JP2010539443A5 - - Google Patents

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Publication number
JP2010539443A5
JP2010539443A5 JP2010520234A JP2010520234A JP2010539443A5 JP 2010539443 A5 JP2010539443 A5 JP 2010539443A5 JP 2010520234 A JP2010520234 A JP 2010520234A JP 2010520234 A JP2010520234 A JP 2010520234A JP 2010539443 A5 JP2010539443 A5 JP 2010539443A5
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JP
Japan
Prior art keywords
gas
atoms
plasma
emission
emission intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010520234A
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English (en)
Japanese (ja)
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JP2010539443A (ja
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Publication date
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Priority claimed from PCT/US2008/072008 external-priority patent/WO2009020881A1/en
Publication of JP2010539443A publication Critical patent/JP2010539443A/ja
Publication of JP2010539443A5 publication Critical patent/JP2010539443A5/ja
Pending legal-status Critical Current

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JP2010520234A 2007-08-07 2008-08-01 ガスの化学組成を同定するための方法および装置 Pending JP2010539443A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96397407P 2007-08-07 2007-08-07
US2045708P 2008-01-11 2008-01-11
PCT/US2008/072008 WO2009020881A1 (en) 2007-08-07 2008-08-01 Method and apparatus for identifying the chemical composition of a gas

Publications (2)

Publication Number Publication Date
JP2010539443A JP2010539443A (ja) 2010-12-16
JP2010539443A5 true JP2010539443A5 (enExample) 2011-09-15

Family

ID=40341669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010520234A Pending JP2010539443A (ja) 2007-08-07 2008-08-01 ガスの化学組成を同定するための方法および装置

Country Status (7)

Country Link
US (2) US7940395B2 (enExample)
EP (1) EP2185909A4 (enExample)
JP (1) JP2010539443A (enExample)
KR (1) KR20100065321A (enExample)
CN (1) CN101784878B (enExample)
TW (1) TWI396224B (enExample)
WO (1) WO2009020881A1 (enExample)

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US8716655B2 (en) * 2009-07-02 2014-05-06 Tricorntech Corporation Integrated ion separation spectrometer
US20120129318A1 (en) * 2010-11-24 2012-05-24 Semiconductor Energy Laboratory Co., Ltd. Atmospheric pressure plasma etching apparatus and method for manufacturing soi substrate
US8609548B2 (en) 2011-06-06 2013-12-17 Lam Research Corporation Method for providing high etch rate
US8440473B2 (en) * 2011-06-06 2013-05-14 Lam Research Corporation Use of spectrum to synchronize RF switching with gas switching during etch
JP6095901B2 (ja) * 2012-05-24 2017-03-15 株式会社Ihi 物質特定装置および物質特定方法
KR101791870B1 (ko) * 2013-02-19 2017-11-02 세메스 주식회사 검사 방법, 이를 포함하는 기판 처리 방법 및 기판 처리 장치
US9454158B2 (en) 2013-03-15 2016-09-27 Bhushan Somani Real time diagnostics for flow controller systems and methods
CA3000982A1 (en) * 2014-10-10 2016-04-14 Orthobond, Inc. Method for detecting and analzying surface films
WO2017116905A1 (en) * 2015-12-30 2017-07-06 Mattson Technology, Inc. Gas flow control for millisecond anneal system
US10504720B2 (en) 2016-11-29 2019-12-10 Taiwan Semiconductor Manufacturing Company, Ltd. Etching using chamber with top plate formed of non-oxygen containing material
US10983537B2 (en) 2017-02-27 2021-04-20 Flow Devices And Systems Inc. Systems and methods for flow sensor back pressure adjustment for mass flow controller
WO2018217466A2 (en) * 2017-05-25 2018-11-29 Applied Materials, Inc. Measuring concentrations of radicals in semiconductor processing
JP2020136473A (ja) * 2019-02-19 2020-08-31 株式会社東芝 半導体装置の製造方法
TWI897405B (zh) * 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
US20220093428A1 (en) * 2020-09-21 2022-03-24 Applied Materials, Inc. Atomic oxygen detection in semiconductor processing chambers

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPH0722151B2 (ja) * 1984-05-23 1995-03-08 株式会社日立製作所 エツチングモニタ−方法
US5405488A (en) * 1993-09-13 1995-04-11 Vlsi Technology, Inc. System and method for plasma etching endpoint detection
JP3333657B2 (ja) * 1995-02-10 2002-10-15 サイエンステクノロジー株式会社 気相エッチング装置及び気相エッチング方法
US5711843A (en) * 1995-02-21 1998-01-27 Orincon Technologies, Inc. System for indirectly monitoring and controlling a process with particular application to plasma processes
JPH11102895A (ja) * 1997-09-29 1999-04-13 Fujitsu Ltd 半導体装置の製造方法
US5986747A (en) * 1998-09-24 1999-11-16 Applied Materials, Inc. Apparatus and method for endpoint detection in non-ionizing gaseous reactor environments
WO2001007897A1 (en) * 1999-07-23 2001-02-01 Efthimion Philip C A continuous emissions monitor of multiple metal species in harsh environments
JP3565774B2 (ja) * 2000-09-12 2004-09-15 株式会社日立製作所 プラズマ処理装置及び処理方法
JP2002270574A (ja) * 2001-03-07 2002-09-20 Hitachi Kokusai Electric Inc プラズマエッチング装置
US7052943B2 (en) * 2001-03-16 2006-05-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
CN1153056C (zh) * 2001-04-10 2004-06-09 华邦电子股份有限公司 以光学方法测量温度并监控蚀刻率的方法
KR100426988B1 (ko) * 2001-11-08 2004-04-14 삼성전자주식회사 반도체 제조장비의 식각 종말점 검출장치 및 그에 따른검출방법
US20030129117A1 (en) * 2002-01-02 2003-07-10 Mills Randell L. Synthesis and characterization of a highly stable amorphous silicon hydride as the product of a catalytic hydrogen plasma reaction
US8580076B2 (en) * 2003-05-22 2013-11-12 Lam Research Corporation Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith
US20040235299A1 (en) * 2003-05-22 2004-11-25 Axcelis Technologies, Inc. Plasma ashing apparatus and endpoint detection process
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JP4849875B2 (ja) * 2005-11-17 2012-01-11 東京エレクトロン株式会社 プラズマエッチング方法

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