JP2010531369A5 - - Google Patents

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Publication number
JP2010531369A5
JP2010531369A5 JP2010513316A JP2010513316A JP2010531369A5 JP 2010531369 A5 JP2010531369 A5 JP 2010531369A5 JP 2010513316 A JP2010513316 A JP 2010513316A JP 2010513316 A JP2010513316 A JP 2010513316A JP 2010531369 A5 JP2010531369 A5 JP 2010531369A5
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JP
Japan
Prior art keywords
mixture
copolymer
organic polymer
formula
group
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JP2010513316A
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English (en)
Japanese (ja)
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JP2010531369A (ja
JP5314012B2 (ja
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Priority claimed from US11/821,568 external-priority patent/US20080318065A1/en
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Publication of JP2010531369A5 publication Critical patent/JP2010531369A5/ja
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Publication of JP5314012B2 publication Critical patent/JP5314012B2/ja
Expired - Fee Related legal-status Critical Current
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JP2010513316A 2007-06-22 2008-06-03 ポリジオルガノシロキサンポリアミド含有成分と有機ポリマーの混合物 Expired - Fee Related JP5314012B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/821,568 2007-06-22
US11/821,568 US20080318065A1 (en) 2007-06-22 2007-06-22 Mixtures of polydiorganosiloxane polyamide-containing components and organic polymers
PCT/US2008/065645 WO2009002668A2 (en) 2007-06-22 2008-06-03 Mixtures of polydiorganosiloxane polyamide-containing components and organic polymers

Publications (3)

Publication Number Publication Date
JP2010531369A JP2010531369A (ja) 2010-09-24
JP2010531369A5 true JP2010531369A5 (enExample) 2011-07-21
JP5314012B2 JP5314012B2 (ja) 2013-10-16

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JP2010513316A Expired - Fee Related JP5314012B2 (ja) 2007-06-22 2008-06-03 ポリジオルガノシロキサンポリアミド含有成分と有機ポリマーの混合物

Country Status (7)

Country Link
US (3) US20080318065A1 (enExample)
EP (1) EP2164901B1 (enExample)
JP (1) JP5314012B2 (enExample)
KR (1) KR101508403B1 (enExample)
CN (1) CN101688045B (enExample)
TW (1) TW200909522A (enExample)
WO (1) WO2009002668A2 (enExample)

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CN111492022B (zh) 2017-12-13 2022-11-08 瓦克化学股份公司 有机硅共聚物、其生产及其在处理纤维基材中的用途
DK3724292T3 (da) 2017-12-14 2024-09-30 Avery Dennison Corp Trykfølsom klæber med bredt dæmpningstemperatur- og frekvensområde
CN111133035B (zh) * 2017-12-19 2022-03-11 瓦克化学股份公司 包含草酰胺基酯基团的硅氧烷的制备方法
US11059264B2 (en) 2018-03-19 2021-07-13 Avery Dennison Corporation Multilayer constrained-layer damping
HUE063771T2 (hu) 2018-05-17 2024-01-28 Avery Dennison Corp Többrétegû csillapító laminátum részleges lefedéssel
CN109054423A (zh) * 2018-08-08 2018-12-21 苏州利波紧固件有限公司 一种微发泡复合高分子材料建筑模板及其制作方法
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JP7434543B2 (ja) * 2019-10-30 2024-02-20 ダウ シリコーンズ コーポレーション 無溶媒ポリオルガノシロキサンペレットならびにその調製および使用のためのプロセス
JP7689523B2 (ja) * 2019-11-25 2025-06-06 スリーエム イノベイティブ プロパティズ カンパニー ポリジオルガノシロキサンポリオキサミドコポリマースキン層を有する中空糸膜並びにその製造及び使用方法
EP4150007B1 (de) * 2020-05-11 2023-11-08 Wacker Chemie AG Farbmittel enthaltende zusammensetzungen, verfahren zu deren herstellung und deren verwendung
KR20230058509A (ko) * 2020-09-08 2023-05-03 와커 헤미 아게 실리콘 공중합체, 이의 제조 및 섬유 기재의 처리를 위한 이의 용도
US12116511B2 (en) 2021-04-09 2024-10-15 Dow Silicones Corporation Process for preparing a solventless polyorganosiloxane pellet and a waterborne dispersion of a silicone pressure sensitive adhesive base
KR102553392B1 (ko) 2021-07-21 2023-07-11 다우 글로벌 테크놀로지스 엘엘씨 실리콘 감압성 접착제 베이스의 수성 분산액, 및 분산액의 제조 및 사용 방법
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