JP2010528134A5 - - Google Patents
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- Publication number
- JP2010528134A5 JP2010528134A5 JP2010508779A JP2010508779A JP2010528134A5 JP 2010528134 A5 JP2010528134 A5 JP 2010528134A5 JP 2010508779 A JP2010508779 A JP 2010508779A JP 2010508779 A JP2010508779 A JP 2010508779A JP 2010528134 A5 JP2010528134 A5 JP 2010528134A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- formaldehyde resin
- silanized
- polyvinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 10
- 230000001070 adhesive effect Effects 0.000 claims 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- -1 vinylsilyl groups Chemical group 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000000197 pyrolysis Methods 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 238000005266 casting Methods 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims 2
- 239000011118 polyvinyl acetate Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 229920001634 Copolyester Polymers 0.000 claims 1
- 229920000877 Melamine resin Polymers 0.000 claims 1
- 229920000459 Nitrile rubber Polymers 0.000 claims 1
- 239000004952 Polyamide Chemical class 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- 229920001807 Urea-formaldehyde Polymers 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims 1
- 230000003712 anti-aging effect Effects 0.000 claims 1
- 229920005601 base polymer Polymers 0.000 claims 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims 1
- 229920005549 butyl rubber Polymers 0.000 claims 1
- 150000001720 carbohydrates Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims 1
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 125000001165 hydrophobic group Chemical group 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 229920001084 poly(chloroprene) Polymers 0.000 claims 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 1
- 229920002492 poly(sulfone) Polymers 0.000 claims 1
- 229920002647 polyamide Chemical class 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 239000005077 polysulfide Substances 0.000 claims 1
- 229920001021 polysulfide Polymers 0.000 claims 1
- 150000008117 polysulfides Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 239000004800 polyvinyl chloride Substances 0.000 claims 1
- 229920001289 polyvinyl ether Polymers 0.000 claims 1
- 229920006395 saturated elastomer Chemical class 0.000 claims 1
- 239000003707 silyl modified polymer Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 229920003048 styrene butadiene rubber Polymers 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 229920001567 vinyl ester resin Polymers 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007024099A DE102007024099A1 (de) | 2007-05-22 | 2007-05-22 | Klebstoffe |
| DE102007024099.8 | 2007-05-22 | ||
| PCT/EP2008/055565 WO2008141929A1 (en) | 2007-05-22 | 2008-05-06 | Adhesives |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010528134A JP2010528134A (ja) | 2010-08-19 |
| JP2010528134A5 true JP2010528134A5 (enExample) | 2011-06-23 |
| JP5523309B2 JP5523309B2 (ja) | 2014-06-18 |
Family
ID=39735107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010508779A Expired - Fee Related JP5523309B2 (ja) | 2007-05-22 | 2008-05-06 | 接着剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8173737B2 (enExample) |
| EP (1) | EP2158282A1 (enExample) |
| JP (1) | JP5523309B2 (enExample) |
| CN (1) | CN101679820B (enExample) |
| DE (1) | DE102007024099A1 (enExample) |
| TW (1) | TWI372170B (enExample) |
| WO (1) | WO2008141929A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6112753B2 (ja) * | 2009-12-28 | 2017-04-12 | 日揮触媒化成株式会社 | 透明被膜形成用塗布液ならびに透明被膜付基材、および疎水性金属酸化物粒子の製造方法 |
| CN101857790A (zh) * | 2010-06-08 | 2010-10-13 | 武汉市科达云石护理材料有限公司 | 一种专用有色石材勾缝胶 |
| US8475925B2 (en) | 2010-06-22 | 2013-07-02 | Pbi Performance Products, Inc. | PBI/epoxy coatings |
| DK2447332T3 (da) * | 2010-10-27 | 2014-04-28 | Kronotec Ag | Hybrid-klæbestof og dets anvendelse på en træbaseret plade |
| CN102477272A (zh) * | 2010-11-23 | 2012-05-30 | 上海恩意材料科技有限公司 | 一种环保型水性耐蒸煮胶黏剂及其制造方法 |
| CN102757755B (zh) * | 2012-07-17 | 2013-12-04 | 湖南高华环保股份有限公司 | 一种耐高温防漏耐腐蚀胶粘剂的制备方法 |
| CN103611580B (zh) * | 2013-09-05 | 2016-04-13 | 金湖飞虹涂装材料有限公司 | 一种高强度纳米粉末涂料的涂覆方法 |
| CN103555239B (zh) * | 2013-11-04 | 2015-05-20 | 南通众诚生物技术有限公司 | 一种高抗磨性能地板胶的制备方法 |
| WO2020256879A1 (en) | 2019-06-18 | 2020-12-24 | Avery Dennison Corporation | Butyl rubber based pressure sensitive adhesives |
