JP2010537187A - マルチサイトプローブ - Google Patents

マルチサイトプローブ Download PDF

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Publication number
JP2010537187A
JP2010537187A JP2010521495A JP2010521495A JP2010537187A JP 2010537187 A JP2010537187 A JP 2010537187A JP 2010521495 A JP2010521495 A JP 2010521495A JP 2010521495 A JP2010521495 A JP 2010521495A JP 2010537187 A JP2010537187 A JP 2010537187A
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JP
Japan
Prior art keywords
semiconductor
matrix array
probe
conductor pin
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010521495A
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English (en)
Japanese (ja)
Other versions
JP2010537187A5 (enExample
Inventor
ガンゴソ，アンドリュー
マルティネス，リアーネ
Original Assignee
アドバンスト マイクロ デバイシズ，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アドバンスト マイクロ デバイシズ，インコーポレイテッド filed Critical アドバンスト マイクロ デバイシズ，インコーポレイテッド
Publication of JP2010537187A publication Critical patent/JP2010537187A/ja
Publication of JP2010537187A5 publication Critical patent/JP2010537187A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2010521495A 2007-08-17 2008-08-15 マルチサイトプローブ Pending JP2010537187A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/840,587 US7847568B2 (en) 2007-08-17 2007-08-17 Multi-site probe
PCT/IB2008/002158 WO2009024851A2 (en) 2007-08-17 2008-08-15 Multi-site probe

Publications (2)

Publication Number Publication Date
JP2010537187A true JP2010537187A (ja) 2010-12-02
JP2010537187A5 JP2010537187A5 (enExample) 2011-09-15

Family

ID=40328863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010521495A Pending JP2010537187A (ja) 2007-08-17 2008-08-15 マルチサイトプローブ

Country Status (6)

Country Link
US (1) US7847568B2 (enExample)
EP (1) EP2183603B1 (enExample)
JP (1) JP2010537187A (enExample)
KR (1) KR101365188B1 (enExample)
CN (1) CN101821634B (enExample)
WO (1) WO2009024851A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100069300A (ko) * 2008-12-16 2010-06-24 삼성전자주식회사 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법
US8519729B2 (en) 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
US9997423B2 (en) 2014-04-08 2018-06-12 Nxp Usa, Inc. Semiconductor wafer and method of concurrently testing circuits formed thereon
US9716031B2 (en) 2014-04-08 2017-07-25 Nxp Usa, Inc. Semiconductor wafer and method of concurrently testing circuits formed thereon
CN104615018A (zh) * 2014-12-18 2015-05-13 西安华芯半导体有限公司 一种调整同测芯片dc参数的方法
US10620236B2 (en) * 2017-06-12 2020-04-14 Marvell Asia Pte, Ltd. Multi-test type probe card and corresponding testing system for parallel testing of dies via multiple test sites
US12183609B2 (en) * 2022-03-03 2024-12-31 Micron Technology, Inc. Wafer carrier with reticle template for marking reticle fields on a semiconductor wafer
CN117199055A (zh) * 2022-06-01 2023-12-08 长鑫存储技术有限公司 封装结构及其制作方法、半导体器件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177318A (ja) * 1991-09-30 1994-06-24 Internatl Business Mach Corp <Ibm> マルチチツプ集積回路パツケージ及びそのシステム
JP2003007784A (ja) * 2001-06-22 2003-01-10 Hitachi Maxell Ltd 半導体検査装置
JP2005302917A (ja) * 2004-04-09 2005-10-27 Renesas Technology Corp 半導体集積回路の製造方法及びプローブカード
WO2006028238A1 (ja) * 2004-09-06 2006-03-16 Nec Corporation テストキャリア
JP2007017363A (ja) * 2005-07-11 2007-01-25 Japan Electronic Materials Corp プローブカード

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4692205A (en) * 1986-01-31 1987-09-08 International Business Machines Corporation Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings
JP3219844B2 (ja) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US6258609B1 (en) * 1996-09-30 2001-07-10 Micron Technology, Inc. Method and system for making known good semiconductor dice
US6404212B1 (en) * 1999-02-18 2002-06-11 St Assembly Test Services Pte Ltd Testing of BGA and other CSP packages using probing techniques
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
JP2001056346A (ja) 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
US6407568B1 (en) * 2000-02-10 2002-06-18 International Business Machines Corporation Apparatus for probing ends of pins
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
JP2002122630A (ja) * 2000-10-17 2002-04-26 Ando Electric Co Ltd Ｉｃテスタ調整装置
JP2002168906A (ja) * 2000-11-28 2002-06-14 Ando Electric Co Ltd テストヘッドの接続装置
US6547409B2 (en) * 2001-01-12 2003-04-15 Electroglas, Inc. Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
US6674296B1 (en) * 2002-02-28 2004-01-06 Advanced Micro Devices, Inc. Probe card measurement tool
US20050212546A1 (en) * 2004-03-26 2005-09-29 Mark Lynch Method and apparatus for package testing
CN101223460B (zh) 2005-07-14 2010-05-19 帝人化成株式会社 发泡树脂片材和液晶显示装置
EP1965422A4 (en) 2005-12-22 2012-03-07 Jsr Corp PRINTED CIRCUIT BOARD APPARATUS FOR WAFER INSPECTION, PROBE CARD AND PLATE INSPECTION APPARATUS
TW200729373A (en) * 2006-01-20 2007-08-01 Advanced Semiconductor Eng Test module for wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177318A (ja) * 1991-09-30 1994-06-24 Internatl Business Mach Corp <Ibm> マルチチツプ集積回路パツケージ及びそのシステム
JP2003007784A (ja) * 2001-06-22 2003-01-10 Hitachi Maxell Ltd 半導体検査装置
JP2005302917A (ja) * 2004-04-09 2005-10-27 Renesas Technology Corp 半導体集積回路の製造方法及びプローブカード
WO2006028238A1 (ja) * 2004-09-06 2006-03-16 Nec Corporation テストキャリア
JP2007017363A (ja) * 2005-07-11 2007-01-25 Japan Electronic Materials Corp プローブカード

Also Published As

Publication number Publication date
CN101821634B (zh) 2013-08-14
EP2183603B1 (en) 2012-10-31
KR101365188B1 (ko) 2014-02-21
EP2183603A2 (en) 2010-05-12
WO2009024851A3 (en) 2009-04-30
US7847568B2 (en) 2010-12-07
US20090045827A1 (en) 2009-02-19
WO2009024851A2 (en) 2009-02-26
KR20100055483A (ko) 2010-05-26
CN101821634A (zh) 2010-09-01

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