JP2010532567A5 - - Google Patents

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Publication number
JP2010532567A5
JP2010532567A5 JP2010514821A JP2010514821A JP2010532567A5 JP 2010532567 A5 JP2010532567 A5 JP 2010532567A5 JP 2010514821 A JP2010514821 A JP 2010514821A JP 2010514821 A JP2010514821 A JP 2010514821A JP 2010532567 A5 JP2010532567 A5 JP 2010532567A5
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JP
Japan
Prior art keywords
layer
conductive
interconnect element
forming
metal
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JP2010514821A
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English (en)
Japanese (ja)
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JP5421254B2 (ja
JP2010532567A (ja
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Priority claimed from US11/824,484 external-priority patent/US7911805B2/en
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Publication of JP2010532567A publication Critical patent/JP2010532567A/ja
Publication of JP2010532567A5 publication Critical patent/JP2010532567A5/ja
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Publication of JP5421254B2 publication Critical patent/JP5421254B2/ja
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JP2010514821A 2007-06-29 2008-06-23 ピン・インタフェースを有する多層配線エレメント Active JP5421254B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/824,484 US7911805B2 (en) 2007-06-29 2007-06-29 Multilayer wiring element having pin interface
US11/824,484 2007-06-29
PCT/US2008/007978 WO2009005696A1 (en) 2007-06-29 2008-06-23 Multilayer wiring element having pin interface

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013238596A Division JP6001524B2 (ja) 2007-06-29 2013-11-19 ピン・インタフェースを有する多層配線エレメント

Publications (3)

Publication Number Publication Date
JP2010532567A JP2010532567A (ja) 2010-10-07
JP2010532567A5 true JP2010532567A5 (cg-RX-API-DMAC7.html) 2011-09-29
JP5421254B2 JP5421254B2 (ja) 2014-02-19

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010514821A Active JP5421254B2 (ja) 2007-06-29 2008-06-23 ピン・インタフェースを有する多層配線エレメント
JP2013238596A Active JP6001524B2 (ja) 2007-06-29 2013-11-19 ピン・インタフェースを有する多層配線エレメント

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013238596A Active JP6001524B2 (ja) 2007-06-29 2013-11-19 ピン・インタフェースを有する多層配線エレメント

Country Status (6)

Country Link
US (1) US7911805B2 (cg-RX-API-DMAC7.html)
EP (1) EP2172089B1 (cg-RX-API-DMAC7.html)
JP (2) JP5421254B2 (cg-RX-API-DMAC7.html)
KR (1) KR101530896B1 (cg-RX-API-DMAC7.html)
CN (1) CN101772995B (cg-RX-API-DMAC7.html)
WO (1) WO2009005696A1 (cg-RX-API-DMAC7.html)

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US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
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US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
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US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
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