1276793 ⑴ 玖、發明說明 【發明所屬之技術領域】 本發明是有關於圖案檢查方法及裝置，特別是有關於 對著利用捲帶載體方式的TAB (Tape Automated Bonding )膠帶照射照明光，將形成在TAB膠帶上的積體電路（ 1 C )等的圖案，利用攝影手段來拍攝且自動進行外觀檢查 的圖案檢查方法及裝置。 【先前技術】 半導體裝置是對應於高積體化和高密度實裝的要求， 促進引線的多針腳化和微小化。因爲有利於該多針腳化、 微小化’所以採用將半導體晶片與設置在薄膜狀的TAB 膠帶的多數引線連接的方法。 於第1 1圖表示TAB膠帶之構造的一例。 TAB膠帶101是在厚度20〜150//m左右（多數爲 2 5〜7 5 // m )、寬度3 5〜1 6 5 m m左右的樹脂薄膜1 〇 2上， 除了形成穿孔1 0 3之兩側周邊部外，如第1丨圖（a )所示 ，塗佈厚度1 〇〜1 5 // m左右的黏著劑1 〇 4，在其上如第 1 1圖（b )所示，粘貼著銅箔等之金屬箔1 〇 5。 利用曝光及蝕刻來加工該金屬箔1 05，如第1 1圖（c )所示，形成電路等圖案]0 6。此時，不除去黏著劑i 〇4 這層，依然保留。 形成貫際圖案的T A B膠帶]〇 1的例子表示在第〗2圖 (2) 1276793 於第】2圖中，內部的白長方形是指安裝半導體晶片 的開口部（裝置孔）1 1 0，1 1 1是指配線電路圖案。 此種TAB膠帶101的製造工程中，必須使用圖案檢 查裝置來檢查配線電路圖案是否形成正常。 圖案檢查裝置是利用照明光來照明欲檢查的TAB膠 帶1 0 1，利用攝影裝置或是目視來檢測電路圖案的狀態（ 外觀），與基準圖案比較判斷所形成的圖案良否。近年來 也採用事先在檢查裝置的·控制部的記憶部記憶著基準圖案 ，加以比較所記憶的基準圖案和利用攝影裝置所拍攝的實 際電路圖案，自動的加以判定良否的自動檢查裝置。 爲了拍攝圖案，對TAB膠帶照射照明光的方法有： 採用落射光的方法和採用透過光的方法。 採用落射光的方法是從TAB膠帶的上方（形成圖案 的這側）照射照明光，且從照射照明光的方向，觀察因來 自TAB膠帶的反射光的電路圖案像，例如利甩攝影元件 拍攝且進行圖像處理。 例如於日本特許文獻1揭示上種採用落射光的圖案檢 查裝置。 上述日本特許文獻1所記載的是對著形成圖案的膠帶 從照明裝置照射光，且利用CCD照像機來拍攝以照明裝 置所照明的位置的膠帶，並輸出到電腦，且利用電腦來處 理圖像，檢測出圖案的缺陷。 另一方面，採用透過照明的方法是從T A B膠帶的下 方（與形成圖案的這側相反的一側）進行照明，且利用設 - 5- (3) 1276793 置在T A B膠帶的上方（與照射照明光的這側相反的一側 )的攝影元件來拍攝因穿透TAB膠帶的透過光的電路圖 案像。 採用透過光的方法比採用落射光的方法還要適合圖案 檢查。其理由於以下做說明。 如第1 3圖所示，蝕刻銅箔等金屬箔而形成圖案之時 ，所形成的圖案之斷面爲梯形，若圖案之上側的寬度a與 下側的寬度幅b的尺寸相比，下側的寬度b較寬。此乃基 於蝕刻液自銅箔的表面蝕刻到內部時的擴散和速度，很淸 楚。 檢查此種圖案的時候，照明光若採用落射光，攝影元 件是捕捉反射在配線圖案之表面的光，除此以外的部分變 暗黑。 因而，如第1 4圖（a )所示，即使配線的圖案與在下 側相鄰的圖案形成短路，所攝影的圖像會拍攝出沒有短路 的正常圖案。因而，會有漏看不良的情形。 另一方面，若採用透過光，攝影元件是捕捉透過樹脂 薄膜的光，除此以外的部分變暗黑。 因而，如第1 4圖（b )所示，配線的圖案與在下側相 鄰的圖案形成短路的話，所拍攝的圖像由於短路會拍攝到 很粗的異常圖案，因而，能檢測到不良。 [曰本特許文獻1 ] 日本特開第2 0 0 0 — 1 8 2 0 6 1號公報 (4) 1276793 [發明欲解決之課題] 但是採用透過光的時候，會有以下的問題。如前述， 在形成TAB膠帶的樹脂薄膜之上，有用來黏著金屬箔之 黏著劑的層，圖案形成後也留在樹脂薄膜上。 銅箔利用蝕刻被剝離後的黏著劑層的表面，據知存在 無數數m m的凹凸。本來黏著劑的表面是平坦的。但由 於在銅箔的背面因結合效果而強固黏著的緣故，會形成多 數微小的突起，該突起會被轉印到黏著劑的表面。 若對著銅箔剝離後的黏著劑透過照明光，經由銅箔背 面被轉印的凹凸會讓照明光因亂反射引起擴散而變暗黑， 在利用 CCD照相機等所攝影的圖像會產生黑色的污點、 斑點。 若以看見此種污點、斑點的狀態進行圖像處理，在圖 案附近有污點、斑點的話，以此作爲配線的一部分進行處 理，當檢查裝置與基準圖案做比較時，就會有誤認爲配線 變粗，判斷爲製品不良的情形。 另外，在圖案附近沒有污點、斑點，就會有辨識爲灰 塵，判斷爲製品不良的情形。像這樣實際上並不是不良， 不過裝置判斷爲不良的所謂過度檢測的情形。 若進行透過照明，因此種黏著劑層的微小凹凸產生污 點、斑點是造成過度檢測的原因，採用透過光之圖案的自 動檢查裝置的實用化就很困難。反射照明的時候，當拍攝 到黏著劑層時會照出暗黑，並不會產生此種問題。 本發明是欲解決上述習知技術之問題的發明，其目的 -7 - 1276793 (5) 是在於即使在基板上形成具有像是黏著劑層的微小凹凸的 層，亦不會產生過度檢測，能實現採用透過光的圖案自動 檢查。 【發明內容】 [用以解決課題之手段] 爲解決上述課題，將攝影手段相對於基板而配置在照 明手段的相反側，從攝影手段之視野外來照射屬於擴散光 的照明光，對基板進行透過照明。 例如，在射出照明手段的照明光的部分設置擴散板， 將射出照明光的光源，以其中心光線（從照明光源射出的 光線中，光強度爲最大的光線）不直接射入攝影手段的方 式’配置在攝影手段之視野的外側。 或者，對於將上述照明手段的光源，以其中心光線對 基板而言，被傾斜照射的方式加以配置，且受像面對基板 而言爲平行的方式被配置的攝影手段，上述中心光線不會 直接射入。 另外，在照明手段和基板之間配置覆蓋上述攝影手段 之視野內的領域的遮光板，且來自照明手段的光源，其中 心光線不會直接射入到攝影手段。 在此’上述攝影手段的視野是指結像在攝影元件之受 像面的物體面上的範圍（領域），上述攝影手段爲直列式 感測器的時候，寬度爲】mm以下，長度是對應於攝影手 段的受像元件的長度而決定的長度。 (6) 1276793 攝影手段爲使用直列式感測器的時候，如上述’因爲 視野幅度很窄，所以與攝影手段一起在視野幅度方向掃描 上述照明手段，而取得基板上的圖案。 利用攝影手段被攝影的基板的圖像的圖案會被送到控 制部，處理圖像，與事先記憶的基準圖案比較，判斷基板 上的圖案是否良好。 在透過光的圖像產生污點、斑點，認爲是以下的理由 〇 如第2圖（a )所示，對著黏著劑層射入照明光之際 ，對基板而言，直角射入的成份的光，若射入到基板之沒 有凹凸的部分，其光會照樣直進。另一方面，射入到有凹 凸的部分的時候，會因亂反射被擴散，直進的光之成份變 少〇 將攝影手段相對於基板而配置在上述照明手段的相反 側的時候，來自上述照明手段，光強度最大的中心光線會 略直角的射入到上述基板之沒有凹凸的部分。 該光的大部分會照樣直進而射入到攝影元件，在利用 攝影手段所受像的圖像上會照出明亮沒有凹凸的部分。 另外，射入到有凹凸的部分的時候，如上述，會因亂 反射被擴散，即使上述光強度大的中心光線射入到該部分 ，直進的光的成份變少。因此，在利用攝影手段所受像的 圖像上會照出暗黑有凹凸的部分。即，對於被攝影元件受 像的圖像，部分明亮度會不同。 