JP5475474B2 - レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン - Google Patents

レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン Download PDF

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Publication number
JP5475474B2
JP5475474B2 JP2009554625A JP2009554625A JP5475474B2 JP 5475474 B2 JP5475474 B2 JP 5475474B2 JP 2009554625 A JP2009554625 A JP 2009554625A JP 2009554625 A JP2009554625 A JP 2009554625A JP 5475474 B2 JP5475474 B2 JP 5475474B2
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Japan
Prior art keywords
film
lite
tool
pattern
layer
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Expired - Fee Related
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JP2009554625A
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Japanese (ja)
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JP2010522102A (ja
JP2010522102A5 (enExample
Inventor
ビー． ウォルク，マーティン
エイチ． マズレク，ミエチスワフ
ティー． ヒューン，カーン
ピー． ビートゾルード，ジョン
リー，インボ
エー． シャーマン，オードリー
ジェイ． ウィンクラー，ウェンディー
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y10T156/1041—Subsequent to lamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2009554625A 2007-03-22 2008-02-29 レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン Expired - Fee Related JP5475474B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/689,853 US20080233404A1 (en) 2007-03-22 2007-03-22 Microreplication tools and patterns using laser induced thermal embossing
US11/689,853 2007-03-22
PCT/US2008/055403 WO2008118610A1 (en) 2007-03-22 2008-02-29 Microreplication tools and patterns using laser induced thermal embossing

Publications (3)

Publication Number Publication Date
JP2010522102A JP2010522102A (ja) 2010-07-01
JP2010522102A5 JP2010522102A5 (enExample) 2011-03-31
JP5475474B2 true JP5475474B2 (ja) 2014-04-16

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JP2009554625A Expired - Fee Related JP5475474B2 (ja) 2007-03-22 2008-02-29 レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン

Country Status (6)

