JP2010522102A5 - - Google Patents
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- Publication number
- JP2010522102A5 JP2010522102A5 JP2009554625A JP2009554625A JP2010522102A5 JP 2010522102 A5 JP2010522102 A5 JP 2010522102A5 JP 2009554625 A JP2009554625 A JP 2009554625A JP 2009554625 A JP2009554625 A JP 2009554625A JP 2010522102 A5 JP2010522102 A5 JP 2010522102A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- lite
- pattern
- photothermal conversion
- conversion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/689,853 US20080233404A1 (en) | 2007-03-22 | 2007-03-22 | Microreplication tools and patterns using laser induced thermal embossing |
| US11/689,853 | 2007-03-22 | ||
| PCT/US2008/055403 WO2008118610A1 (en) | 2007-03-22 | 2008-02-29 | Microreplication tools and patterns using laser induced thermal embossing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010522102A JP2010522102A (ja) | 2010-07-01 |
| JP2010522102A5 true JP2010522102A5 (enExample) | 2011-03-31 |
| JP5475474B2 JP5475474B2 (ja) | 2014-04-16 |
Family
ID=39775041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009554625A Expired - Fee Related JP5475474B2 (ja) | 2007-03-22 | 2008-02-29 | レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20080233404A1 (enExample) |
| EP (1) | EP2136948A1 (enExample) |
| JP (1) | JP5475474B2 (enExample) |
| KR (1) | KR20090122468A (enExample) |
| TW (1) | TW200900245A (enExample) |
| WO (1) | WO2008118610A1 (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080233404A1 (en) * | 2007-03-22 | 2008-09-25 | 3M Innovative Properties Company | Microreplication tools and patterns using laser induced thermal embossing |
| US8428100B2 (en) * | 2007-10-08 | 2013-04-23 | Honeywell International Inc. | System and methods for securing data transmissions over wireless networks |
| US8394224B2 (en) | 2010-12-21 | 2013-03-12 | International Business Machines Corporation | Method of forming nanostructures |
| KR20130007042A (ko) * | 2011-06-28 | 2013-01-18 | 삼성디스플레이 주식회사 | 열전사용 도너 필름, 이의 제조 방법 및 이를 이용한 유기 발광 소자의 제조 방법 |
| DE102012207231A1 (de) * | 2012-05-02 | 2013-11-07 | Robert Bosch Gmbh | Prägeverfahren und ein mittels des Prägeverfahrens hergestelltes Werkstück |
| US9780335B2 (en) * | 2012-07-20 | 2017-10-03 | 3M Innovative Properties Company | Structured lamination transfer films and methods |
| JP6401162B2 (ja) * | 2012-08-13 | 2018-10-03 | ティ・ジィ・メッドワイズ・リミテッドTg Medwise Ltd. | 物質送達装置 |
| FR2998208B1 (fr) * | 2012-11-16 | 2017-01-06 | Oberthur Technologies | Procede de realisation d'un motif en relief dans une carte plastique mince |
| US20140175707A1 (en) * | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Methods of using nanostructured transfer tape and articles made therefrom |
| US9711744B2 (en) | 2012-12-21 | 2017-07-18 | 3M Innovative Properties Company | Patterned structured transfer tape |
| CN105916674B (zh) * | 2014-01-20 | 2019-04-02 | 3M创新有限公司 | 用于形成凹入结构的叠层转印膜 |
| US20150202834A1 (en) | 2014-01-20 | 2015-07-23 | 3M Innovative Properties Company | Lamination transfer films for forming antireflective structures |
| US9246134B2 (en) * | 2014-01-20 | 2016-01-26 | 3M Innovative Properties Company | Lamination transfer films for forming articles with engineered voids |
| JP2017508641A (ja) | 2014-01-22 | 2017-03-30 | スリーエム イノベイティブ プロパティズ カンパニー | グレイジング用微小光学体 |
| TW201539736A (zh) | 2014-03-19 | 2015-10-16 | 3M Innovative Properties Co | 用於藉白光成色之 oled 裝置的奈米結構 |
| DE102014210798A1 (de) * | 2014-06-05 | 2015-12-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Formwerkzeug, Verfahren zur seiner Herstellung und Verwendung sowie Kunststofffolie und Kunststoffbauteil |
| US9472788B2 (en) | 2014-08-27 | 2016-10-18 | 3M Innovative Properties Company | Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures |
| KR102319347B1 (ko) * | 2014-09-01 | 2021-10-29 | 삼성전자주식회사 | 대면적 마스터 웨이퍼, 대면적 마스터 웨이퍼의 제조 방법 및 대면적 마스터웨이퍼를 이용한 광학 소자 제조 방법 |
| CN107075898B (zh) | 2014-10-20 | 2020-02-18 | 3M创新有限公司 | 包括微结构化漫射体的隔热玻璃窗单元和微光学层以及方法 |
| US10106643B2 (en) | 2015-03-31 | 2018-10-23 | 3M Innovative Properties Company | Dual-cure nanostructure transfer film |
| US10518512B2 (en) | 2015-03-31 | 2019-12-31 | 3M Innovative Properties Company | Method of forming dual-cure nanostructure transfer film |
| US11250303B2 (en) | 2016-09-28 | 2022-02-15 | 3M Innovative Properties Company | Multi-dimensional optical code with static data and dynamic lookup data optical element sets |
