JP6001524B2 - ピン・インタフェースを有する多層配線エレメント - Google Patents
ピン・インタフェースを有する多層配線エレメント Download PDFInfo
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- JP6001524B2 JP6001524B2 JP2013238596A JP2013238596A JP6001524B2 JP 6001524 B2 JP6001524 B2 JP 6001524B2 JP 2013238596 A JP2013238596 A JP 2013238596A JP 2013238596 A JP2013238596 A JP 2013238596A JP 6001524 B2 JP6001524 B2 JP 6001524B2
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Description
本願は、2007年6月29日に出願された“MULTILAYER WIRING ELEMENT HAVING PIN
INTERFACE”と題された米国特許出願第11/824,484号の利益を主張するものである。同米国特許出願の内容は、引用することにより本明細書の一部をなすものとする。
本発明は一般に、マイクロエレクトロニクス・デバイスを相互接続し、相互接続エレメント、特に多層配線エレメントをサポートする技術に関する。
基板またはデバイス上に半田ボールを配置し、デバイスを正面を下向きにして基板と並置し、半田を瞬時にリフローさせて接合する。フリップチップ技術は、チップ自体の面積以下の基板面積を占める、コンパクトなアセンブリを実現する。
程とを含む。
接続エレメントの第1の表面に露出した複数の導電性部位を含んでおり、これらの導電性部位を導電性ピンと電気的に相互接続する金属トレース(metal features)とを備える。
法をここに開示する。図1に多層相互接続エレメント10を示す。多層相互接続エレメント10は、誘電体部分12と導電体部分14を有する。導電体部分は、配線、接合パッド、あるいは他の類似物の形態をとることがある。
リソグラフィーパタン形成またはレーザ穴開けが実行されることがある。電気接続路22が形成された後、それらは所望の厚みまで厚みを増すために電気メッキされることがある。この結果、多層相互接続エレメント10とマイクロエレクトロニクス・ピン20との間に電気接続路22が形成される。最後に、アセンブリ50が破損しないように、電気接続路22とマイクロエレクトロニクス・ピン20の下部とをカバーする保護誘電体層または保護誘電膜24(図1E)が、多層相互接続エレメント10上に積層されることがある。この保護層(あるいは保護膜)24は、マイクロエレクトロニクス・ピン20の最上面の共平面性を維持することにも関与することができる。なぜならば、保護誘電体層24はピン20を動かないように固定することに役立つので、保護誘電体層24はアセンブリ50が取り扱われる際のたわみを低減するからである。保護層(あるいは保護膜)の材料としては、例えば半田マスクなどがある。
お、同米国特許および同米国仮特許出願の内容は、引用することにより本明細書の一部をなすものとする。
成を促進することもできる、金などの金属を含む。別の特定の実施形態では、第2の金属層は、スズといった融点が低い金属あるいは半田といった融点が低い合金あるいは共晶混合物を含む。第2の金属層として利用可能な1種類以上の金属の追加的な例としては、ニッケル、アルミニウム、またはニッケル/金を含む。
トロニクス・ピン20の反対側でアセンブリ50に実装されることもある。さらに、本方法および構造は、図7Cに示す様に、フリップチップまたはワイヤボンド・マイクロコンタクトにも有利である。仕上がったアセンブリは回路パネルである場合がある、あるいはチップに接合した回路パネルである場合がある。さらに、仕上がったセンブリは別の回路パネルまたはチップへの相互接続に向いていると考えられる。
12 誘電体部分
14 導電体部分
16 金属層
18 接着剤層
20 マイクロエレクトロニクス・ピン
22 電気接続路(金属トレース)
24 誘電体保護層
26 層状金属構造体
26 層状金属構造体
28 第1の金属層
30 エッチング停止層
32 第2の金属層
40 ピンの最上面
50 アセンブリ
200 導電性ピン
210 連続した金属配線層
220 内部金属層
300 円形ピン
310 直方形ピン
320 楕円形ピン
400 ピン(第1の金属層)
410 第2の金属層
420 エッチング停止層
440 ベース金属層
450 導電性ピン
460 第2の金属層
470 接着剤層
Claims (14)
- 露出したピン・インタフェースを有する多重配線層相互接続エレメントであって、