Country Link
US (2) US20080233404A1 (enExample)
EP (1) EP2136948A1 (enExample)
JP (1) JP5475474B2 (enExample)
KR (1) KR20090122468A (enExample)
TW (1) TW200900245A (enExample)
WO (1) WO2008118610A1 (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080233404A1 (en) * 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US8428100B2 (en) * 2007-10-08 2013-04-23 Honeywell International Inc. System and methods for securing data transmissions over wireless networks
US8394224B2 (en) 2010-12-21 2013-03-12 International Business Machines Corporation Method of forming nanostructures
KR20130007042A (ko) * 2011-06-28 2013-01-18 삼성디스플레이 주식회사 열전사용 도너 필름, 이의 제조 방법 및 이를 이용한 유기 발광 소자의 제조 방법
DE102012207231A1 (de) * 2012-05-02 2013-11-07 Robert Bosch Gmbh Prägeverfahren und ein mittels des Prägeverfahrens hergestelltes Werkstück
US9780335B2 (en) * 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
JP6401162B2 (ja) * 2012-08-13 2018-10-03 ティ・ジィ・メッドワイズ・リミテッドＴｇ Ｍｅｄｗｉｓｅ Ｌｔｄ． 物質送達装置
FR2998208B1 (fr) * 2012-11-16 2017-01-06 Oberthur Technologies Procede de realisation d'un motif en relief dans une carte plastique mince
US20140175707A1 (en) * 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
CN105916674B (zh) * 2014-01-20 2019-04-02 3M创新有限公司 用于形成凹入结构的叠层转印膜
US20150202834A1 (en) 2014-01-20 2015-07-23 3M Innovative Properties Company Lamination transfer films for forming antireflective structures
US9246134B2 (en) * 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
JP2017508641A (ja) 2014-01-22 2017-03-30 スリーエム イノベイティブ プロパティズ カンパニー グレイジング用微小光学体
TW201539736A (zh) 2014-03-19 2015-10-16 3M Innovative Properties Co 用於藉白光成色之 oled 裝置的奈米結構
DE102014210798A1 (de) * 2014-06-05 2015-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Formwerkzeug, Verfahren zur seiner Herstellung und Verwendung sowie Kunststofffolie und Kunststoffbauteil
US9472788B2 (en) 2014-08-27 2016-10-18 3M Innovative Properties Company Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures
KR102319347B1 (ko) * 2014-09-01 2021-10-29 삼성전자주식회사 대면적 마스터 웨이퍼, 대면적 마스터 웨이퍼의 제조 방법 및 대면적 마스터웨이퍼를 이용한 광학 소자 제조 방법
CN107075898B (zh) 2014-10-20 2020-02-18 3M创新有限公司 包括微结构化漫射体的隔热玻璃窗单元和微光学层以及方法
US10106643B2 (en) 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
US10518512B2 (en) 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
US11250303B2 (en) 2016-09-28 2022-02-15 3M Innovative Properties Company Multi-dimensional optical code with static data and dynamic lookup data optical element sets
EP3520030B1 (en) 2016-09-28 2023-05-24 3M Innovative Properties Company Hierarchichal optical element sets for machine-read articles
EP3520031B1 (en) 2016-09-28 2021-12-08 3M Innovative Properties Company Occlusion-resilient optical codes for machine-read articles
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
KR102574914B1 (ko) 2017-06-02 2023-09-04 어플라이드 머티어리얼스, 인코포레이티드 보론 카바이드 하드마스크의 건식 스트리핑
US10234630B2 (en) 2017-07-12 2019-03-19 Applied Materials, Inc. Method for creating a high refractive index wave guide
KR102405723B1 (ko) 2017-08-18 2022-06-07 어플라이드 머티어리얼스, 인코포레이티드 고압 및 고온 어닐링 챔버
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
CN111357090B (zh) 2017-11-11 2024-01-05 微材料有限责任公司 用于高压处理腔室的气体输送系统
KR102622303B1 (ko) 2017-11-16 2024-01-05 어플라이드 머티어리얼스, 인코포레이티드 고압 스팀 어닐링 프로세싱 장치
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
CN111699549B (zh) 2018-01-24 2025-03-28 应用材料公司 使用高压退火的接缝弥合
KR102702244B1 (ko) 2018-03-09 2024-09-03 어플라이드 머티어리얼스, 인코포레이티드 금속 함유 재료들을 위한 고압 어닐링 프로세스
WO2019191235A1 (en) 2018-03-27 2019-10-03 3M Innovative Properties Company Identifier allocation for optical element sets in machine-read articles
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
JP7178011B2 (ja) 2018-10-10 2022-11-25 東芝インフラシステムズ株式会社 記録媒体及び記録装置
WO2020092002A1 (en) 2018-10-30 2020-05-07 Applied Materials, Inc. Methods for etching a structure for semiconductor applications
CN112996950B (zh) 2018-11-16 2024-04-05 应用材料公司 使用增强扩散工艺的膜沉积
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
CN114211121A (zh) * 2021-11-23 2022-03-22 电子科技大学 超疏水表面的飞秒激光烧蚀-表面覆膜的复合加工方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3221654A (en) * 1960-09-22 1965-12-07 Dynamics Corp America Plastic printing plate and method for manufacture
US3632695A (en) * 1970-03-05 1972-01-04 Reflex Corp Canada Ltd Making a combined lens and reflector
US4054635A (en) * 1974-09-26 1977-10-18 American Can Company Copolymer of glycidyl methacrylate and allyl glycidyl ether
JPS5936277A (ja) * 1982-08-23 1984-02-28 Sanyo Electric Co Ltd 凹凸パタ−ンの消去方法
US4478769A (en) * 1982-09-30 1984-10-23 Amerace Corporation Method for forming an embossing tool with an optically precise pattern
US5156863A (en) * 1982-09-30 1992-10-20 Stimsonite Corporation Continuous embossing belt
US4973572A (en) * 1987-12-21 1990-11-27 Eastman Kodak Company Infrared absorbing cyanine dyes for dye-donor element used in laser-induced thermal dye transfer
US5387496A (en) * 1993-07-30 1995-02-07 Eastman Kodak Company Interlayer for laser ablative imaging
US6440880B2 (en) * 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
JP3592715B2 (ja) * 1993-10-29 2004-11-24 ミネソタ マイニング アンド マニュファクチャリング カンパニー 微細構造化面を有する感圧接着剤
US5558740A (en) * 1995-05-19 1996-09-24 Reflexite Corporation Method and apparatus for producing seamless retroreflective sheeting
US5725989A (en) * 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US5693446A (en) * 1996-04-17 1997-12-02 Minnesota Mining And Manufacturing Company Polarizing mass transfer donor element and method of transferring a polarizing mass transfer layer
US5710097A (en) * 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays
EP0938028A1 (en) * 1998-02-24 1999-08-25 Toray Industries, Inc. A precursor of waterless planographic printing plates
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
US6228543B1 (en) * 1999-09-09 2001-05-08 3M Innovative Properties Company Thermal transfer with a plasticizer-containing transfer layer
JP4590663B2 (ja) * 1999-10-29 2010-12-01 セイコーエプソン株式会社 カラーフィルタの製造方法
US6521324B1 (en) * 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
US6284425B1 (en) * 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6228555B1 (en) * 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050037143A1 (en) * 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
US6486715B2 (en) * 2001-04-02 2002-11-26 Sandisk Corporation System and method for achieving fast switching of analog voltages on large capacitive load
US6485884B2 (en) * 2001-04-27 2002-11-26 3M Innovative Properties Company Method for patterning oriented materials for organic electronic displays and devices
US7364314B2 (en) * 2002-05-15 2008-04-29 Reflexite Corporation Optical structures
JP2005005245A (ja) * 2002-11-08 2005-01-06 Fuji Photo Film Co Ltd 転写素材の転写方法、形状転写方法及び転写装置
US7374864B2 (en) * 2003-02-13 2008-05-20 The Regents Of The University Of Michigan Combined nanoimprinting and photolithography for micro and nano devices fabrication
US20040175843A1 (en) * 2003-03-04 2004-09-09 Roitman Daniel B. Near-field and far-field encoding and shaping of microbeads for bioassays
EP1606834B1 (en) * 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
JP2005064143A (ja) * 2003-08-08 2005-03-10 Seiko Epson Corp レジストパターンの形成方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器
US7479318B2 (en) * 2003-09-08 2009-01-20 E.I. Du Pont De Nemours And Company Fibrillar microstructure and processes for the production thereof
JP4862885B2 (ja) * 2003-09-17 2012-01-25 大日本印刷株式会社 微細凹凸パターンの形成方法
JP4268910B2 (ja) * 2003-09-17 2009-05-27 大日本印刷株式会社 微細凹凸パターンの形成方法
MXPA06005650A (es) * 2003-11-18 2006-08-17 3M Innovative Properties Co Metodo para fabricar dispositivo electroluminiscente que incluye filtro de color.
US7187995B2 (en) * 2003-12-31 2007-03-06 3M Innovative Properties Company Maximization of yield for web-based articles
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US7419757B2 (en) * 2006-10-20 2008-09-02 3M Innovative Properties Company Structured thermal transfer donors
US7604916B2 (en) * 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
US20080233404A1 (en) * 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing

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US20080233404A1 (en) 2008-09-25
EP2136948A1 (en) 2009-12-30
US20100006211A1 (en) 2010-01-14
KR20090122468A (ko) 2009-11-30
TW200900245A (en) 2009-01-01

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