| EP3520030B1 (en) | 2016-09-28 | 2023-05-24 | 3M Innovative Properties Company | Hierarchichal optical element sets for machine-read articles |
| EP3520031B1 (en) | 2016-09-28 | 2021-12-08 | 3M Innovative Properties Company | Occlusion-resilient optical codes for machine-read articles |
| US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
| US10847360B2 (en) | 2017-05-25 | 2020-11-24 | Applied Materials, Inc. | High pressure treatment of silicon nitride film |
| US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
| KR102574914B1 (ko) | 2017-06-02 | 2023-09-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 보론 카바이드 하드마스크의 건식 스트리핑 |
| US10234630B2 (en) | 2017-07-12 | 2019-03-19 | Applied Materials, Inc. | Method for creating a high refractive index wave guide |
| KR102405723B1 (ko) | 2017-08-18 | 2022-06-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 및 고온 어닐링 챔버 |
| US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
| CN111095524B (zh) | 2017-09-12 | 2023-10-03 | 应用材料公司 | 用于使用保护阻挡物层制造半导体结构的设备和方法 |
| US10643867B2 (en) | 2017-11-03 | 2020-05-05 | Applied Materials, Inc. | Annealing system and method |
| CN111357090B (zh) | 2017-11-11 | 2024-01-05 | 微材料有限责任公司 | 用于高压处理腔室的气体输送系统 |
| KR102622303B1 (ko) | 2017-11-16 | 2024-01-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 스팀 어닐링 프로세싱 장치 |
| KR20200075892A (ko) | 2017-11-17 | 2020-06-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 처리 시스템을 위한 컨덴서 시스템 |
| CN111699549B (zh) | 2018-01-24 | 2025-03-28 | 应用材料公司 | 使用高压退火的接缝弥合 |
| KR102702244B1 (ko) | 2018-03-09 | 2024-09-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 금속 함유 재료들을 위한 고압 어닐링 프로세스 |
| WO2019191235A1 (en) | 2018-03-27 | 2019-10-03 | 3M Innovative Properties Company | Identifier allocation for optical element sets in machine-read articles |
| US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
| US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
| US10566188B2 (en) | 2018-05-17 | 2020-02-18 | Applied Materials, Inc. | Method to improve film stability |
| US10704141B2 (en) | 2018-06-01 | 2020-07-07 | Applied Materials, Inc. | In-situ CVD and ALD coating of chamber to control metal contamination |
| US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
| US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
| JP7178011B2 (ja) | 2018-10-10 | 2022-11-25 | 東芝インフラシステムズ株式会社 | 記録媒体及び記録装置 |
| WO2020092002A1 (en) | 2018-10-30 | 2020-05-07 | Applied Materials, Inc. | Methods for etching a structure for semiconductor applications |
| CN112996950B (zh) | 2018-11-16 | 2024-04-05 | 应用材料公司 | 使用增强扩散工艺的膜沉积 |
| WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
| US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
| CN114211121A (zh) * | 2021-11-23 | 2022-03-22 | 电子科技大学 | 超疏水表面的飞秒激光烧蚀-表面覆膜的复合加工方法 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3221654A (en) * | 1960-09-22 | 1965-12-07 | Dynamics Corp America | Plastic printing plate and method for manufacture |
| US3632695A (en) * | 1970-03-05 | 1972-01-04 | Reflex Corp Canada Ltd | Making a combined lens and reflector |
| US4054635A (en) * | 1974-09-26 | 1977-10-18 | American Can Company | Copolymer of glycidyl methacrylate and allyl glycidyl ether |
| JPS5936277A (ja) * | 1982-08-23 | 1984-02-28 | Sanyo Electric Co Ltd | 凹凸パタ−ンの消去方法 |
| US4478769A (en) * | 1982-09-30 | 1984-10-23 | Amerace Corporation | Method for forming an embossing tool with an optically precise pattern |
| US5156863A (en) * | 1982-09-30 | 1992-10-20 | Stimsonite Corporation | Continuous embossing belt |
| US4973572A (en) * | 1987-12-21 | 1990-11-27 | Eastman Kodak Company | Infrared absorbing cyanine dyes for dye-donor element used in laser-induced thermal dye transfer |
| US5387496A (en) * | 1993-07-30 | 1995-02-07 | Eastman Kodak Company | Interlayer for laser ablative imaging |
| US6440880B2 (en) * | 1993-10-29 | 2002-08-27 | 3M Innovative Properties Company | Pressure-sensitive adhesives having microstructured surfaces |
| JP3592715B2 (ja) * | 1993-10-29 | 2004-11-24 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 微細構造化面を有する感圧接着剤 |
| US5558740A (en) * | 1995-05-19 | 1996-09-24 | Reflexite Corporation | Method and apparatus for producing seamless retroreflective sheeting |
| US5725989A (en) * | 1996-04-15 | 1998-03-10 | Chang; Jeffrey C. | Laser addressable thermal transfer imaging element with an interlayer |
