Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
  • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
  • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
  • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23B—TURNING; BORING
  • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
  • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
  • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
  • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
  • B29D7/00—Producing flat articles, e.g. films or sheets
  • B29D7/01—Films or sheets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
  • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
  • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
  • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
  • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
  • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
  • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
  • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
  • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
  • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
  • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
  • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
  • B29C2059/023—Microembossing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
  • B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
  • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
  • Y10T156/1041—Subsequent to lamination
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31678—Of metal

Definitions

• the present invention relates to microreplication tools and methods to make them using laser induced thermal embossing (LITE) films and laser induced thermal imaging (LITI) methods.
• LITE laser induced thermal embossing
• LITI laser induced thermal imaging
• microreplication tools are commonly used for extrusion processes, injection molding processes, embossing processes, casting processes, or the like, to create microstructures.
• the articles having microstructured surfaces may comprise optical films, abrasive films, adhesive films, mechanical fasteners having self-mating profiles, or any molded or extruded parts having microreplication features of relatively small dimensions, such as dimensions less than approximately 1000 microns.
• the microstructured features can also be made by various other methods.
• the structure of the master tool can be transferred onto other media, such as to a belt or web of polymeric material, by a cast and cure process from the master tool in order to form a production tool, which is then used to make the microstructures.
• Other methods such as electro forming can be used to copy the master tool.
• Other techniques of making tools include chemical etching, bead blasting, or other stochastic surface modification techniques.
• a LITE film consistent with the present invention, includes a substrate and a light-to-heat conversion layer overlaying the substrate.
• a surface of the LITE film is capable of bearing a microstructured surface selectively embossed thereon.
• a method of fabricating a microreplication tool includes the following steps: providing a LITE film comprising a substrate and a light-to-heat conversion layer overlaying the substrate; laminating the LITE film to a master tool comprising a pattern of microstructures with the light-to-heat conversion layer being in contact with the microstructures; pattern- wise imaging the LITE film to selectively expose the light-to-heat conversion layer; and removing the master tool to produce a microstructured pattern on the LITE film corresponding with the microstructures of the master tool.
• FIG. 1 is a diagram of an exemplary LITE film prior to embossing
• FIGS. 2a-2c are diagrams illustrating a process of embossing a LITE film to produce a microreplication tool, liner, or product such as LITI donor film;
• FIG. 3 is a diagram of an embossed liner and product
• FIG. 4 is a diagram of an embossed product made from the embossed liner;
• FIG. 5a is a perspective diagram of a microreplication tool;
• FIG. 5b is a perspective diagram of a LITE tool made using the microreplication tool shown in FIG. 5a;
• FIG. 6a is a perspective diagram of three different microreplication tools
• FIG. 6b is a perspective diagram of a LITE tool made using the three microreplication tools shown in FIG. 6a;
• FIGS. 7a-7f are diagrams illustrating a process of embossing a LITE film, while using a structure on structure pattern in the film or a corresponding tool, to produce a microreplication tool, liner, or product such as LITI donor film;
• FIGS. 8a-8c are diagrams illustrating a LITI process of imaging an embossed a LITE film having a transfer layer in order to transfer a portion of the transfer layer to a permanent receptor;
• FIG. 9a is a diagram illustrating a process for making a LITE tool using a 90° orientation of laser scanning
• FIG. 9b is an image of a sample LITE tool made using the scanning orientation shown in FIG. 9a;
• FIG. 10a is a diagram illustrating a process for making a LITE tool using a 45° orientation of laser scanning; and FIG. 10b is an image of a sample LITE tool made using the scanning orientation shown in FIG. 10a.
• Embodiments of the present invention include methods to generate complex tools for micro- and nano-replication processes.
• the methods involve combining aspects of precision laser exposure and LITE with conventional microreplication tools such as those made using precision diamond machining, Excimer Laser Machining of Flats (ELMoF), photolithographic patterning, or other techniques.
