KR20090125057A - 단일 및 다중-스펙트럼 조명 시스템 및 방법 - Google Patents
단일 및 다중-스펙트럼 조명 시스템 및 방법 Download PDFInfo
- Publication number
- KR20090125057A KR20090125057A KR1020097016562A KR20097016562A KR20090125057A KR 20090125057 A KR20090125057 A KR 20090125057A KR 1020097016562 A KR1020097016562 A KR 1020097016562A KR 20097016562 A KR20097016562 A KR 20097016562A KR 20090125057 A KR20090125057 A KR 20090125057A
- Authority
- KR
- South Korea
- Prior art keywords
- light
- long wavelength
- stencil
- circuit board
- electronic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims description 40
- 238000001228 spectrum Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 229910000679 solder Inorganic materials 0.000 claims abstract description 95
- 238000003384 imaging method Methods 0.000 claims abstract description 75
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 238000005286 illumination Methods 0.000 description 60
- 238000000576 coating method Methods 0.000 description 16
- 239000007921 spray Substances 0.000 description 12
- 238000007689 inspection Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 238000005507 spraying Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
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- 239000000523 sample Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/02—Manually-operable devices
- B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5193—Electrical connector or terminal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/707,757 | 2007-02-16 | ||
| US11/707,757 US7710611B2 (en) | 2007-02-16 | 2007-02-16 | Single and multi-spectral illumination system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090125057A true KR20090125057A (ko) | 2009-12-03 |
Family
ID=39671890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097016562A Ceased KR20090125057A (ko) | 2007-02-16 | 2008-01-03 | 단일 및 다중-스펙트럼 조명 시스템 및 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7710611B2 (enExample) |
| JP (1) | JP2010519733A (enExample) |
| KR (1) | KR20090125057A (enExample) |
| CN (1) | CN101606448B (enExample) |
| DE (1) | DE112008000339B4 (enExample) |
| GB (1) | GB2458428B (enExample) |
| IL (1) | IL199930A (enExample) |
| WO (1) | WO2008100646A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150123817A (ko) * | 2013-03-12 | 2015-11-04 | 일리노이즈 툴 워크스 인코포레이티드 | 색상 기반 선형 3차원 포착 시스템 및 방법 |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4696861B2 (ja) * | 2005-11-11 | 2011-06-08 | パナソニック株式会社 | スクリーン印刷装置 |
| US8730321B2 (en) * | 2007-06-28 | 2014-05-20 | Accuvein, Inc. | Automatic alignment of a contrast enhancement system |
| CN101960253B (zh) * | 2008-02-26 | 2013-05-01 | 株式会社高永科技 | 三维形状测量装置及测量方法 |
| US8413577B2 (en) * | 2008-11-19 | 2013-04-09 | Illinois Tool Works Inc. | Vertically separated pass through conveyor system and method in surface mount technology process equipment |
| IT1392991B1 (it) * | 2009-02-23 | 2012-04-02 | Applied Materials Inc | Procedimento di stampa serigrafica autoregolantesi |
| DE102009053575B4 (de) | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste |
| EP2380738B1 (de) * | 2010-04-22 | 2014-05-28 | Manz AG | Drucksieb und Verfahren zur Einstellung der relativen Lage eines Druckmusters und eines Substrats |
| US8474377B2 (en) * | 2010-12-08 | 2013-07-02 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
| US9243726B2 (en) | 2012-10-03 | 2016-01-26 | Aarne H. Reid | Vacuum insulated structure with end fitting and method of making same |
| WO2014058460A1 (en) * | 2012-10-08 | 2014-04-17 | Dwfritz Automation Inc. | Simultaneous-view object insertion systems, apparatuses and methods |
| JP2014091247A (ja) * | 2012-11-02 | 2014-05-19 | Panasonic Corp | 半田印刷機及び半田印刷機の半田にじみ検査方法 |
| US11176635B2 (en) * | 2013-01-25 | 2021-11-16 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
| EP2998728B1 (en) * | 2013-05-13 | 2019-10-30 | FUJI Corporation | Component mounting machine |
| US9743527B2 (en) * | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
