JP2011146718A5 - - Google Patents

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Publication number
JP2011146718A5
JP2011146718A5 JP2011007523A JP2011007523A JP2011146718A5 JP 2011146718 A5 JP2011146718 A5 JP 2011146718A5 JP 2011007523 A JP2011007523 A JP 2011007523A JP 2011007523 A JP2011007523 A JP 2011007523A JP 2011146718 A5 JP2011146718 A5 JP 2011146718A5
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JP
Japan
Prior art keywords
semiconductor die
receptacle
semiconductor
die
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011007523A
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English (en)
Japanese (ja)
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JP2011146718A (ja
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Publication date
Priority claimed from US12/689,126 external-priority patent/US8384231B2/en
Application filed filed Critical
Publication of JP2011146718A publication Critical patent/JP2011146718A/ja
Publication of JP2011146718A5 publication Critical patent/JP2011146718A5/ja
Pending legal-status Critical Current

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JP2011007523A 2010-01-18 2011-01-18 半導体ダイを形成する方法 Pending JP2011146718A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/689,126 2010-01-18
US12/689,126 US8384231B2 (en) 2010-01-18 2010-01-18 Method of forming a semiconductor die

Publications (2)

Publication Number Publication Date
JP2011146718A JP2011146718A (ja) 2011-07-28
JP2011146718A5 true JP2011146718A5 (enExample) 2013-12-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011007523A Pending JP2011146718A (ja) 2010-01-18 2011-01-18 半導体ダイを形成する方法

Country Status (5)

Country Link
US (1) US8384231B2 (enExample)
JP (1) JP2011146718A (enExample)
KR (1) KR20110084836A (enExample)
CN (1) CN102130022A (enExample)
TW (1) TW201135868A (enExample)

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US11430746B2 (en) 2020-04-29 2022-08-30 Semiconductor Components Industries, Llc Multidie supports for reducing die warpage
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US12230502B2 (en) 2017-08-17 2025-02-18 Semiconductor Components Industries, Llc Semiconductor package stress balance structures and related methods
US11367619B2 (en) 2017-08-17 2022-06-21 Semiconductor Components Industries, Llc Semiconductor package electrical contacts and related methods
US11404277B2 (en) 2017-08-17 2022-08-02 Semiconductor Components Industries, Llc Die sidewall coatings and related methods
US11361970B2 (en) 2017-08-17 2022-06-14 Semiconductor Components Industries, Llc Silicon-on-insulator die support structures and related methods
US10741487B2 (en) 2018-04-24 2020-08-11 Semiconductor Components Industries, Llc SOI substrate and related methods
US11393692B2 (en) 2017-08-17 2022-07-19 Semiconductor Components Industries, Llc Semiconductor package electrical contact structures and related methods
US11348796B2 (en) 2017-08-17 2022-05-31 Semiconductor Components Industries, Llc Backmetal removal methods
US11404276B2 (en) 2017-08-17 2022-08-02 Semiconductor Components Industries, Llc Semiconductor packages with thin die and related methods
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US10916474B2 (en) 2018-06-25 2021-02-09 Semiconductor Components Industries, Llc Method of reducing residual contamination in singulated semiconductor die
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