JP2011054969A - 半導体素子及びその形成方法 - Google Patents
半導体素子及びその形成方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 139
- 238000000034 method Methods 0.000 title claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 314
- 239000002184 metal Substances 0.000 claims abstract description 314
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000001039 wet etching Methods 0.000 claims abstract description 15
- 239000007789 gas Substances 0.000 claims description 46
- 230000004888 barrier function Effects 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 22
- 150000001875 compounds Chemical group 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- -1 hydrogen ions Chemical class 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 94
- 238000006243 chemical reaction Methods 0.000 description 36
- 230000008569 process Effects 0.000 description 22
- 238000000151 deposition Methods 0.000 description 20
- 238000003860 storage Methods 0.000 description 19
- 230000008021 deposition Effects 0.000 description 18
- 125000004429 atom Chemical group 0.000 description 14
- 239000012535 impurity Substances 0.000 description 11
- 239000006227 byproduct Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
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Abstract
【解決手段】本発明の半導体素子の形成方法は、基板上に半導体構造物及び絶縁パターンを形成し、絶縁パターンの一面によって定義される側壁と半導体構造物の底によって定義される底を有するオープニングを形成し、オープニングを満たす第1金属膜を形成し、第1金属膜を湿式エッチングしてオープニングの側壁を少なくとも一部露出させ、第1金属膜上に第2金属膜を選択的に形成することを含む。
【選択図】図3
Description
2WF6+3SiH4−>2W+3SiF4+6H2
2WF6+3H2−>W+6HF
2WF6+3SiH4−>2W+3SiF4+6H2
WF6+3H2−>W+6HF
121 基底絶縁膜
123 ゲート間絶縁膜
125 上部絶縁膜
130 ホール
133 半導体構造物
135 不純物領域
140 グルーブ
142 絶縁パターン
150 オープニング
153 第1金属膜
154 第1金属パターン
156 第2金属パターン
158 充填絶縁膜
161 層間絶縁膜
165 ビットライン
SC 犠牲膜
Claims (20)
- 半導体構造物及び絶縁パターンを形成し、
前記絶縁パターンの一面によって定義される側壁を有するオープニングを形成し、
前記オープニングを満たす第1金属膜を形成し、
前記第1金属膜を湿式エッチングして前記オープニングの側壁を少なくとも一部露出させ、
前記エッチングされた第1金属膜上に第2金属膜を選択的に形成することを含み、前記第1金属膜のグレインの大きさは前記第2金属膜のグレインの大きさより小さいことを特徴とする半導体素子の形成方法。 - 前記基板上にゲートパターン及びゲート間絶縁膜を形成することをさらに含み、
前記半導体構造物は前記ゲート間絶縁膜を貫通するホール内に形成され、前記絶縁パターンは前記半導体構造物とゲートパターンとの間及び前記絶縁膜の上部面及び下部面上に形成されることを特徴とする請求項1に記載の半導体素子の形成方法。 - 前記ゲート間絶縁膜、前記半導体構造物、及び前記絶縁パターンを形成することは、
前記基板上にゲート間絶縁膜及び犠牲膜を交互に積層し、
前記ゲート間絶縁膜及び犠牲膜を貫通する前記ホールを形成し、
前記犠牲膜を除去し、
前記犠牲膜が除去された空間及び前記ホールをコンフォーマルに覆う前記絶縁パターンを形成することを含むことを特徴とする請求項2に記載の半導体素子の形成方法。 - 前記絶縁パターンと前記第1金属膜との間にバリア層を形成することをさらに含み、前記バリア層は前記湿式エッチングの時、前記第1金属膜と共にエッチングされることを特徴とする請求項1に記載の半導体素子の形成方法。
- 前記絶縁パターンはイオン結合によって結合される化合物を含むことを特徴とする請求項1に記載の半導体素子の形成方法。
- 前記第1金属膜及び第2金属膜は同一の金属を含むことを特徴とする請求項1に記載の半導体素子の形成方法。
- 前記第1金属膜の形成速度は前記第2金属膜の形成速度より速いことを特徴とする請求項1に記載の半導体素子の形成方法。
- 前記第1金属膜を形成すること及び前記第2金属膜を形成することは、前記オープニング内に第1金属ソース及び第1還元ガスを提供すること及び第2金属ソース及び第2還元ガスを提供することを各々含み、
前記第1金属ソース及び第2金属ソースは同一の金属元素を含むことを特徴とする請求項7に記載の半導体素子の形成方法。 - 前記第1金属ソース及び第2金属ソースはWF6であることを特徴とする請求項8に記載の半導体素子の形成方法。
- 前記第1還元ガス及び第2還元ガスは水素原子、水素ラジカル及び/または水素イオンを含むことを特徴とする請求項8に記載の半導体素子の形成方法。
- 前記第1還元ガスはシラン、またはジボランであり、前記第2還元ガスは水素ガスであることを特徴とする請求項8に記載の半導体素子の形成方法。
- 前記絶縁パターン及び前記オープニングを形成することは、
前記半導体構造物上に絶縁膜を形成すること及び前記半導体構造物の上部面を露出させるまで前記絶縁膜を異方性エッチングすることを含むことを特徴とする請求項1に記載の半導体素子の形成方法。 - 前記半導体構造物は、前記オープニングの底を通じて露出される導電領域をさらに含み、前記第1金属膜は前記導電領域と電気的に連結されることを特徴とする請求項12に記載の半導体素子の形成方法。
- 前記第2金属膜と接する可変抵抗パターンを形成し、
前記可変抵抗パターン上に第3金属膜を形成することをさらに含むことを特徴とする請求項12に記載の半導体素子の形成方法。 - 基板と、
前記基板上に交互に積層されたゲート間絶縁膜及びゲートパターンと、
前記ゲート間絶縁膜及び前記ゲートパターンの側壁に沿って前記基板から上に延長される半導体構造物と、
前記ゲートパターン及び前記半導体構造物の間の絶縁パターンとを含み、
前記ゲートパターンは前記半導体構造物と隣接した第1金属パターンと前記第1金属パターンに接し、前記第1金属パターンによって前記半導体構造物と離隔される第2金属パターンとを含むことを特徴とする半導体素子。 - 前記第1金属パターンのグレインの大きさは前記第2金属パターンのグレインの大きさより小さいことを特徴とする請求項15に記載の半導体素子。
- 前記絶縁パターンは前記ゲートパターンの上部面及び下部面上に延長されることを特徴とする請求項15に記載の半導体素子。
- 前記第2金属パターンは前記半導体構造物と隣接した前記ゲートパターンの第1側壁に向き合う第2側壁上に延長され、
前記第2金属パターンは前記ゲートパターンの前記第2側壁上の前記絶縁パターンより突き出されることを特徴とする請求項16に記載の半導体素子。 - 前記第1金属パターンと前記絶縁パターンとの間にバリア層をさらに含み、前記バリア層の一面は前記第1金属パターンの一面と同一の平面をなすことを特徴とする請求項15に記載の半導体素子。
- 前記絶縁パターンはONOAを含むことを特徴とする請求項15に記載の半導体素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090083124A KR101604054B1 (ko) | 2009-09-03 | 2009-09-03 | 반도체 소자 및 그 형성방법 |
KR10-2009-0083124 | 2009-09-03 |
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US8691682B2 (en) | 2014-04-08 |
US20130164928A1 (en) | 2013-06-27 |
US8415674B2 (en) | 2013-04-09 |
TWI464807B (zh) | 2014-12-11 |
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US20110049646A1 (en) | 2011-03-03 |
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