JP2010537187A5 - - Google Patents

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Publication number
JP2010537187A5
JP2010537187A5 JP2010521495A JP2010521495A JP2010537187A5 JP 2010537187 A5 JP2010537187 A5 JP 2010537187A5 JP 2010521495 A JP2010521495 A JP 2010521495A JP 2010521495 A JP2010521495 A JP 2010521495A JP 2010537187 A5 JP2010537187 A5 JP 2010537187A5
Authority
JP
Japan
Prior art keywords
matrix array
semiconductor
conductor pin
pin matrix
network system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010521495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010537187A (ja
Filing date
Publication date
Priority claimed from US11/840,587 external-priority patent/US7847568B2/en
Application filed filed Critical
Publication of JP2010537187A publication Critical patent/JP2010537187A/ja
Publication of JP2010537187A5 publication Critical patent/JP2010537187A5/ja
Pending legal-status Critical Current

Links

JP2010521495A 2007-08-17 2008-08-15 マルチサイトプローブ Pending JP2010537187A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/840,587 US7847568B2 (en) 2007-08-17 2007-08-17 Multi-site probe
PCT/IB2008/002158 WO2009024851A2 (en) 2007-08-17 2008-08-15 Multi-site probe

Publications (2)

Publication Number Publication Date
JP2010537187A JP2010537187A (ja) 2010-12-02
JP2010537187A5 true JP2010537187A5 (enExample) 2011-09-15

Family

ID=40328863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010521495A Pending JP2010537187A (ja) 2007-08-17 2008-08-15 マルチサイトプローブ

Country Status (6)

Country Link
US (1) US7847568B2 (enExample)
EP (1) EP2183603B1 (enExample)
JP (1) JP2010537187A (enExample)
KR (1) KR101365188B1 (enExample)
CN (1) CN101821634B (enExample)
WO (1) WO2009024851A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100069300A (ko) * 2008-12-16 2010-06-24 삼성전자주식회사 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법
US8519729B2 (en) 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
US9997423B2 (en) 2014-04-08 2018-06-12 Nxp Usa, Inc. Semiconductor wafer and method of concurrently testing circuits formed thereon
US9716031B2 (en) 2014-04-08 2017-07-25 Nxp Usa, Inc. Semiconductor wafer and method of concurrently testing circuits formed thereon
CN104615018A (zh) * 2014-12-18 2015-05-13 西安华芯半导体有限公司 一种调整同测芯片dc参数的方法
US10620236B2 (en) * 2017-06-12 2020-04-14 Marvell Asia Pte, Ltd. Multi-test type probe card and corresponding testing system for parallel testing of dies via multiple test sites
US12183609B2 (en) * 2022-03-03 2024-12-31 Micron Technology, Inc. Wafer carrier with reticle template for marking reticle fields on a semiconductor wafer
CN117199055A (zh) * 2022-06-01 2023-12-08 长鑫存储技术有限公司 封装结构及其制作方法、半导体器件

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4692205A (en) * 1986-01-31 1987-09-08 International Business Machines Corporation Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings
JPH0715969B2 (ja) * 1991-09-30 1995-02-22 インターナショナル・ビジネス・マシーンズ・コーポレイション マルチチツプ集積回路パツケージ及びそのシステム
JP3219844B2 (ja) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US6258609B1 (en) * 1996-09-30 2001-07-10 Micron Technology, Inc. Method and system for making known good semiconductor dice
US6404212B1 (en) * 1999-02-18 2002-06-11 St Assembly Test Services Pte Ltd Testing of BGA and other CSP packages using probing techniques
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
US6407568B1 (en) * 2000-02-10 2002-06-18 International Business Machines Corporation Apparatus for probing ends of pins
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
JP2002122630A (ja) * 2000-10-17 2002-04-26 Ando Electric Co Ltd Ｉｃテスタ調整装置
JP2002168906A (ja) * 2000-11-28 2002-06-14 Ando Electric Co Ltd テストヘッドの接続装置
US6547409B2 (en) * 2001-01-12 2003-04-15 Electroglas, Inc. Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
JP2003007784A (ja) * 2001-06-22 2003-01-10 Hitachi Maxell Ltd 半導体検査装置
US6674296B1 (en) * 2002-02-28 2004-01-06 Advanced Micro Devices, Inc. Probe card measurement tool
US20050212546A1 (en) * 2004-03-26 2005-09-29 Mark Lynch Method and apparatus for package testing
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
WO2006028238A1 (ja) * 2004-09-06 2006-03-16 Nec Corporation テストキャリア
JP4859174B2 (ja) * 2005-07-11 2012-01-25 日本電子材料株式会社 プローブカード
CN101223460B (zh) 2005-07-14 2010-05-19 帝人化成株式会社 发泡树脂片材和液晶显示装置
EP1965422A4 (en) 2005-12-22 2012-03-07 Jsr Corp PRINTED CIRCUIT BOARD APPARATUS FOR WAFER INSPECTION, PROBE CARD AND PLATE INSPECTION APPARATUS
TW200729373A (en) * 2006-01-20 2007-08-01 Advanced Semiconductor Eng Test module for wafer

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