| US5693446A (en) * | 1996-04-17 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Polarizing mass transfer donor element and method of transferring a polarizing mass transfer layer |
| US5710097A (en) * | 1996-06-27 | 1998-01-20 | Minnesota Mining And Manufacturing Company | Process and materials for imagewise placement of uniform spacers in flat panel displays |
| EP0938028A1 (en) * | 1998-02-24 | 1999-08-25 | Toray Industries, Inc. | A precursor of waterless planographic printing plates |
| US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
| US6228543B1 (en) * | 1999-09-09 | 2001-05-08 | 3M Innovative Properties Company | Thermal transfer with a plasticizer-containing transfer layer |
| JP4590663B2 (ja) * | 1999-10-29 | 2010-12-01 | セイコーエプソン株式会社 | カラーフィルタの製造方法 |
| US6521324B1 (en) * | 1999-11-30 | 2003-02-18 | 3M Innovative Properties Company | Thermal transfer of microstructured layers |
| US6284425B1 (en) * | 1999-12-28 | 2001-09-04 | 3M Innovative Properties | Thermal transfer donor element having a heat management underlayer |
| US6228555B1 (en) * | 1999-12-28 | 2001-05-08 | 3M Innovative Properties Company | Thermal mass transfer donor element |
| US7211214B2 (en) * | 2000-07-18 | 2007-05-01 | Princeton University | Laser assisted direct imprint lithography |
| US20050037143A1 (en) * | 2000-07-18 | 2005-02-17 | Chou Stephen Y. | Imprint lithography with improved monitoring and control and apparatus therefor |
| US6486715B2 (en) * | 2001-04-02 | 2002-11-26 | Sandisk Corporation | System and method for achieving fast switching of analog voltages on large capacitive load |
| US6485884B2 (en) * | 2001-04-27 | 2002-11-26 | 3M Innovative Properties Company | Method for patterning oriented materials for organic electronic displays and devices |
| US7364314B2 (en) * | 2002-05-15 | 2008-04-29 | Reflexite Corporation | Optical structures |
| JP2005005245A (ja) * | 2002-11-08 | 2005-01-06 | Fuji Photo Film Co Ltd | 転写素材の転写方法、形状転写方法及び転写装置 |
| US7374864B2 (en) * | 2003-02-13 | 2008-05-20 | The Regents Of The University Of Michigan | Combined nanoimprinting and photolithography for micro and nano devices fabrication |
| US20040175843A1 (en) * | 2003-03-04 | 2004-09-09 | Roitman Daniel B. | Near-field and far-field encoding and shaping of microbeads for bioassays |
| EP1606834B1 (en) * | 2003-03-27 | 2013-06-05 | Korea Institute Of Machinery & Materials | Uv nanoimprint lithography process using elementwise embossed stamp |
| JP2005064143A (ja) * | 2003-08-08 | 2005-03-10 | Seiko Epson Corp | レジストパターンの形成方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器 |
| US7479318B2 (en) * | 2003-09-08 | 2009-01-20 | E.I. Du Pont De Nemours And Company | Fibrillar microstructure and processes for the production thereof |
| JP4862885B2 (ja) * | 2003-09-17 | 2012-01-25 | 大日本印刷株式会社 | 微細凹凸パターンの形成方法 |
| JP4268910B2 (ja) * | 2003-09-17 | 2009-05-27 | 大日本印刷株式会社 | 微細凹凸パターンの形成方法 |
| MXPA06005650A (es) * | 2003-11-18 | 2006-08-17 | 3M Innovative Properties Co | Metodo para fabricar dispositivo electroluminiscente que incluye filtro de color. |
| US7187995B2 (en) * | 2003-12-31 | 2007-03-06 | 3M Innovative Properties Company | Maximization of yield for web-based articles |
| JP4854383B2 (ja) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | インプリント方法およびナノ・インプリント装置 |
| US7419757B2 (en) * | 2006-10-20 | 2008-09-02 | 3M Innovative Properties Company | Structured thermal transfer donors |
| US7604916B2 (en) * | 2006-11-06 | 2009-10-20 | 3M Innovative Properties Company | Donor films with pattern-directing layers |
| US20080233404A1 (en) * | 2007-03-22 | 2008-09-25 | 3M Innovative Properties Company | Microreplication tools and patterns using laser induced thermal embossing |
-
2007
- 2007-03-22 US US11/689,853 patent/US20080233404A1/en not_active Abandoned
-
2008
- 2008-02-29 KR KR1020097020604A patent/KR20090122468A/ko not_active Ceased
- 2008-02-29 WO PCT/US2008/055403 patent/WO2008118610A1/en not_active Ceased
- 2008-02-29 EP EP20080731046 patent/EP2136948A1/en not_active Withdrawn
- 2008-02-29 JP JP2009554625A patent/JP5475474B2/ja not_active Expired - Fee Related
- 2008-03-21 TW TW97110237A patent/TW200900245A/zh unknown
-
2009
- 2009-08-19 US US12/543,705 patent/US20100006211A1/en not_active Abandoned
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