| US9463918B2 (en) | 2014-02-20 | 2016-10-11 | Aarne H. Reid | Vacuum insulated articles and methods of making same |
| JP6654805B2 (ja) * | 2015-03-12 | 2020-02-26 | 日東電工株式会社 | 配線回路基板の製造方法および検査方法 |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
| US10065256B2 (en) * | 2015-10-30 | 2018-09-04 | Concept Group Llc | Brazing systems and methods |
| EP3423854A4 (en) | 2016-03-04 | 2020-01-01 | Concept Group LLC | VACUUM-INSULATED ARTICLES WITH IMPROVEMENT OF REFLECTIVE MATERIAL |
| JP7202766B2 (ja) | 2016-11-15 | 2023-01-12 | コンセプト グループ エルエルシー | 微小孔構造の絶縁体によって強化された真空絶縁物品 |
| WO2018093773A1 (en) | 2016-11-15 | 2018-05-24 | Reid Aarne H | Multiply-insulated assemblies |
| JP2020531764A (ja) | 2017-08-25 | 2020-11-05 | コンセプト グループ エルエルシー | 複合的ジオメトリおよび複合的材料の断熱部品 |
| JP6783739B2 (ja) | 2017-10-31 | 2020-11-11 | 株式会社東芝 | 検査システムおよび検査方法 |
| CN110132960B (zh) * | 2018-02-09 | 2021-12-14 | 飞旭电子(苏州)有限公司 | 电路板组件的检测方法 |
| US10780515B2 (en) * | 2018-04-26 | 2020-09-22 | Raytheon Technologies Corporation | Auto-adaptive braze dispensing systems and methods |
| KR102528016B1 (ko) * | 2018-10-05 | 2023-05-02 | 삼성전자주식회사 | 솔더 부재 실장 방법 및 시스템 |
| JP7402634B2 (ja) * | 2019-08-01 | 2023-12-21 | 株式会社Fuji | マスク印刷機、供給位置案内装置 |
| TW202400995A (zh) * | 2021-12-20 | 2024-01-01 | 瑞士瑞士義大利語區應用科技大學 | 用以獲取適用於底層物體的視覺品質的自動光學檢查的人工視覺系統的物體及表面的三維資訊的裝置,所述物體尤其是電子組裝、電路板等 |
| IT202100031832A1 (it) * | 2021-12-20 | 2023-06-20 | Scuola Univ Professionale Della Svizzera Italiana Supsi | Apparato di acquisizione di informazioni tridimensionali di oggetti e superfici per un sistema di visione artificiale per l'ispezione ottica automatica della qualità visiva di un oggetto sottostante, in particolare assemblaggi elettronici, schede elettroniche e simili |
| US11947094B1 (en) * | 2023-03-23 | 2024-04-02 | Illinois Tool Works Inc. | Dual camera prism assembly for stencil printer |
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| JP2003172711A (ja) * | 2001-09-26 | 2003-06-20 | Dainippon Screen Mfg Co Ltd | 画像処理を利用した検査対象物の表面検査 |
| JP3981259B2 (ja) * | 2001-11-01 | 2007-09-26 | 松下電器産業株式会社 | 基板用支持治具 |
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| GB2403003B (en) | 2003-06-19 | 2006-06-07 | Dek Int Gmbh | Inspection system for and method of inspecting deposits printed on workpieces |
| JP2006242719A (ja) * | 2005-03-02 | 2006-09-14 | Omron Corp | 半田材劣化度判断装置、半田印刷機、半田材劣化度判断方法、半田印刷方法、半田材劣化度判断プログラム、半田印刷プログラムおよびコンピュータ読み取り可能な記録媒体 |
| JP5191089B2 (ja) * | 2005-06-30 | 2013-04-24 | Ckd株式会社 | 基板の検査装置 |
| US20070102477A1 (en) | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
| US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
-
2007
- 2007-02-16 US US11/707,757 patent/US7710611B2/en active Active
-
2008
- 2008-01-03 JP JP2009549651A patent/JP2010519733A/ja active Pending
- 2008-01-03 CN CN2008800042613A patent/CN101606448B/zh active Active
- 2008-01-03 KR KR1020097016562A patent/KR20090125057A/ko not_active Ceased
- 2008-01-03 DE DE112008000339.4T patent/DE112008000339B4/de active Active
- 2008-01-03 GB GB0913116.0A patent/GB2458428B/en not_active Expired - Fee Related
- 2008-01-03 WO PCT/US2008/050068 patent/WO2008100646A2/en not_active Ceased
-
2009
- 2009-07-16 IL IL199930A patent/IL199930A/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150123817A (ko) * | 2013-03-12 | 2015-11-04 | 일리노이즈 툴 워크스 인코포레이티드 | 색상 기반 선형 3차원 포착 시스템 및 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101606448A (zh) | 2009-12-16 |
| IL199930A (en) | 2016-06-30 |
| DE112008000339B4 (de) | 2021-08-26 |
| GB0913116D0 (en) | 2009-09-02 |
| US7710611B2 (en) | 2010-05-04 |
| WO2008100646A3 (en) | 2009-01-08 |
| CN101606448B (zh) | 2011-12-28 |
| IL199930A0 (en) | 2010-04-15 |
| GB2458428A (en) | 2009-09-23 |
| GB2458428B (en) | 2012-01-18 |
| JP2010519733A (ja) | 2010-06-03 |
| US20080197170A1 (en) | 2008-08-21 |
| WO2008100646A2 (en) | 2008-08-21 |
| DE112008000339T5 (de) | 2009-11-19 |
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