JP2011049566A5 - - Google Patents

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Publication number
JP2011049566A5
JP2011049566A5 JP2010198954A JP2010198954A JP2011049566A5 JP 2011049566 A5 JP2011049566 A5 JP 2011049566A5 JP 2010198954 A JP2010198954 A JP 2010198954A JP 2010198954 A JP2010198954 A JP 2010198954A JP 2011049566 A5 JP2011049566 A5 JP 2011049566A5
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JP
Japan
Prior art keywords
substrate
sensor substrate
processing apparatus
processing
detection element
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JP2010198954A
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English (en)
Japanese (ja)
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JP2011049566A (ja
JP5496834B2 (ja
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Priority to JP2010198954A priority Critical patent/JP5496834B2/ja
Priority claimed from JP2010198954A external-priority patent/JP5496834B2/ja
Publication of JP2011049566A publication Critical patent/JP2011049566A/ja
Publication of JP2011049566A5 publication Critical patent/JP2011049566A5/ja
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Publication of JP5496834B2 publication Critical patent/JP5496834B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2010198954A 1999-05-07 2010-09-06 センサ基板 Expired - Fee Related JP5496834B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010198954A JP5496834B2 (ja) 1999-05-07 2010-09-06 センサ基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP12695299 1999-05-07
JP1999126952 1999-05-07
JP2010198954A JP5496834B2 (ja) 1999-05-07 2010-09-06 センサ基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000617488A Division JP4776783B2 (ja) 1999-05-07 2000-05-02 基板処理方法及び基板処理装置

Publications (3)

Publication Number Publication Date
JP2011049566A JP2011049566A (ja) 2011-03-10
JP2011049566A5 true JP2011049566A5 (enExample) 2011-04-21
JP5496834B2 JP5496834B2 (ja) 2014-05-21

Family

ID=14947967

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000617488A Expired - Lifetime JP4776783B2 (ja) 1999-05-07 2000-05-02 基板処理方法及び基板処理装置
JP2010198954A Expired - Fee Related JP5496834B2 (ja) 1999-05-07 2010-09-06 センサ基板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2000617488A Expired - Lifetime JP4776783B2 (ja) 1999-05-07 2000-05-02 基板処理方法及び基板処理装置

Country Status (4)

Country Link
US (1) US6553277B1 (enExample)
JP (2) JP4776783B2 (enExample)
KR (1) KR100674624B1 (enExample)
WO (1) WO2000068986A1 (enExample)

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US8681493B2 (en) 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
KR101899784B1 (ko) * 2011-09-01 2018-09-21 세메스 주식회사 공정 챔버 모니터링 장치 및 방법
KR101334384B1 (ko) 2012-08-31 2013-11-29 한국생산기술연구원 공정챔버 내부의 공정가스 분석 장치
JP5596832B2 (ja) * 2013-07-29 2014-09-24 株式会社日立ハイテクノロジーズ プラズマ処理方法のＲｕｎ−ｔｏ−Ｒｕｎ制御方法
JP6383647B2 (ja) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 測定システムおよび測定方法
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KR102026733B1 (ko) * 2018-05-11 2019-09-30 엘지전자 주식회사 플라즈마 공정 측정 센서 및 그 제조 방법
JP7341237B2 (ja) * 2018-12-03 2023-09-08 ラム リサーチ コーポレーション ピンリフター試験基板
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KR102677514B1 (ko) * 2019-05-22 2024-06-21 삼성전자주식회사 압력 측정 장치
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