JP2008516823A5 - - Google Patents

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Publication number
JP2008516823A5
JP2008516823A5 JP2007538094A JP2007538094A JP2008516823A5 JP 2008516823 A5 JP2008516823 A5 JP 2008516823A5 JP 2007538094 A JP2007538094 A JP 2007538094A JP 2007538094 A JP2007538094 A JP 2007538094A JP 2008516823 A5 JP2008516823 A5 JP 2008516823A5
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JP
Japan
Prior art keywords
light
layer
support layer
heat conversion
stretching process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007538094A
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English (en)
Japanese (ja)
Other versions
JP2008516823A (ja
JP4713592B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/038011 external-priority patent/WO2006045085A1/en
Publication of JP2008516823A publication Critical patent/JP2008516823A/ja
Publication of JP2008516823A5 publication Critical patent/JP2008516823A5/ja
Application granted granted Critical
Publication of JP4713592B2 publication Critical patent/JP4713592B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007538094A 2004-10-20 2005-10-20 熱転写用のドナー要素 Expired - Fee Related JP4713592B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62058304P 2004-10-20 2004-10-20
US60/620,583 2004-10-20
PCT/US2005/038011 WO2006045085A1 (en) 2004-10-20 2005-10-20 Donor element for thermal transfer

Publications (3)

Publication Number Publication Date
JP2008516823A JP2008516823A (ja) 2008-05-22
JP2008516823A5 true JP2008516823A5 (enExample) 2008-12-04
JP4713592B2 JP4713592B2 (ja) 2011-06-29

Family

ID=35827659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538094A Expired - Fee Related JP4713592B2 (ja) 2004-10-20 2005-10-20 熱転写用のドナー要素

Country Status (8)

Country Link
US (1) US7387864B2 (enExample)
EP (1) EP1805034B1 (enExample)
JP (1) JP4713592B2 (enExample)
KR (1) KR20070067725A (enExample)
CN (1) CN100506553C (enExample)
DE (1) DE602005025149D1 (enExample)
TW (1) TWI337582B (enExample)
WO (1) WO2006045085A1 (enExample)

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KR101873037B1 (ko) * 2011-10-27 2018-08-03 엘지디스플레이 주식회사 레이저 열전사기판 및 그 제조방법, 이를 이용한 유기전계발광소자의 제조방법
KR101459131B1 (ko) * 2011-12-30 2014-11-10 제일모직주식회사 열전사 필름
KR101608116B1 (ko) * 2012-12-18 2016-03-31 제일모직주식회사 열전사 필름, 그의 제조방법 및 이로부터 제조된 유기전계발광소자
KR101659115B1 (ko) * 2012-12-27 2016-09-22 제일모직주식회사 열전사 필름 및 이를 사용하여 제조된 유기전계발광소자
KR101582370B1 (ko) * 2012-12-28 2016-01-04 제일모직주식회사 열전사필름 및 이를 이용한 유기전계발광소자
KR102175754B1 (ko) 2013-01-24 2020-11-06 도레이첨단소재 주식회사 레이저 열전사용 투명성 도너필름
KR102107661B1 (ko) 2013-01-30 2020-05-07 도레이첨단소재 주식회사 레이저 열전사용 도너필름
KR20140140190A (ko) 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법
CN105270001A (zh) * 2014-06-24 2016-01-27 金正文 新型热转印膜和贴膜流程
JP5913498B2 (ja) * 2014-09-17 2016-04-27 ユー・ディー・シー アイルランド リミテッド 有機電界発光装置の製造方法及び有機電界発光装置
KR101736043B1 (ko) * 2015-05-28 2017-05-16 김승수 전사 인쇄 방법
US10003023B2 (en) * 2016-04-15 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
CN106926559B (zh) * 2017-03-24 2020-05-26 京东方科技集团股份有限公司 转印基板及其制作方法、oled器件制作方法
KR102095544B1 (ko) 2018-03-09 2020-03-31 도레이첨단소재 주식회사 레이저 열전사 필름
US12311689B2 (en) * 2019-02-26 2025-05-27 Dai Nippon Printing Co., Ltd. Thermal transfer sheet
US11721786B2 (en) * 2019-06-27 2023-08-08 Intel Corporation Micro light-emitting diode displays having color correction films applied thereto
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CN116626997A (zh) * 2023-05-23 2023-08-22 无锡物联网创新中心有限公司 一种高精度数字光刻机
CN119920690B (zh) * 2025-03-27 2025-06-24 北京怀柔实验室 半导体器件的电极制备方法

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