JP2010519733A - 単一照明および多重照明システムおよび方法 - Google Patents

単一照明および多重照明システムおよび方法 Download PDF

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Publication number
JP2010519733A
JP2010519733A JP2009549651A JP2009549651A JP2010519733A JP 2010519733 A JP2010519733 A JP 2010519733A JP 2009549651 A JP2009549651 A JP 2009549651A JP 2009549651 A JP2009549651 A JP 2009549651A JP 2010519733 A JP2010519733 A JP 2010519733A
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Japan
Prior art keywords
circuit board
long wavelength
light
electronic circuit
axis
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Pending
Application number
JP2009549651A
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English (en)
Japanese (ja)
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JP2010519733A5 (enExample
Inventor
ピー． プリンス，デイビッド
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
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Publication of JP2010519733A publication Critical patent/JP2010519733A/ja
Publication of JP2010519733A5 publication Critical patent/JP2010519733A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2009549651A 2007-02-16 2008-01-03 単一照明および多重照明システムおよび方法 Pending JP2010519733A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/707,757 US7710611B2 (en) 2007-02-16 2007-02-16 Single and multi-spectral illumination system and method
PCT/US2008/050068 WO2008100646A2 (en) 2007-02-16 2008-01-03 Single and multi-spectral illumination system and method

Publications (2)

Publication Number Publication Date
JP2010519733A true JP2010519733A (ja) 2010-06-03
JP2010519733A5 JP2010519733A5 (enExample) 2011-02-24

Family

ID=39671890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009549651A Pending JP2010519733A (ja) 2007-02-16 2008-01-03 単一照明および多重照明システムおよび方法

Country Status (8)

Country Link
US (1) US7710611B2 (enExample)
JP (1) JP2010519733A (enExample)
KR (1) KR20090125057A (enExample)
CN (1) CN101606448B (enExample)
DE (1) DE112008000339B4 (enExample)
GB (1) GB2458428B (enExample)
IL (1) IL199930A (enExample)
WO (1) WO2008100646A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014091247A (ja) * 2012-11-02 2014-05-19 Panasonic Corp 半田印刷機及び半田印刷機の半田にじみ検査方法
JP2016512330A (ja) * 2013-03-12 2016-04-25 イリノイ トゥール ワークス インコーポレイティド 色に基づく線形３次元捕捉システム及び方法
JP2021024157A (ja) * 2019-08-01 2021-02-22 株式会社Ｆｕｊｉ マスク印刷機、供給位置案内装置

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置
US8730321B2 (en) * 2007-06-28 2014-05-20 Accuvein, Inc. Automatic alignment of a contrast enhancement system
CN101960253B (zh) * 2008-02-26 2013-05-01 株式会社高永科技 三维形状测量装置及测量方法
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
IT1392991B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento di stampa serigrafica autoregolantesi
DE102009053575B4 (de) 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
EP2380738B1 (de) * 2010-04-22 2014-05-28 Manz AG Drucksieb und Verfahren zur Einstellung der relativen Lage eines Druckmusters und eines Substrats
US8474377B2 (en) * 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
WO2014058460A1 (en) * 2012-10-08 2014-04-17 Dwfritz Automation Inc. Simultaneous-view object insertion systems, apparatuses and methods
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
EP2998728B1 (en) * 2013-05-13 2019-10-30 FUJI Corporation Component mounting machine
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
JP6654805B2 (ja) * 2015-03-12 2020-02-26 日東電工株式会社 配線回路基板の製造方法および検査方法
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
EP3423854A4 (en) 2016-03-04 2020-01-01 Concept Group LLC VACUUM-INSULATED ARTICLES WITH IMPROVEMENT OF REFLECTIVE MATERIAL
JP7202766B2 (ja) 2016-11-15 2023-01-12 コンセプト グループ エルエルシー 微小孔構造の絶縁体によって強化された真空絶縁物品
WO2018093773A1 (en) 2016-11-15 2018-05-24 Reid Aarne H Multiply-insulated assemblies
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
JP6783739B2 (ja) 2017-10-31 2020-11-11 株式会社東芝 検査システムおよび検査方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
TW202400995A (zh) * 2021-12-20 2024-01-01 瑞士瑞士義大利語區應用科技大學 用以獲取適用於底層物體的視覺品質的自動光學檢查的人工視覺系統的物體及表面的三維資訊的裝置，所述物體尤其是電子組裝、電路板等
IT202100031832A1 (it) * 2021-12-20 2023-06-20 Scuola Univ Professionale Della Svizzera Italiana Supsi Apparato di acquisizione di informazioni tridimensionali di oggetti e superfici per un sistema di visione artificiale per l'ispezione ottica automatica della qualità visiva di un oggetto sottostante, in particolare assemblaggi elettronici, schede elettroniche e simili
US11947094B1 (en) * 2023-03-23 2024-04-02 Illinois Tool Works Inc. Dual camera prism assembly for stencil printer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022393A (ja) * 1998-06-30 2000-01-21 Yamaha Motor Co Ltd 認識用照明装置
JP2002543421A (ja) * 1999-05-04 2002-12-17 スピードライン・テクノロジーズ・インコーポレーテッド 基板上の半田ペースト堆積を検査する方法および装置
JP2003142897A (ja) * 2001-11-01 2003-05-16 Matsushita Electric Ind Co Ltd 基板用支持治具、並びに回路基板製造装置及び方法
JP2003172711A (ja) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd 画像処理を利用した検査対象物の表面検査
JP2004529373A (ja) * 2001-06-12 2004-09-24 シーメンス　アクチエンゲゼルシヤフト 光センサ装置
JP2006242719A (ja) * 2005-03-02 2006-09-14 Omron Corp 半田材劣化度判断装置、半田印刷機、半田材劣化度判断方法、半田印刷方法、半田材劣化度判断プログラム、半田印刷プログラムおよびコンピュータ読み取り可能な記録媒体

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34615A (en) 1862-03-04 Improvement in cartridges for fire-arms
US4924304A (en) 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
US5278012A (en) 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
US5058178A (en) 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
US5060063A (en) 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
JP2698213B2 (ja) 1990-11-07 1998-01-19 三菱電機株式会社 回路基板および回路基板の位置認識方式
JPH05223532A (ja) 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
US5157438A (en) 1992-02-04 1992-10-20 Dek Printing Machines Limited Workpiece support and clamping means
GB9323978D0 (en) 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3617547B2 (ja) 1995-02-14 2005-02-09 富士通株式会社 配線パターンを観察する方法および加工装置
US5943089A (en) 1996-08-23 1999-08-24 Speedline Technologies, Inc. Method and apparatus for viewing an object and for viewing a device that acts upon the object
GB2323664A (en) 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
DE19728144C2 (de) 1997-07-02 2001-02-01 Ekra Eduard Kraft Gmbh Verfahren und Vorrichtung zum Erzeugen von Testmustern
US6040895A (en) * 1997-10-08 2000-03-21 Siemens Aktiengesellschaft Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object
US6198529B1 (en) 1999-04-30 2001-03-06 International Business Machines Corporation Automated inspection system for metallic surfaces
US6891967B2 (en) 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
GB2359515B (en) 2000-02-23 2003-12-03 Kistech Ltd Method of printing and printing machine
US7028391B2 (en) 2002-06-19 2006-04-18 Speedline Technologies, Inc. Method and apparatus for supporting a substrate
GB2403003B (en) 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
JP5191089B2 (ja) * 2005-06-30 2013-04-24 Ｃｋｄ株式会社 基板の検査装置
US20070102477A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US7458318B2 (en) 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022393A (ja) * 1998-06-30 2000-01-21 Yamaha Motor Co Ltd 認識用照明装置
JP2002543421A (ja) * 1999-05-04 2002-12-17 スピードライン・テクノロジーズ・インコーポレーテッド 基板上の半田ペースト堆積を検査する方法および装置
JP2004529373A (ja) * 2001-06-12 2004-09-24 シーメンス　アクチエンゲゼルシヤフト 光センサ装置
JP2003172711A (ja) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd 画像処理を利用した検査対象物の表面検査
JP2003142897A (ja) * 2001-11-01 2003-05-16 Matsushita Electric Ind Co Ltd 基板用支持治具、並びに回路基板製造装置及び方法
JP2006242719A (ja) * 2005-03-02 2006-09-14 Omron Corp 半田材劣化度判断装置、半田印刷機、半田材劣化度判断方法、半田印刷方法、半田材劣化度判断プログラム、半田印刷プログラムおよびコンピュータ読み取り可能な記録媒体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014091247A (ja) * 2012-11-02 2014-05-19 Panasonic Corp 半田印刷機及び半田印刷機の半田にじみ検査方法
JP2016512330A (ja) * 2013-03-12 2016-04-25 イリノイ トゥール ワークス インコーポレイティド 色に基づく線形３次元捕捉システム及び方法
JP2021024157A (ja) * 2019-08-01 2021-02-22 株式会社Ｆｕｊｉ マスク印刷機、供給位置案内装置
JP7402634B2 (ja) 2019-08-01 2023-12-21 株式会社Fuji マスク印刷機、供給位置案内装置

Also Published As

Publication number Publication date
CN101606448A (zh) 2009-12-16
KR20090125057A (ko) 2009-12-03
IL199930A (en) 2016-06-30
DE112008000339B4 (de) 2021-08-26
GB0913116D0 (en) 2009-09-02
US7710611B2 (en) 2010-05-04
WO2008100646A3 (en) 2009-01-08
CN101606448B (zh) 2011-12-28
IL199930A0 (en) 2010-04-15
GB2458428A (en) 2009-09-23
GB2458428B (en) 2012-01-18
US20080197170A1 (en) 2008-08-21
WO2008100646A2 (en) 2008-08-21
DE112008000339T5 (de) 2009-11-19

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