• LITE can be performed using virtually any microreplication tool surface and a LITE sheet or film having sufficient heat stability. The film is laminated to the microreplication tool and then exposed from the back with a laser. The result is a three dimensional embossed pattern that corresponds with the pattern of the microreplication tool at the laser exposure area.
• LITE can be used to create many different microstructured films.
• LITE can provide for a rapid method to create customizable holographic patterns on film substrates for security applications using a single holographic master (e.g., laminates for drivers licenses or credit cards).
• LITE can also be used to create microstructured films having various other optical properties based upon, for example, their microstructured optical elements.
• LITE offers the ability to combine elements from different MS tooling methods into one LITE tool.
• LITE can also be used to make products from a master tool.
• the LITE film after embossing, can form a microstructured master tool having a microreplicated pattern corresponding with the embossing.
• the LITE film as a master tool can be used to microreplicate a product having the inverse pattern from the tool, for example a protrusion in the master tool corresponds with an indentation in the product.
• the LITE film as a master tool can be used to make a microreplicated mold, which can then be used to make a product having the same microreplicated pattern as the master tool, or to make a more robust (metal) tool, for example by nickel electroforming having the inverse pattern. Electroforming is described in, for example, U.S. Patent Nos. 4,478,769 and 5,156,863, which are incorporated herein by reference.
• the LITE film as a master tool can thus be used to produce positive and negative replicated products of the microreplicated pattern of the master tool.
• microreplication tool means a tool having microstructured features, nanostructured features, or a combination of microstructured and nanostructured features from which the features can be replicated.
• microstructured refers to features of a surface that have at least one dimension (e.g., height, length, width, or diameter), and typically at least two dimensions, of less than one millimeter.
• nanostructured refers to features of a surface that have at least one dimension (e.g., height, length, width, or diameter) of less than one micron.
• FIG. 1 is a diagram of an exemplary LITE film 100.
• Film 100 typically includes a substrate 102 and light-to-heat conversion (LTHC) layer 104.
• LITE is used to emboss the LTHC, creating on the LTHC layer a microstructured or nanostructured pattern or both.
• the film substrate 102 provides support for the layers of the film 100.
• One suitable type of polymer film is a polyester film, for example, PET or polyethylene naphthalate (PEN) films.
• PEN polyethylene naphthalate
• other films with sufficient optical properties can be used, if light is used for heating and embossing.
• the film substrate in at least some instances, is flat so that uniform coatings can be formed.
• the film substrate is also typically selected from materials that remain substantially stable despite heating of any layers in the film (e.g., an LTHC layer).
• a suitable thickness for the film substrate ranges from, for example, 0.025 millimeters (mm) to 0.15 mm, preferably 0.05 mm to 0.1 mm, although thicker or thinner film substrates may be used.
• the LTHC layer 104 typically includes a radiation absorber that absorbs incident radiation (e.g., laser light) and converts at least a portion of the incident radiation into heat to enable embossing of the LTHC layer.
• incident radiation e.g., laser light
• radiation absorbers can be included in one or more other layers of the LITE film in addition to or in place of the LTHC layer.
• the radiation absorber in the LTHC layer (or other layers) absorbs light in the infrared, visible, and/or ultraviolet regions of the electromagnetic spectrum.
• the radiation absorber is typically highly absorptive of the selected imaging radiation, providing an optical density at the wavelength of the imaging radiation in the range of 0.2 to 3, and preferably from 0.5 to 2.
• Suitable radiation absorbing materials can include, for example, dyes (e.g., visible dyes, ultraviolet dyes, infrared dyes, fluorescent dyes, and radiation-polarizing dyes), pigments, metals, metal compounds, metal films, and other suitable absorbing materials.
• dyes e.g., visible dyes, ultraviolet dyes, infrared dyes, fluorescent dyes, and radiation-polarizing dyes
• pigments e.g., titanium oxides, titanium oxides, and metal sulfides.
