JP2011103498A5 - - Google Patents

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Publication number
JP2011103498A5
JP2011103498A5 JP2011031168A JP2011031168A JP2011103498A5 JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5 JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5
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JP
Japan
Prior art keywords
water
polishing
cmp
cerium oxide
azobis
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JP2011031168A
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English (en)
Japanese (ja)
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JP2011103498A (ja
JP5509114B2 (ja
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Priority to JP2011031168A priority Critical patent/JP5509114B2/ja
Priority claimed from JP2011031168A external-priority patent/JP5509114B2/ja
Publication of JP2011103498A publication Critical patent/JP2011103498A/ja
Publication of JP2011103498A5 publication Critical patent/JP2011103498A5/ja
Application granted granted Critical
Publication of JP5509114B2 publication Critical patent/JP5509114B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2011031168A 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法 Expired - Lifetime JP5509114B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004216039 2004-07-23
JP2004216039 2004-07-23
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法

Related Parent Applications (1)

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JP2006529234A Division JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013042019A Division JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

Publications (3)

Publication Number Publication Date
JP2011103498A JP2011103498A (ja) 2011-05-26
JP2011103498A5 true JP2011103498A5 (OSRAM) 2012-06-21
JP5509114B2 JP5509114B2 (ja) 2014-06-04

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ID=35785268

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法
JP2011031168A Expired - Lifetime JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法
JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

Family Applications Before (1)

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JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

Country Status (7)

Country Link
US (1) US9293344B2 (OSRAM)
EP (1) EP1796152B1 (OSRAM)
JP (3) JPWO2006009160A1 (OSRAM)
KR (1) KR100856171B1 (OSRAM)
CN (3) CN101311205A (OSRAM)
TW (1) TWI287040B (OSRAM)
WO (1) WO2006009160A1 (OSRAM)

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KR101245502B1 (ko) 2006-01-31 2013-03-25 히타치가세이가부시끼가이샤 절연막 연마용 cmp 연마제, 연마 방법, 상기 연마 방법으로 연마된 반도체 전자 부품
MD3809C2 (ro) * 2008-06-26 2009-08-31 Акционерное Общество "Azurit" Procedeu de prelucrare de finisare a plăcilor pentru acoperire din calcar hemogen
WO2010036358A1 (en) * 2008-09-26 2010-04-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
MY171840A (en) * 2011-10-24 2019-11-04 Fujimi Inc Composition for polishing purposes,polishing method using same,and method for producing substrate
US8703004B2 (en) * 2011-11-14 2014-04-22 Kabushiki Kaisha Toshiba Method for chemical planarization and chemical planarization apparatus
JPWO2013137220A1 (ja) * 2012-03-14 2015-08-03 日立化成株式会社 研磨方法
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
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KR102239131B1 (ko) * 2013-09-30 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
JP5920840B2 (ja) * 2013-09-30 2016-05-18 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
CN104356950B (zh) * 2014-10-21 2017-01-18 李金平 一种蓝宝石晶片抛光液
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
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JP6837958B2 (ja) 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
CN113412322B (zh) 2019-02-19 2023-04-25 昭和电工材料株式会社 研磨液及研磨方法
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