JP2006332612A5 - - Google Patents

Download PDF

Info

Publication number
JP2006332612A5
JP2006332612A5 JP2006115406A JP2006115406A JP2006332612A5 JP 2006332612 A5 JP2006332612 A5 JP 2006332612A5 JP 2006115406 A JP2006115406 A JP 2006115406A JP 2006115406 A JP2006115406 A JP 2006115406A JP 2006332612 A5 JP2006332612 A5 JP 2006332612A5
Authority
JP
Japan
Prior art keywords
connection
terminal
inspection
crimp
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006115406A
Other languages
English (en)
Japanese (ja)
Other versions
JP4869770B2 (ja
JP2006332612A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006115406A priority Critical patent/JP4869770B2/ja
Priority claimed from JP2006115406A external-priority patent/JP4869770B2/ja
Publication of JP2006332612A publication Critical patent/JP2006332612A/ja
Publication of JP2006332612A5 publication Critical patent/JP2006332612A5/ja
Application granted granted Critical
Publication of JP4869770B2 publication Critical patent/JP4869770B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006115406A 2005-04-28 2006-04-19 検査方法 Expired - Fee Related JP4869770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006115406A JP4869770B2 (ja) 2005-04-28 2006-04-19 検査方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005133494 2005-04-28
JP2005133494 2005-04-28
JP2006115406A JP4869770B2 (ja) 2005-04-28 2006-04-19 検査方法

Publications (3)

Publication Number Publication Date
JP2006332612A JP2006332612A (ja) 2006-12-07
JP2006332612A5 true JP2006332612A5 (enExample) 2009-05-28
JP4869770B2 JP4869770B2 (ja) 2012-02-08

Family

ID=37553924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006115406A Expired - Fee Related JP4869770B2 (ja) 2005-04-28 2006-04-19 検査方法

Country Status (1)

Country Link
JP (1) JP4869770B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102050067B1 (ko) * 2013-02-25 2019-11-29 삼성디스플레이 주식회사 표시 장치
CN103517563B (zh) * 2013-10-16 2016-03-02 镇江华印电路板有限公司 挠性印刷线路板补强钢片粘贴方法
JP7520666B2 (ja) 2020-09-28 2024-07-23 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
CN114200238B (zh) * 2021-12-10 2023-09-01 苏州华星光电技术有限公司 测试装置、测试系统及测试方法
CN119335366B (zh) * 2024-12-19 2025-04-04 国鲸科技(广东横琴粤澳深度合作区)有限公司 一种透明柔性集成电路基板的信号通信检测方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005069945A (ja) * 2003-08-26 2005-03-17 Seiko Epson Corp 半導体装置の検査方法

Similar Documents

Publication Publication Date Title
CN101231322A (zh) 集成电路开路/短路的测试连接方法及装置
CN103219322A (zh) 具有电阻测量结构的三维集成电路及其使用方法
CN103487710B (zh) 电路测试震动装置
JP2010537187A5 (enExample)
US9502378B1 (en) Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same
JP2006332612A5 (enExample)
WO2009031394A1 (ja) 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法
CN104714065A (zh) 探针模块
CN109425810B (zh) 半导体测试装置、半导体测试系统以及半导体测试方法
KR20170046344A (ko) 반도체 장치 및 이를 포함하는 반도체 패키지
CN105388413B (zh) 芯片失效分析仪器
CN105652088A (zh) 外置接口接触阻抗的测试装置
CN102881336B (zh) 用在测试存储器模块的装置
CN204302384U (zh) 外置接口接触阻抗的测试装置
KR102124550B1 (ko) 전기 특성의 검사 방법
US8810252B2 (en) Solder joint inspection
JP2010043868A (ja) 電気検査ジグおよび電気検査装置
KR20140021890A (ko) 도전 검사용 프로브 모듈 및 그 제조방법
JP6259254B2 (ja) 検査装置および検査方法
TW200739095A (en) Method for fabricating connecting jig, and connecting jig
JP2004259750A (ja) 配線基板、接続配線基板及びその検査方法、電子装置及びその製造方法、電子モジュール並びに電子機器
CN201051111Y (zh) 刺穿式探针
CN104332459A (zh) 一种接触孔可靠性测试装置
CN204302320U (zh) 一种测试dut板
CN102386144A (zh) 芯片