TWI372170B - Adhesives - Google Patents
AdhesivesInfo
- Publication number
- TWI372170B TWI372170B TW097118378A TW97118378A TWI372170B TW I372170 B TWI372170 B TW I372170B TW 097118378 A TW097118378 A TW 097118378A TW 97118378 A TW97118378 A TW 97118378A TW I372170 B TWI372170 B TW I372170B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesives
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/19—Oil-absorption capacity, e.g. DBP values
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2995—Silane, siloxane or silicone coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007024099A DE102007024099A1 (de) | 2007-05-22 | 2007-05-22 | Klebstoffe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200911937A TW200911937A (en) | 2009-03-16 |
| TWI372170B true TWI372170B (en) | 2012-09-11 |
Family
ID=39735107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097118378A TWI372170B (en) | 2007-05-22 | 2008-05-19 | Adhesives |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8173737B2 (enExample) |
| EP (1) | EP2158282A1 (enExample) |
| JP (1) | JP5523309B2 (enExample) |
| CN (1) | CN101679820B (enExample) |
| DE (1) | DE102007024099A1 (enExample) |
| TW (1) | TWI372170B (enExample) |
| WO (1) | WO2008141929A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6112753B2 (ja) * | 2009-12-28 | 2017-04-12 | 日揮触媒化成株式会社 | 透明被膜形成用塗布液ならびに透明被膜付基材、および疎水性金属酸化物粒子の製造方法 |
| CN101857790A (zh) * | 2010-06-08 | 2010-10-13 | 武汉市科达云石护理材料有限公司 | 一种专用有色石材勾缝胶 |
| US8475925B2 (en) | 2010-06-22 | 2013-07-02 | Pbi Performance Products, Inc. | PBI/epoxy coatings |
| DK2447332T3 (da) * | 2010-10-27 | 2014-04-28 | Kronotec Ag | Hybrid-klæbestof og dets anvendelse på en træbaseret plade |
| CN102477272A (zh) * | 2010-11-23 | 2012-05-30 | 上海恩意材料科技有限公司 | 一种环保型水性耐蒸煮胶黏剂及其制造方法 |
| CN102757755B (zh) * | 2012-07-17 | 2013-12-04 | 湖南高华环保股份有限公司 | 一种耐高温防漏耐腐蚀胶粘剂的制备方法 |
| CN103611580B (zh) * | 2013-09-05 | 2016-04-13 | 金湖飞虹涂装材料有限公司 | 一种高强度纳米粉末涂料的涂覆方法 |
| CN103555239B (zh) * | 2013-11-04 | 2015-05-20 | 南通众诚生物技术有限公司 | 一种高抗磨性能地板胶的制备方法 |
| WO2020256879A1 (en) | 2019-06-18 | 2020-12-24 | Avery Dennison Corporation | Butyl rubber based pressure sensitive adhesives |
| KR102131606B1 (ko) * | 2020-02-19 | 2020-07-08 | 박희대 | 소수성 나노실리카가 배합된 접착수지를 이용한 도트합포 신발 인솔 및 그 제조방법 |
| EP3954743A1 (de) | 2020-08-12 | 2022-02-16 | Evonik Operations GmbH | Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen |
| JP7456957B2 (ja) * | 2021-02-18 | 2024-03-27 | 信越化学工業株式会社 | 表面処理気相法シリカ粒子の製造方法、表面処理気相法シリカ粒子、及び静電荷像現像用トナー外添剤 |
| JP7548845B2 (ja) * | 2021-02-24 | 2024-09-10 | 信越化学工業株式会社 | 表面処理ゾルゲルシリカ粒子の製造方法、表面処理ゾルゲルシリカ粒子、及び静電荷像現像用トナー外添剤 |
| CN119912901A (zh) * | 2025-01-13 | 2025-05-02 | 北京林业大学 | 一种水触发胶黏剂及其制备方法和应用 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1425575A (en) | 1972-04-28 | 1976-02-18 | Raychem Ltd | Adhesive |
| DE2929587C2 (de) * | 1979-07-21 | 1981-08-27 | Degussa Ag, 6000 Frankfurt | Hydrophobe Füllstoff-Mischung, Verfahren zu deren Herstellung und deren Verwendung |
| DE4103602A1 (de) * | 1991-02-07 | 1992-08-13 | Wacker Chemie Gmbh | Verfahren zur kontinuierlichen herstellung von htv-siliconmassen |
| US6193795B1 (en) * | 1993-08-02 | 2001-02-27 | Degussa Corporation | Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use |
| DE4402370A1 (de) | 1994-01-27 | 1995-08-03 | Degussa | Silanisierte Kieselsäuren |
| JP3891265B2 (ja) * | 2001-11-30 | 2007-03-14 | 信越化学工業株式会社 | 疎水性シリカ微粉末及びその製造方法 |
| WO2004005393A1 (en) | 2002-07-02 | 2004-01-15 | Degussa Ag | Liquid duroplastics |