• a variety of radiation-emitting sources can be used.
• high- powered light sources e.g., xenon flash lamps and lasers
• infrared, visible, and ultraviolet lasers are particularly useful.
• Suitable lasers include, for example, high power (e.g. >100 mW) single mode laser diodes, fiber-coupled laser diodes, and diode-pumped solid state lasers (e.g., Nd:YAG and Nd:YLF).
• Laser exposure dwell times can be in the range from, for example, about 0.1 microsecond to 100 microseconds and laser fluences can be in the range from, for example, about 0.01 J/cm 2 to about 1 J/cm 2 .
• pressure or vacuum may be used to hold the LTHC layer in intimate contact with a microreplication tool.
• a radiation source may then be used to heat the LTHC layer or other layers containing radiation absorbers in an image-wise fashion (e.g., digitally or by analog exposure through a mask) to emboss the LTHC layer.
• a microreplication tool can be used to generate LITE films by irradiating the films, when laminated to the microreplication tool, with an area of a laser exposure.
• the result is an embossed film with a structure corresponding with the microreplication structure of the tool in the areas of laser exposure.
• the process can be repeated with different tools, made from different MS techniques, to provide a single LITE tool with a number of different patterns.
• FIGS. 2a-2c are diagrams illustrating use of LITE to make a microreplication tool using a LITE film.
• making a microreplication tool involves use of a film 200 and microreplication tool 202.
• Film 200 has a substrate 222 and an additional layer 224 such as an LTHC layer, which may correspond with substrate 102 and LTHC layer 104.
• Microreplication tool 202 has microstructures 204. To make the LITE microreplication tool, as illustrated in FIG.
• film 200 is laminated to tool 202 with microstructures 204 in contact with LTHC layer 224, and the film 200 is then imaged against tool 202, while laminated to it, using a laser beam 228 and a thermal imaging process such as that described in the present specification.
• LTHC layer 224 has a microreplication pattern 226 corresponding with the imaged part of the microstructures on tool 202, as illustrated in FIG. 2c.
• the imaged film with the microreplication pattern can subsequently be used, for example, as a reusable tool, or it can be used to make a metal copy or replica of the imaged film.
• FIG. 3 is a diagram of a film construction 250 including an embossed liner and product.
• the embossed liner is composed of a substrate 252 and structured LTHC 254, which may correspond with substrate 102 and LTHC layer 104 and can be embossed using the techniques described above to impart a structure 257 within it.
• the product is composed of a substrate 258 and a material layer 256, which becomes structured upon lamination or application of the embossed liner to it.
• FIG. 4 is a diagram of an embossed product made from the embossed liner.
• the embossed product is composed of substrate 258 and material 256 having a structure 259 imparted from structured LTHC 254 of the liner.
• An example of a structured liner is described in U.S. Patent No. 6,838,150, which is incorporated herein by reference.
• FIG. 5a is a perspective diagram of a microreplication tool 300 having microstructured prisms.
• FIG. 5b is a perspective diagram of a LITE tool 302 made using the microreplication tool 300.
• the microreplication tool 302 comprises a LITE film having a substrate 304 and an additional layer 306 such as an LTHC layer, which may correspond with substrate 102 and LTHC layer 104.
• Tool 302 can be made using the same or a similar process as described with respect to FIGS. 2a-2c.
• LITE tool 302 it is laminated to tool 300 with the microstructured prisms in contact with LTHC layer 306, and it is then imaged against tool 300.
• FIG. 6a is a perspective diagram of three microreplication tools 400, 402, and 404, each having microstructured prisms with a different pitch and height.
• FIG. 6b is a perspective diagram of a LITE tool 406 made using the microreplication tools shown in FIG. 6a.
• microreplication tool 406 comprises a LITE film having a substrate 408 and an additional layer 410 such as an LTHC layer, which may correspond with substrate 102 and LTHC layer 104.
