JP 2010012423 A JP2010012423 A JP 2010012423A JP 2010012423 A JP2010012423 A JP 2010012423A JP 2011147982 A5 JP2011147982 A5 JP 2011147982A5
Authority
JP
Japan
Prior art keywords
mass
powder
solder
less
solder material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010012423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011147982A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010012423A priority Critical patent/JP2011147982A/ja
Priority claimed from JP2010012423A external-priority patent/JP2011147982A/ja
Priority to TW100101821A priority patent/TW201125674A/zh
Priority to US13/009,445 priority patent/US20110180311A1/en
Publication of JP2011147982A publication Critical patent/JP2011147982A/ja
Publication of JP2011147982A5 publication Critical patent/JP2011147982A5/ja
Pending legal-status Critical Current

Links

JP2010012423A 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法 Pending JP2011147982A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010012423A JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法
TW100101821A TW201125674A (en) 2010-01-22 2011-01-18 Solder, electronic part, and method of fabricating electronic part
US13/009,445 US20110180311A1 (en) 2010-01-22 2011-01-19 Solder, electronic part, and method of fabricating electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010012423A JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2011147982A JP2011147982A (ja) 2011-08-04
JP2011147982A5 true JP2011147982A5 (enExample) 2011-11-04

Family

ID=44308099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010012423A Pending JP2011147982A (ja) 2010-01-22 2010-01-22 はんだ、電子部品、及び電子部品の製造方法

Country Status (3)

Country Link
US (1) US20110180311A1 (enExample)
JP (1) JP2011147982A (enExample)
TW (1) TW201125674A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
FR3014339B1 (fr) * 2013-12-06 2016-01-08 Snecma Procede de fabrication d'une piece par fusion selective de poudre
DE102014211497A1 (de) * 2014-06-16 2015-12-17 Siemens Aktiengesellschaft Lötverfahren
CN105834610A (zh) * 2015-02-04 2016-08-10 日本电波工业株式会社 焊料材料及电子零件
JP6780994B2 (ja) * 2016-09-22 2020-11-04 日本電波工業株式会社 はんだ材料及び電子部品
CN110961831B (zh) * 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
WO2020089258A1 (en) * 2018-10-31 2020-05-07 Robert Bosch Gmbh Mixed alloy solder paste, method of making the same and soldering method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
JPH0417994A (ja) * 1990-05-10 1992-01-22 Asahi Chem Ind Co Ltd はんだ組成物
US20030007885A1 (en) * 1999-03-16 2003-01-09 Shinjiro Domi Lead-free solder
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP4617485B2 (ja) * 2004-12-13 2011-01-26 ナノジョイン株式会社 はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
JP4692479B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合材料およびモジュール構造体

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