| KR102131606B1 (ko) * | 2020-02-19 | 2020-07-08 | 박희대 | 소수성 나노실리카가 배합된 접착수지를 이용한 도트합포 신발 인솔 및 그 제조방법 |
| EP3954743A1 (de) | 2020-08-12 | 2022-02-16 | Evonik Operations GmbH | Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen |
| JP7456957B2 (ja) * | 2021-02-18 | 2024-03-27 | 信越化学工業株式会社 | 表面処理気相法シリカ粒子の製造方法、表面処理気相法シリカ粒子、及び静電荷像現像用トナー外添剤 |
| JP7548845B2 (ja) * | 2021-02-24 | 2024-09-10 | 信越化学工業株式会社 | 表面処理ゾルゲルシリカ粒子の製造方法、表面処理ゾルゲルシリカ粒子、及び静電荷像現像用トナー外添剤 |
| CN119912901A (zh) * | 2025-01-13 | 2025-05-02 | 北京林业大学 | 一种水触发胶黏剂及其制备方法和应用 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1425575A (en) | 1972-04-28 | 1976-02-18 | Raychem Ltd | Adhesive |
| DE2929587C2 (de) * | 1979-07-21 | 1981-08-27 | Degussa Ag, 6000 Frankfurt | Hydrophobe Füllstoff-Mischung, Verfahren zu deren Herstellung und deren Verwendung |
| DE4103602A1 (de) * | 1991-02-07 | 1992-08-13 | Wacker Chemie Gmbh | Verfahren zur kontinuierlichen herstellung von htv-siliconmassen |
| US6193795B1 (en) * | 1993-08-02 | 2001-02-27 | Degussa Corporation | Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use |
| DE4402370A1 (de) | 1994-01-27 | 1995-08-03 | Degussa | Silanisierte Kieselsäuren |
| JP3891265B2 (ja) * | 2001-11-30 | 2007-03-14 | 信越化学工業株式会社 | 疎水性シリカ微粉末及びその製造方法 |
| WO2004005393A1 (en) | 2002-07-02 | 2004-01-15 | Degussa Ag | Liquid duroplastics |
| DE10238369A1 (de) * | 2002-08-22 | 2004-03-04 | Degussa Ag | Mittel als Haftvermittler für gefüllte und peroxidisch zu vernetzende Gummicompounds |
| DE10239425A1 (de) | 2002-08-28 | 2004-03-11 | Degussa Ag | Lackformulierungen |
| DE10239424A1 (de) | 2002-08-28 | 2004-03-11 | Degussa Ag | Kieselsäuren |
| US6830811B2 (en) * | 2002-10-02 | 2004-12-14 | Dow Corning Corporation | Method of preparing hydrophobic partially aggregated colloidal silica |
| US6750273B2 (en) * | 2002-10-02 | 2004-06-15 | Dow Corning Corporation | Filled silicone composition and cured silicone product |
| DE10260323A1 (de) * | 2002-12-20 | 2004-07-08 | Wacker-Chemie Gmbh | Wasserbenetzbare silylierte Metalloxide |
| JP2004331820A (ja) * | 2003-05-08 | 2004-11-25 | Shin Etsu Chem Co Ltd | 移動体用シリコーンゴム接着剤組成物 |
| US20050171266A1 (en) * | 2003-06-10 | 2005-08-04 | Matthijssen Johannes G. | Filled compositions and a method of making |
| DE10330020A1 (de) * | 2003-07-03 | 2005-01-20 | Degussa Ag | Hochgefüllte Silan-Zubereitung |
| DE10356042A1 (de) * | 2003-12-01 | 2005-07-07 | Degussa Ag | Kleb-und Dichtstoffsysteme |
| DE102004005222A1 (de) * | 2004-02-03 | 2005-08-18 | Degussa Ag | Silikonkautschuk |
| DE102004005155A1 (de) | 2004-02-03 | 2005-08-18 | Degussa Ag | Silikonkautschuk-Mischungen |
| DE102004010756A1 (de) * | 2004-03-05 | 2005-09-22 | Degussa Ag | Silanisierte Kieselsäuren |
| WO2005102403A1 (en) * | 2004-04-08 | 2005-11-03 | Dow Corning Corporation | Silicone skin adhesive gels |
| DE102004039212A1 (de) * | 2004-08-12 | 2006-03-02 | Wacker-Chemie Gmbh | Rheologiesteuerung von Pickering-Emulsion durch Elektrolyte |
| JP4419018B2 (ja) * | 2004-10-22 | 2010-02-24 | 株式会社スリーボンド | 嫌気硬化性組成物 |
| JP4741230B2 (ja) * | 2004-12-28 | 2011-08-03 | 東レ・ダウコーニング株式会社 | フィルム状シリコーンゴム接着剤 |
| DE102004063762A1 (de) * | 2004-12-29 | 2006-07-13 | Wacker Chemie Ag | Reaktive Kieselsäuresuspensionen |
| DE102005012409A1 (de) * | 2005-03-17 | 2006-09-21 | Wacker Chemie Ag | Wäßrige Dispersionen teilhydrophober Kieselsäuren |
| EP1736505B1 (en) | 2005-06-25 | 2008-08-27 | Evonik Degussa GmbH | Thermoplastic matrix comprising silanised pyrogenic silica |
| US8038832B2 (en) * | 2005-06-30 | 2011-10-18 | Three Bond Co., Ltd. | Curable composition and sealing method |
| JP4786964B2 (ja) * | 2005-08-16 | 2011-10-05 | 信越化学工業株式会社 | 熱硬化型エポキシ樹脂組成物及びそれを用いた半導体装置 |
| US8501856B2 (en) * | 2007-07-13 | 2013-08-06 | Momentive Performance Materials Inc. | Curable silicon-containing compositions possessing high translucency |
-
2007
- 2007-05-22 DE DE102007024099A patent/DE102007024099A1/de not_active Ceased
-
2008
- 2008-05-06 CN CN2008800167248A patent/CN101679820B/zh not_active Expired - Fee Related
- 2008-05-06 US US12/597,917 patent/US8173737B2/en not_active Expired - Fee Related
- 2008-05-06 EP EP08750105A patent/EP2158282A1/en not_active Withdrawn
- 2008-05-06 WO PCT/EP2008/055565 patent/WO2008141929A1/en not_active Ceased
- 2008-05-06 JP JP2010508779A patent/JP5523309B2/ja not_active Expired - Fee Related
- 2008-05-19 TW TW097118378A patent/TWI372170B/zh not_active IP Right Cessation
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