• LITE tool 406 can be made using the same or a similar process as described with respect to FIGS. 2a-2c.
• LITE tool 406 it is sequentially laminated and imaged against tools 400, 402, and 404 with the microstructured prisms in contact with LTHC layer 410 during the imaging.
• layer 410 is embossed with microstructures 412, 414, and 416 corresponding with tools 404, 402, and 400, respectively, and separated by non-imaged portions 418 and 420.
• FIGS. 7a-7c are diagrams illustrating use of LITE to make a microreplication tool having a structure on structure pattern.
• making a structure on structure microreplication tool involves use of a film 500 and microreplication tool 502.
• Film 500 has a substrate 520 and an additional layer 524, such as an LTHC layer, which may correspond with substrate 102 and LTHC layer 104.
• LTHC layer 524 has a nanostructured surface 525, and microreplication tool 502 has microstructures 504.
• film 500 is laminated to tool 502 with microstructures 504 in contact with LTHC layer 524, and the film 500 is then imaged against tool 502, while laminated to it, using a laser beam 521 and a thermal imaging process such as that described in the present specification.
• LTHC layer 524 has a microreplication pattern 528 having a nanostructured surface and corresponding with the imaged part of the microstructures on tool 502, as illustrated in FIG. 7c.
• FIGS. 7d-7f illustrates alternatives to the structure on structure patterns.
• FIG. 7d-7f illustrates alternatives to the structure on structure patterns.
• FIG. 7d is a diagram of a LITE film 500 embossed against tool 502 where certain nanostructures are removed in areas 530 during the embossing process as described with respect to FIG. 7b.
• a laser beam 521 of sufficient energy can be used to cause destruction of the nanostructured features in areas 530 imaged against tool 502.
• a tool 532 has a structure on structure pattern including microstructured features 536 and nanostructured features 534 between or among the microstructured features.
• FIG. 7f is a diagram illustrating a LITE film, including a substrate 538 and an additional layer 540 such as an LTHC, embossed using tool 532 and the embossing process as described above. After embossing against tool 532, the LITE film has nanostructured features 542 on microstructured features separated by spaces 544 corresponding with microstructured features 536 on tool 532.
• FIGS. 8a-8c are diagrams illustrating a LITI process of imaging an embossed LITE film 600 having a transfer layer 606 in order to transfer a portion of the transfer layer to a receptor 608.
• LITE film 600 is composed of an embossed LITE film coated with a transfer layer.
• the LITE film is composed of a substrate 602 and an LTHC layer 604 having structure 605 made using a process of imaging it against a microreplication tool as described above.
• a transfer layer 606 is applied to structured LTHC layer 604.
• the LITE film is held in intimate contact with the receptor with the transfer layer held against receptor 608, and a laser beam 610 irradiates the LITE film causing transfer of a portion of the transfer layer 606 to receptor 608.
• a transferred portion 612 of transfer layer 606 remains on receptor 608, and the transferred portion 612 has a structure 614 as imparted by structure 605 in LTHC 604 of the LITE film.
• Film 600 can have an optional interlayer between LTHC layer 606 and embossing layer 608.
• the optional interlayer may be used in the thermal donor to minimize damage and contamination of the transferred portion of the layer and may also reduce distortion in the transferred portion of the layer.
• the interlayer may also influence the adhesion of the transfer layer to the rest of the thermal transfer donor.
• the interlayer has high thermal resistance.
• the interlayer does not distort or chemically decompose under the imaging conditions, particularly to an extent that renders the transferred image non- functional.
• the interlayer typically remains in contact with the LTHC layer during the transfer process and is not substantially transferred with the transfer layer.
• Suitable interlayers include, for example, polymer films, metal layers (e.g., vapor deposited metal layers), inorganic layers (e.g., sol-gel deposited layers and vapor deposited layers of inorganic oxides (e.g., silica, titania, and other metal oxides)), and organic/inorganic composite layers.
