JP2010525365A - 試験ソケット内で破損ピンを検出するための方法および装置 - Google Patents
試験ソケット内で破損ピンを検出するための方法および装置 Download PDFInfo
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- JP2010525365A JP2010525365A JP2010506217A JP2010506217A JP2010525365A JP 2010525365 A JP2010525365 A JP 2010525365A JP 2010506217 A JP2010506217 A JP 2010506217A JP 2010506217 A JP2010506217 A JP 2010506217A JP 2010525365 A JP2010525365 A JP 2010525365A
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- 238000012360 testing method Methods 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000011990 functional testing Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
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- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
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- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (10)
- 走査データを生成するために、試験対象デバイス(170)の抜去後に試験ソケット(120)を走査するステップと、
前記走査データを基準データと比較するステップと、
前記比較に基づいて前記試験ソケット(120)内にピン(210)の少なくとも一部が存在することを検出するステップと、を有する方法。 - 前記試験ソケット(120)を走査するステップは、前記試験ソケット(120)を光学的に走査するステップを更に有し、前記基準データは光学的しきい値を含む請求項1に記載の方法。
- 前記試験ソケット(120)を走査するステップは、前記試験ソケット(120)の画像(400)をキャプチャするステップを更に有し、前記基準データは基準画像(410)を含む請求項1に記載の方法。
- 前記試験ソケット(120)を走査するステップは、前記試験ソケット(120)を電気的に走査するステップを更に有し、前記基準データは電気的しきい値を含む請求項1に記載の方法。
- 試験対象デバイス(170)を受容するように動作可能な試験ソケット(120)と、
走査データを生成するために、試験対象デバイス(170)の抜去後に、前記試験ソケット(120)を走査するように動作可能な走査装置(140)と、
前記走査データを基準データと比較し、前記比較に基づいて前記試験ソケット(120)内にピン(210)の少なくとも一部が存在することを検出するように動作可能な制御ユニット(150)と、を有する試験システム(100)。 - 前記走査装置(140)は光学式走査装置を有し、前記基準データは光学的しきい値を含む請求項5に記載のシステム(100)。
- 前記走査装置(140)は、前記試験ソケット(120)の画像(400)を前記走査データとしてキャプチャするように動作可能であり、前記基準データは前記試験ソケット(120)の基準画像(410)を含む請求項5に記載のシステム(100)。
- 前記走査装置(140)は、前記試験ソケット(120)を電気的に走査するように動作可能であり、前記基準データは光学的しきい値を含む請求項5に記載のシステム(100)。
- 前記試験ソケット(120)は、
試験対象デバイス(170)のピンを受容するための開口と、
前記開口に配置された少なくとも第1のコンタクトと、
前記開口に配置された少なくとも第2のコンタクトとを有し、
前記走査装置は、前記第1のコンタクトと前記第2のコンタクトとの間に導通が存在するかどうかを判定するように動作可能であり、前記走査データは、前記開口のそれぞれの導通の結果を含む請求項5に記載のシステム(100)。 - 前記試験ソケット(120)は、
試験対象デバイス(170)のピンを受容するための開口(200)と、
前記開口に配置された少なくとも第1のコンタクト(600,610)と、
前記開口に配置された少なくとも第2のコンタクト(610,620)と、
前記走査装置(140)は、前記第1のコンタクト(600,610)に信号を注入し、前記第2のコンタクト(610,620)における応答を測定するように動作可能であり、前記走査データは、前記開口(200)のそれぞれの応答結果を含む請求項5に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/738,541 US20080258704A1 (en) | 2007-04-23 | 2007-04-23 | Method and apparatus for identifying broken pins in a test socket |
PCT/US2008/004961 WO2008133833A1 (en) | 2007-04-23 | 2008-04-17 | Method and apparatus for identifying broken pins in a test socket |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010525365A true JP2010525365A (ja) | 2010-07-22 |
Family
ID=39591414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010506217A Pending JP2010525365A (ja) | 2007-04-23 | 2008-04-17 | 試験ソケット内で破損ピンを検出するための方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20080258704A1 (ja) |
JP (1) | JP2010525365A (ja) |
KR (1) | KR20100036222A (ja) |
CN (1) | CN101861524A (ja) |
DE (1) | DE112008001088T5 (ja) |
GB (1) | GB2461454A (ja) |
TW (1) | TW200903009A (ja) |
WO (1) | WO2008133833A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2973935A1 (fr) * | 2011-04-11 | 2012-10-12 | St Microelectronics Rousset | Procede pour evaluer un processus de decoupe de wafer semi-conducteur |
TWI443346B (zh) * | 2012-09-14 | 2014-07-01 | Chunghwa Telecom Co Ltd | 電器設備識別系統及方法 |
US9251346B2 (en) * | 2013-02-27 | 2016-02-02 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Preventing propagation of hardware viruses in a computing system |
TWI497062B (zh) * | 2013-12-05 | 2015-08-21 | Inventec Corp | 中央處理器腳座的光學檢測系統及其方法 |
US9703623B2 (en) * | 2014-11-11 | 2017-07-11 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Adjusting the use of a chip/socket having a damaged pin |
CN106249001B (zh) * | 2016-05-05 | 2019-06-14 | 苏州能讯高能半导体有限公司 | 一种测试板 |
CN109827970B (zh) * | 2019-02-22 | 2022-06-10 | 英特尔产品(成都)有限公司 | 半导体芯片测试系统和方法 |
US11315652B1 (en) * | 2020-11-19 | 2022-04-26 | Winbond Electronics Corp. | Semiconductor chip burn-in test with mutli-channel |
CN115266743B (zh) * | 2022-05-17 | 2024-02-02 | 江苏汤谷智能科技有限公司 | 一种无损检测下的芯片质量的评估系统及方法 |
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-
2007
- 2007-04-23 US US11/738,541 patent/US20080258704A1/en not_active Abandoned
-
2008
- 2008-04-17 JP JP2010506217A patent/JP2010525365A/ja active Pending
- 2008-04-17 KR KR1020097022856A patent/KR20100036222A/ko not_active Application Discontinuation
- 2008-04-17 DE DE112008001088T patent/DE112008001088T5/de not_active Withdrawn
- 2008-04-17 WO PCT/US2008/004961 patent/WO2008133833A1/en active Application Filing
- 2008-04-17 CN CN200880013102A patent/CN101861524A/zh active Pending
- 2008-04-21 TW TW097114442A patent/TW200903009A/zh unknown
-
2009
- 2009-10-26 GB GB0918661A patent/GB2461454A/en not_active Withdrawn
-
2010
- 2010-11-15 US US12/946,386 patent/US8040140B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101861524A (zh) | 2010-10-13 |
DE112008001088T5 (de) | 2010-03-25 |
GB2461454A (en) | 2010-01-06 |
US8040140B2 (en) | 2011-10-18 |
US20080258704A1 (en) | 2008-10-23 |
US20110057666A1 (en) | 2011-03-10 |
KR20100036222A (ko) | 2010-04-07 |
WO2008133833A1 (en) | 2008-11-06 |
GB0918661D0 (en) | 2009-12-09 |
TW200903009A (en) | 2009-01-16 |
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