少なくとも1つの誘電体層で分離された多重配線層を有する相互接続エレメントであり、該多重配線層は前記相互接続エレメントの第1の表面に露出した複数の導電性部位を含み、少なくとも1つの前記誘電体層または前記多重配線層に接続した1つ以上の別の導電性部位が、前記第1の表面から離れた前記相互接続エレメントの第2の表面に露出しているものである、相互接続エレメントと、
それぞれが下部を有しており、前記相互接続エレメントの第1の表面から離れる方向に前記第1の表面より高い高さまで突出する、実質的に固体である複数の導電性ピンであって、該導電性ピンの先端部に形成された金属の融点よりも実質的に融点が高い金属により形成された、複数の導電性ピンと、
前記誘電体層を覆い、前記相互接続エレメントの前記誘電体層と前記複数の導電性ピンの前記下部とを接合している接着剤層であって、前記複数の導電性ピンの間に位置する開口部を含むものである、接着剤層と、
前記複数の導電性ピンの前記下部から前記開口部へと延在し、前記複数の導電性部位を前記複数の導電性ピンと電気的に相互接続する金属トレースと
を備えてなる、多重配線層相互接続エレメント。 - 前記導電性ピンは、外側の金属層と、前記相互接続エレメントに対向する内側の金属層と、前記内側の金属層と前記外側の金属層の間に介在する第3の金属層とを含む層状金属構造体から形成されるものである請求項1に記載の多重配線層相互接続エレメント。
- 前記導電性ピンは前記外側の金属層から形成されるものである請求項2に記載の多重配線層相互接続エレメント。
- 前記金属トレースは、前記導電性部位を前記内側の金属層のいくつかの部分と相互接続するものである請求項2に記載の多重配線層相互接続エレメント。
- 請求項1に記載された多重配線層相互接続エレメントを含むアセンブリであって、
前記導電性ピンと並んで配置されて接続されたコンタクトを有するマイクロエレクトロニクス素子を更に含む、アセンブリ。 - 請求項1に記載された多重配線層相互接続エレメントを含むアセンブリであって、前記相互接続エレメントの前記別の導電性部位と相互接続されたコンタクトを有するマイクロエレクトロニクス素子を更に含むものである、アセンブリ。
- 前記別の導電性部位は前記導電性ピンから遠隔にある前記第2の表面にある請求項6に記載のアセンブリ。
- 多層基板であって、該多層基板は少なくとも1つの誘電体層によって分離された多層配線層を有し、該多層配線層は、前記多層基板の第1の表面に露出した複数の導電性パッドを含み、少なくとも1つの誘電体層または前記多層配線層に接続した1つ以上の別の導電性パッドは、前記第1の表面から離れた前記多層基板の第2の表面に露出している、多層基板と、
それぞれが下部を有しており、第1の表面から離れる方向に前記第1の表面より高い高さまで突出する、実質的に固体である複数の導電性ポストであって、該導電性ポストの先端部に形成された金属の融点よりも実質的に融点が高い金属により形成された、複数の導電性ポストと、
前記誘電体層を覆い、前記多層基板と前記複数のポストとの間に配置され、前記多層基板の前記誘電体層と前記複数の導電性ピンの前記下部とを接合している接合層であって、第1および第2の表面と、該第1の表面および該第2の表面の間に延在する開口部とを有しており、該開口部は、前記複数の導電性ピンのそれぞれの間に配置されている、接合層とを備え、
前記接合層は、前記開口部の内部に形成され、第1および第2の表面と、前記第1および第2の表面の間に延在する複数の金属化ビアとを有し、前記複数の金属化ビアは、前記複数の導電性ポストの前記下部から前記開口部へと延在し、前記複数のポストを前記多層基板上の前記複数の導電性パッドに電気的に結合するように、前記複数の導電性ポストのそれぞれの間に配置されている、相互接続エレメント。 - 前記複数のポストは、外側の金属層と、前記接合層に対向する内側の金属層と、前記内側の金属層と前記外側の金属層の間に介在する第3の金属層とを含む層状金属構造体から形成される、請求項8に記載の相互接続エレメント。
- 前記複数のポストは前記外側の金属層から形成される請求項9に記載の相互接続エレメント。
- 請求項8に記載された相互接続エレメントを含むアセンブリであって、前記複数のポストと相互接続されたコンタクトを有するマイクロエレクトロニクス素子を更に含む、アセンブリ。
- 請求項8に記載された相互接続エレメントを含むアセンブリであって、前記多層基板の第2の表面に露出した、前記多層基板の前記別の導電性パッドと相互接続されたコンタクトを有するマイクロエレクトロニクス素子を更に含む、アセンブリ。
- 前記別の導電性パッドは、前記接合層に隣接した前記多層基板の第1の表面から遠隔にある前記第2の表面にある、請求項12に記載のアセンブリ。
- 前記接合層は接着剤であることを特徴とする請求項8に記載の相互接続エレメント。
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