JP2011063855A - 無電解めっき素材の製造方法 - Google Patents
無電解めっき素材の製造方法 Download PDFInfo
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
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- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Chemically Coating (AREA)
Abstract
【解決手段】本発明の無電解めっき素材の製造方法は、表面に無電解めっきによりめっきされる無電解めっき素材の製造方法であって、樹脂からなる素材本体とオゾンを含む溶液とを接触させて該素材本体の表面に改質層を形成するオゾン処理工程と、前記オゾン処理工程の後、前記改質層の表面にエネルギーを付与して該改質層の表層を除去する表層除去工程と、を行うことを特徴とする。
【選択図】図1
Description
樹脂からなる素材本体とオゾンを含む溶液とを接触させて該素材本体の表面に改質層を形成するオゾン処理工程と、
前記オゾン処理工程の後、前記改質層の表面にエネルギーを付与して該改質層の表層を除去する表層除去工程と、
を行うことを特徴とする。
樹脂製の素材本体としてシクロオレフィンポリマー(COP)樹脂製の樹脂基板(150mm×150mm×0.1mm)を用いて無電解めっき素材を作製し、さらに無電解めっきとして化学銅めっきを行い、銅めっき被覆部材を得た。以下に、作製手順を詳説する。
表面層除去工程を行わない他は実施例1と同様にして銅めっき被覆部材を作製した。
(1−1)高温高湿環境下において、従来の銅めっき被覆部材の樹脂基板と銅めっき被膜との密着強度が低下することを示すために、耐久試験および剥離試験を行い、耐久試験後の密着強度を測定した。密着強度の測定には、引張り試験機(オートグラフ)を用いた。試料には、比較例1の被覆部材を用いた。耐久試験は、85℃85%の高温高湿環境下に1000時間放置、85℃40%の高温環境下に1000時間放置、の2種類を行った。なお、湿度は相対湿度である。耐久試験前後の密着強度を図2に示す。
実施例1の表層除去工程におけるエネルギー付与の手段をプラズマに変更して、実施例2の銅めっき被覆部材を作製した。表層除去工程以外の工程は、実施例1と同様にして作製した。以下に、表層除去工程を説明する。
表面層除去工程を行わない他は実施例2と同様にして銅めっき被覆部材を作製した。
実施例2の被覆部材および比較例2の被覆部材について、高温高湿環境下(85℃85%)での耐久試験を行った。そして、高温高湿環境下で100時間、200時間、500時間、1000時間、保持したそれぞれの被覆部材について、密着強度を測定した。密着強度の測定には、引張り試験機(オートグラフ)を用いた。結果を図7に示す。
表面層除去工程において酸素プラズマにかえて窒素プラズマを照射した他は実施例2と同様にして銅めっき被覆部材を作製した。
表面層除去工程において酸素プラズマの照射時間を10分とした他は実施例2と同様にして銅めっき被覆部材を作製した。
表面層除去工程において窒素プラズマの照射時間を10分とした他は実施例3と同様にして銅めっき被覆部材を作製した。
実施例2〜5の被覆部材の密着強度を測定した。密着強度の測定には、引張り試験機(オートグラフ)を用いた。なお、耐久試験は行わず、測定した密着強度は、初期の密着強度であった。結果を図8に示す。
実施例1の表層除去工程における紫外線の照度および/または照射時間を変更することで、除去される表層の厚さを変更して、7種類の銅めっき被覆部材を作製した。表層除去工程以外の工程は、実施例1と同様にして作製した。7種類の被覆部材をTEM観察したところ、表層除去工程にて除去された表層の厚さ(表層除去厚み)は、5nm、10nm、25nm、35nm、50nm、70nm、100nm(すべての改質層を除去)、であった。これらの被覆部材について、高温高湿環境下(85℃85%1000時間保持)での耐久試験を行った。そして、耐久試験前と試験後の被覆部材について、それぞれ密着強度を測定した。密着強度の測定には、引張り試験機(オートグラフ)を用いた。結果を図7に示す。なお、図7において、表層除去厚みが0nmである被覆部材は、比較例1の被覆部材である。
評価4において除去される表層の厚さを変更したのに加えて、さらに、オゾン処理工程におけるオゾン濃度および/または浸漬時間を変更して改質層の厚さも変更し、種々の銅めっき被覆部材を作製した。これらの被覆部材をTEM観察して測定した改質層の厚さおよび表層除去厚みを表1に示す。
Claims (5)
- 表面に無電解めっきによりめっきされる無電解めっき素材の製造方法であって、
樹脂からなる素材本体とオゾンを含む溶液とを接触させて該素材本体の表面に改質層を形成するオゾン処理工程と、
前記オゾン処理工程の後、前記改質層の表面にエネルギーを付与して該改質層の表層を除去する表層除去工程と、
を行うことを特徴とする無電解めっき素材の製造方法。 - 前記表層除去工程は、前記改質層の厚さをTとしたときに、該改質層の表面から0.1T以上0.5T以下の厚さで除去する工程である請求項1記載の無電解めっき素材の製造方法。
- 前記オゾン処理工程により形成される前記改質層の厚さは、30〜200nmである請求項2記載の無電解めっき素材の製造方法。
- 前記表層除去工程は、エネルギー付与をプラズマ照射により行う工程である請求項1〜3のいずれかに記載の無電解めっき素材の製造方法。
- 前記プラズマ照射は、酸素ガスを含む酸素のプラズマを使用する請求項4記載の無電解めっき素材の製造方法。
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JP2019173112A (ja) * | 2018-03-29 | 2019-10-10 | グリーンケム株式会社 | 金属メッキ方法 |
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DE102014005441A1 (de) * | 2014-04-11 | 2015-10-29 | Elena Danziger | Verfahren zur Herstellung eines haftfesten Verbundes |
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