• Organic materials suitable as interlayer materials include both thermoset and thermoplastic materials. Suitable thermoset materials include resins that may be crosslinked by heat, radiation, or chemical treatment including, but not limited to, crosslinked or crosslinkable polyacrylates, polymethacrylates, polyesters, epoxies, and polyurethanes.
• thermoset materials may be coated onto the LTHC layer as, for example, thermoplastic precursors and subsequently crosslinked to form a crosslinked interlayer.
• the interlayer may contain additives, including, for example, photoinitiators, surfactants, pigments, plasticizers, and coating aids.
• the transfer layer 606 typically includes one or more layers for transfer to receptor 608. These one or more layers may be formed using organic, inorganic, organometallic, and other materials.
• Organic materials include, for example, small molecule materials, polymers, oligomers, dendrimers, and hyperbranched materials.
• the thermal transfer layer can include a transfer layer that can be used to form, for example, light emissive elements of a display device, electronic circuitry, resistors, capacitors, diodes, rectifiers, electroluminescent lamps, memory elements, field effect transistors, bipolar transistors, unijunction transistors, metal-oxide semiconductor (MOS) transistors, metal-insulator-semiconductor transistors, charge coupled devices, insulator-metal- insulator stacks, organic conductor-metal-organic conductor stacks, integrated circuits, photodetectors, lasers, lenses, waveguides, gratings, holographic elements, filters for signal processing (e.g., add-drop filters, gain-flattening filters, cut-off filters, and the like), optical filters, mirrors, splitters, couplers, combiners, modulators, sensors (e.g., evanescent sensors, phase modulation sensors, interferometric sensors, and the like), optical cavities, piezoelectric devices, ferroelectric devices, thin
• Permanent receptor 608 for receiving at least a portion of transfer layer 606 may be any item suitable for a particular application including, but not limited to, transparent films, display black matrices, passive and active portions of electronic displays, metals, semiconductors, glass, various papers, and plastics.
• receptor substrates include anodized aluminum and other metals, plastic films (e.g., PET, polypropylene), indium tin oxide coated plastic films, glass, indium tin oxide coated glass, flexible circuitry, circuit boards, silicon or other semiconductors, and a variety of different types of paper (e.g., filled or unfilled, calendered, or coated).
• FIG. 9a is a diagram illustrating a process for making a LITE tool using a 90° orientation of laser scanning
• FIG. 9a is illustrating a process for making a LITE tool using a 90° orientation of laser scanning
• FIG. 9b is an image of a sample LITE tool having microstructures with a 100 micron horizontal pitch and made using the scanning orientation shown in FIG. 9a.
• FIG. 10a is a diagram illustrating a process for making a LITE tool using a 45° orientation of laser scanning
• FIG. 10b is an image of a sample LITE tool having microstructures with a 100 micron diagonal pitch and made using the scanning orientation shown in FIG. 10a.
• These tools can be made using a process of imaging a LITE film against a microreplication tool as described above.
• FIGS. 9a, 9b, 10a, and 10b also illustrate how the registration of the laser scan lines and the tool can be controlled in order to emboss various patterns of features into a LITE film.
• the tool has a high resolution regular array of microstructured features
• the LITE film has no information patterned within it
• the laser pattern has high positional accuracy; in those embodiments, the resulting pattern in the LITE film after embossing includes high positional accuracy with high resolution embossed features, preferably smaller than the laser scan lines.
• Other embodiments may require registration of the laser system with a tool for embossing a LITE film having various configurations of embossed features.
• the LITE film Once the LITE film has been embossed, it can include fiducial marks, or any other type of registration marks, for subsequently aligning the laser system with the LITE film according to the embossed pattern.
• fiducial marks or any other type of registration marks
• LITE Film 1 comprising two coated layers on PET film was prepared in the following manner.