| DE10238369A1 (de) * | 2002-08-22 | 2004-03-04 | Degussa Ag | Mittel als Haftvermittler für gefüllte und peroxidisch zu vernetzende Gummicompounds |
| DE10239425A1 (de) | 2002-08-28 | 2004-03-11 | Degussa Ag | Lackformulierungen |
| DE10239424A1 (de) | 2002-08-28 | 2004-03-11 | Degussa Ag | Kieselsäuren |
| US6830811B2 (en) * | 2002-10-02 | 2004-12-14 | Dow Corning Corporation | Method of preparing hydrophobic partially aggregated colloidal silica |
| US6750273B2 (en) * | 2002-10-02 | 2004-06-15 | Dow Corning Corporation | Filled silicone composition and cured silicone product |
| DE10260323A1 (de) * | 2002-12-20 | 2004-07-08 | Wacker-Chemie Gmbh | Wasserbenetzbare silylierte Metalloxide |
| JP2004331820A (ja) * | 2003-05-08 | 2004-11-25 | Shin Etsu Chem Co Ltd | 移動体用シリコーンゴム接着剤組成物 |
| US20050171266A1 (en) * | 2003-06-10 | 2005-08-04 | Matthijssen Johannes G. | Filled compositions and a method of making |
| DE10330020A1 (de) * | 2003-07-03 | 2005-01-20 | Degussa Ag | Hochgefüllte Silan-Zubereitung |
| DE10356042A1 (de) * | 2003-12-01 | 2005-07-07 | Degussa Ag | Kleb-und Dichtstoffsysteme |
| DE102004005222A1 (de) * | 2004-02-03 | 2005-08-18 | Degussa Ag | Silikonkautschuk |
| DE102004005155A1 (de) | 2004-02-03 | 2005-08-18 | Degussa Ag | Silikonkautschuk-Mischungen |
| DE102004010756A1 (de) * | 2004-03-05 | 2005-09-22 | Degussa Ag | Silanisierte Kieselsäuren |
| WO2005102403A1 (en) * | 2004-04-08 | 2005-11-03 | Dow Corning Corporation | Silicone skin adhesive gels |
| DE102004039212A1 (de) * | 2004-08-12 | 2006-03-02 | Wacker-Chemie Gmbh | Rheologiesteuerung von Pickering-Emulsion durch Elektrolyte |
| JP4419018B2 (ja) * | 2004-10-22 | 2010-02-24 | 株式会社スリーボンド | 嫌気硬化性組成物 |
| JP4741230B2 (ja) * | 2004-12-28 | 2011-08-03 | 東レ・ダウコーニング株式会社 | フィルム状シリコーンゴム接着剤 |
| DE102004063762A1 (de) * | 2004-12-29 | 2006-07-13 | Wacker Chemie Ag | Reaktive Kieselsäuresuspensionen |
| DE102005012409A1 (de) * | 2005-03-17 | 2006-09-21 | Wacker Chemie Ag | Wäßrige Dispersionen teilhydrophober Kieselsäuren |
| EP1736505B1 (en) | 2005-06-25 | 2008-08-27 | Evonik Degussa GmbH | Thermoplastic matrix comprising silanised pyrogenic silica |
| US8038832B2 (en) * | 2005-06-30 | 2011-10-18 | Three Bond Co., Ltd. | Curable composition and sealing method |
| JP4786964B2 (ja) * | 2005-08-16 | 2011-10-05 | 信越化学工業株式会社 | 熱硬化型エポキシ樹脂組成物及びそれを用いた半導体装置 |
| US8501856B2 (en) * | 2007-07-13 | 2013-08-06 | Momentive Performance Materials Inc. | Curable silicon-containing compositions possessing high translucency |
-
2007
- 2007-05-22 DE DE102007024099A patent/DE102007024099A1/de not_active Ceased
-
2008
- 2008-05-06 CN CN2008800167248A patent/CN101679820B/zh not_active Expired - Fee Related
- 2008-05-06 US US12/597,917 patent/US8173737B2/en not_active Expired - Fee Related
- 2008-05-06 EP EP08750105A patent/EP2158282A1/en not_active Withdrawn
- 2008-05-06 WO PCT/EP2008/055565 patent/WO2008141929A1/en not_active Ceased
- 2008-05-06 JP JP2010508779A patent/JP5523309B2/ja not_active Expired - Fee Related
- 2008-05-19 TW TW097118378A patent/TWI372170B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5523309B2 (ja) | 2014-06-18 |
| TW200911937A (en) | 2009-03-16 |
| DE102007024099A1 (de) | 2008-11-27 |
| JP2010528134A (ja) | 2010-08-19 |
| EP2158282A1 (en) | 2010-03-03 |
| US20100137485A1 (en) | 2010-06-03 |
| CN101679820B (zh) | 2013-10-16 |
| WO2008141929A1 (en) | 2008-11-27 |
| CN101679820A (zh) | 2010-03-24 |
| US8173737B2 (en) | 2012-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |