KR20090125057A - 단일 및 다중-스펙트럼 조명 시스템 및 방법 - Google Patents

단일 및 다중-스펙트럼 조명 시스템 및 방법 Download PDF

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Publication number
KR20090125057A
KR20090125057A KR1020097016562A KR20097016562A KR20090125057A KR 20090125057 A KR20090125057 A KR 20090125057A KR 1020097016562 A KR1020097016562 A KR 1020097016562A KR 20097016562 A KR20097016562 A KR 20097016562A KR 20090125057 A KR20090125057 A KR 20090125057A
Authority
KR
South Korea
Prior art keywords
light
long wavelength
stencil
circuit board
electronic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097016562A
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English (en)
Korean (ko)
Inventor
데이비드 피. 프린스
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일리노이즈 툴 워크스 인코포레이티드 filed Critical 일리노이즈 툴 워크스 인코포레이티드
Publication of KR20090125057A publication Critical patent/KR20090125057A/ko
Ceased legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/02Manually-operable devices
    • B41F15/06Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8822Dark field detection
    • G01N2021/8825Separate detection of dark field and bright field
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646Soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193Electrical connector or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
KR1020097016562A 2007-02-16 2008-01-03 단일 및 다중-스펙트럼 조명 시스템 및 방법 Ceased KR20090125057A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/707,757 2007-02-16
US11/707,757 US7710611B2 (en) 2007-02-16 2007-02-16 Single and multi-spectral illumination system and method

Publications (1)

Publication Number Publication Date
KR20090125057A true KR20090125057A (ko) 2009-12-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097016562A Ceased KR20090125057A (ko) 2007-02-16 2008-01-03 단일 및 다중-스펙트럼 조명 시스템 및 방법

Country Status (8)

Country Link
US (1) US7710611B2 (enExample)
JP (1) JP2010519733A (enExample)
KR (1) KR20090125057A (enExample)
CN (1) CN101606448B (enExample)
DE (1) DE112008000339B4 (enExample)
GB (1) GB2458428B (enExample)
IL (1) IL199930A (enExample)
WO (1) WO2008100646A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123817A (ko) * 2013-03-12 2015-11-04 일리노이즈 툴 워크스 인코포레이티드 색상 기반 선형 3차원 포착 시스템 및 방법

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置
US8730321B2 (en) * 2007-06-28 2014-05-20 Accuvein, Inc. Automatic alignment of a contrast enhancement system
CN101960253B (zh) * 2008-02-26 2013-05-01 株式会社高永科技 三维形状测量装置及测量方法
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
IT1392991B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento di stampa serigrafica autoregolantesi
DE102009053575B4 (de) 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
EP2380738B1 (de) * 2010-04-22 2014-05-28 Manz AG Drucksieb und Verfahren zur Einstellung der relativen Lage eines Druckmusters und eines Substrats
US8474377B2 (en) * 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
WO2014058460A1 (en) * 2012-10-08 2014-04-17 Dwfritz Automation Inc. Simultaneous-view object insertion systems, apparatuses and methods
JP2014091247A (ja) * 2012-11-02 2014-05-19 Panasonic Corp 半田印刷機及び半田印刷機の半田にじみ検査方法
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
EP2998728B1 (en) * 2013-05-13 2019-10-30 FUJI Corporation Component mounting machine
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
JP6654805B2 (ja) * 2015-03-12 2020-02-26 日東電工株式会社 配線回路基板の製造方法および検査方法
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
EP3423854A4 (en) 2016-03-04 2020-01-01 Concept Group LLC VACUUM-INSULATED ARTICLES WITH IMPROVEMENT OF REFLECTIVE MATERIAL
JP7202766B2 (ja) 2016-11-15 2023-01-12 コンセプト グループ エルエルシー 微小孔構造の絶縁体によって強化された真空絶縁物品
WO2018093773A1 (en) 2016-11-15 2018-05-24 Reid Aarne H Multiply-insulated assemblies
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
JP6783739B2 (ja) 2017-10-31 2020-11-11 株式会社東芝 検査システムおよび検査方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
JP7402634B2 (ja) * 2019-08-01 2023-12-21 株式会社Fuji マスク印刷機、供給位置案内装置
TW202400995A (zh) * 2021-12-20 2024-01-01 瑞士瑞士義大利語區應用科技大學 用以獲取適用於底層物體的視覺品質的自動光學檢查的人工視覺系統的物體及表面的三維資訊的裝置,所述物體尤其是電子組裝、電路板等
IT202100031832A1 (it) * 2021-12-20 2023-06-20 Scuola Univ Professionale Della Svizzera Italiana Supsi Apparato di acquisizione di informazioni tridimensionali di oggetti e superfici per un sistema di visione artificiale per l'ispezione ottica automatica della qualità visiva di un oggetto sottostante, in particolare assemblaggi elettronici, schede elettroniche e simili
US11947094B1 (en) * 2023-03-23 2024-04-02 Illinois Tool Works Inc. Dual camera prism assembly for stencil printer

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34615A (en) 1862-03-04 Improvement in cartridges for fire-arms
US4924304A (en) 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
US5278012A (en) 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
US5058178A (en) 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
US5060063A (en) 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
JP2698213B2 (ja) 1990-11-07 1998-01-19 三菱電機株式会社 回路基板および回路基板の位置認識方式
JPH05223532A (ja) 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
US5157438A (en) 1992-02-04 1992-10-20 Dek Printing Machines Limited Workpiece support and clamping means
GB9323978D0 (en) 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3617547B2 (ja) 1995-02-14 2005-02-09 富士通株式会社 配線パターンを観察する方法および加工装置
US5943089A (en) 1996-08-23 1999-08-24 Speedline Technologies, Inc. Method and apparatus for viewing an object and for viewing a device that acts upon the object
GB2323664A (en) 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
DE19728144C2 (de) 1997-07-02 2001-02-01 Ekra Eduard Kraft Gmbh Verfahren und Vorrichtung zum Erzeugen von Testmustern
US6040895A (en) * 1997-10-08 2000-03-21 Siemens Aktiengesellschaft Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object
JP2000022393A (ja) 1998-06-30 2000-01-21 Yamaha Motor Co Ltd 認識用照明装置
US6198529B1 (en) 1999-04-30 2001-03-06 International Business Machines Corporation Automated inspection system for metallic surfaces
US6891967B2 (en) 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6738505B1 (en) * 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
GB2359515B (en) 2000-02-23 2003-12-03 Kistech Ltd Method of printing and printing machine
DE10128476C2 (de) * 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
JP2003172711A (ja) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd 画像処理を利用した検査対象物の表面検査
JP3981259B2 (ja) * 2001-11-01 2007-09-26 松下電器産業株式会社 基板用支持治具
US7028391B2 (en) 2002-06-19 2006-04-18 Speedline Technologies, Inc. Method and apparatus for supporting a substrate
GB2403003B (en) 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
JP2006242719A (ja) * 2005-03-02 2006-09-14 Omron Corp 半田材劣化度判断装置、半田印刷機、半田材劣化度判断方法、半田印刷方法、半田材劣化度判断プログラム、半田印刷プログラムおよびコンピュータ読み取り可能な記録媒体
JP5191089B2 (ja) * 2005-06-30 2013-04-24 Ckd株式会社 基板の検査装置
US20070102477A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US7458318B2 (en) 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123817A (ko) * 2013-03-12 2015-11-04 일리노이즈 툴 워크스 인코포레이티드 색상 기반 선형 3차원 포착 시스템 및 방법

Also Published As

Publication number Publication date
CN101606448A (zh) 2009-12-16
IL199930A (en) 2016-06-30
DE112008000339B4 (de) 2021-08-26
GB0913116D0 (en) 2009-09-02
US7710611B2 (en) 2010-05-04
WO2008100646A3 (en) 2009-01-08
CN101606448B (zh) 2011-12-28
IL199930A0 (en) 2010-04-15
GB2458428A (en) 2009-09-23
GB2458428B (en) 2012-01-18
JP2010519733A (ja) 2010-06-03
US20080197170A1 (en) 2008-08-21
WO2008100646A2 (en) 2008-08-21
DE112008000339T5 (de) 2009-11-19

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