• An LTHC was applied on 2.88 mil thick PET film substrate (M7Q film, DuPont Teijin Films, Hopewell Virginia) by coating LTHC-I (Table 1) using a reverse microgravure coater (Yasui Seiki CAG- 150).
• the coating was dried in-line and photocured under ultraviolet radiation in order to achieve an LTHC dry thickness of approximately 2.7 microns.
• the cured coating had an optical density of approximately 1.18 at 1064 nanometers (nm).
• a clear coat was applied to the LTHC layer by coating CC-I (Table 2) using a reverse microgravure coater (Yasui Seiki CAG- 150). The coating was dried in-line and photocured under ultraviolet radiation in order to achieve a dry clear coat thickness of approximately 1.1 microns.
• LITE Film 2 comprising a single coated layer on PET film was prepared in the following manner.
• An LTHC layer was applied on 2.88 mil thick PET film substrate (M7Q film, DuPont Teijin Films, Hopewell Virginia) by coating LTHC-2 (Table 3) using a reverse microgravure coater (Yasui Seiki CAG-150).
• the coating was dried in-line in order to achieve an LTHC dry thickness of approximately 3.7 microns.
• the dry coating had an optical density of approximately 3.2 at 808 nm.
• the patterned silicon wafer master was fabricated on a standard orientation 4 inch silicon wafer which was coated with Shipley 1813 photoresist (Rohm and Haas Electronic Materials, Newark, Delaware).
• the resist was patterned with small square arrays of 5 micron linear features by way of contact photolithography using a standard I-line mask aligner (Quintel, San Jose, California) and an E-beam written chrome on glass phototool. Standard development techniques for Shipley resists were used, although no final hard bake was performed on the resist.
• the sample was then etched in a reactive ion etch tool equipped with an inductively coupled plasma generator (Oxford Instruments, Eynsham, England).
• the sample was etched for 2 minutes to an approximate etch depth of 0.5 micron using C 4 Fg and O 2 , an RF power of 70 W, an ICP power of 1600 W, and a pressure of 5.5 mTorr.
• the sample was then stripped of the resist using Shipley 1165 resist stripper in a heated ultrasonic photoresist stripper bath, yielding the master tool.
• the master tool was plated with electrolytic nickel to a thickness of approximately 25 mils. Prior to nickel plating, 1000 A of vapor coated nickel was deposited on the surface in order to make the wafers conductive. The nickel plating was performed in two steps consisting of a preplate of 6 hours with a low deposition rate to ensure that a uniform conductive layer of nickel was established, followed by a more rapid deposition to achieve the target thickness value of 25 mils.
• the electro forming yielded the nickel electro form tool with arrays of 5 micron wide linear features having a uniform height of approximately 1.29 microns (as determined by AFM analysis).
• a LITE film was brought into intimate contact with a structured tool. Air between the film and tool was removed with a vacuum chuck assembly, and the film-tool laminate was exposed to laser radiation through the support layer (substrate) of the film.
• the scan velocity was 0.635 m/s
• spot power was 1 W in the image plane
• the dose was 0.85 J/cm 2 .
• the scan velocity was 1.0 m/s
• spot power was 1.3 W
• dose was 1.3 J/cm 2 .
• Atomic force microscopy (AFM) in tapping mode was used to characterize embossed features of LITE film 2 and corresponding features of the nickel electroform and IDF.
• the instrument used for analysis of TMF film and corresponding LITE film 2 was a Digital Instruments Dimension 3100 SPM.
• the instrument used for analysis of nanotool and corresponding LITE film 2 was a Digital Instruments Dimension 5000 SPM.
• the probes used were Olympus OTESP single crystal silicon levers with a force constant of -40N/M.
• the setpoint value was set to 75% of the original free space amplitude (2.0 V).

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• 2007
  • 2007-03-22 US US11/689,853 patent/US20080233404A1/en not_active Abandoned
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