另一方面，來自照明手段之光源的中心光線不會透過 (7) (7)1276793 基板直接射入到攝影元件地將照明手段的光源配置在攝影 元件的視野外的話，從該光源射出的強度較大的中心光線 不會透過基板之沒有凹凸的部分而直接射入到攝影手段。 即，像這樣的話，如第2圖（b )所示，即使光強度 較小的擴散光射入到沒有凹凸的部分，在沒有凹凸的部分 會直進並射入到攝影元件的強光的成份變少。因此，從照 明手段與中心光線直角射入到上述基板之沒有凹凸的部分 的情形相比，沒有凹凸的部分會照出暗黑。 另外，上述擴散光射入到有凹凸的部分的情形，也如 第 2圖（b )所示，會被有凹凸的部分擴散，同樣的會照 出暗黑。 因而，與第2圖（a )所示的情形相比，有凹凸的部 分和沒有的部分亮度都沒有很大的差異，在攝影的圖像不 易生污點、斑點。 於本發明中，如上述，針對在攝影手段之視野外配置 照明手段之光源的基板，進行照明，不易在圖像上出現因 亂反射的污點、斑點，就沒有以此爲原因的配線較粗的誤 認，能防止過度檢查。 【實施方式】 [發明之實施形態] 第〗圖是表示本發明之實施例的圖案檢查裝置之構成 例圖。 再者，在以下之實施例中，針對基板爲TAB膠帶的 -10- (8) 1276793 情形做說明，不過本發明除TAB膠帶之外，適用於利用 透過照明光的各種基板的檢查。 本實施例的圖案檢查裝置乃如同圖所示，具備有：由 搬送TAB膠帶5的遞送捲輪1 1、捲繞捲輪1 2等所構成的 膠帶搬送機構1 〇、對著從遞送捲輪1 1被送出的TAB膠帶 5照射照明光且攝影圖案5 a的檢查部1、在T A B膠帶的 檢查圖案5 a上掃描檢查部1的掃描手段2、在不良的圖 案加註標記的標誌部3。另外，比較所攝影的圖案和成爲 基準的主圖案來判定製品良否的同時用來控制檢查部1、 掃描手段2、標誌部3以及膠帶搬送機構1 〇之動作的控 制部4。 檢查部1是由：從背面側照明TAB膠帶5的兩個透 過照明手段1 a、欲拍攝利用經由TAB膠帶5穿透設置在 與透過照明手段1 a相對的位置的T A B膠帶5的照明光形 成在T AB膠帶5的電路等圖案5 a的攝影手段1 b所構成 〇 透過照明手段la是適當選擇輸出穿透TAB膠帶5的 波長之光的光源。攝影手段1 b是屬於在照明光之波長具 有受光感度的例如CCD直列式感測器，以下是針對攝影 手段1 b採用CCD直列式感測器的情形做說明。再者，透 過照明手段1 a的光量十分大的話，取代CCD直列式感測 器’也可採用能一倂拍攝檢查圖案全面的CCD感測器。 掃描手段2是在TAB膠帶5的檢查圖案5a上，在同 圖的紙面前後方向掃描CCD直列式感測器1 b和透過照明 - 11 - (9) (9)1276793 手段1 a，得到TAB膠帶5的全體圖像。 於第1圖中，屬於TAB膠帶5之檢查對象的檢查圖 案5 a經由前述膠帶搬送機構1 〇被搬送到檢查部1的特定 位置的話，TAB膠帶5會停止在該位置，利用上述掃描手 段2在同圖的紙面前後方向掃描透過照明手段1 a、CCD 直列式感測器1 b。藉此，從上述透過光照明手段1 a射出 的照明光，會穿透TAB膠帶上的檢查圖案5a，在CCD直 列式感測器lb受光，檢查圖案5a的圖像會取入到CCD 直列式感測器1 b。 該圖像被送到控制部4，在控制部4比較經由CCD 直列式感測器1 b被取入的檢查圖案5 a的圖像、和事先記 憶在控制部4的檢查用的主圖案（基準圖案）圖像.，來判 斷檢查圖案5a之良否。 上述檢查用之主圖案可爲事先利用攝影手段來拍攝屬 於良品的實際製品，基於該攝影的圖案而製作成的圖案， 也可爲由CAD資料所製作成的圖案。 再者’圖案之良否的判定手法是從習知提供各種手法 ，該些方法之中，選擇採用適當的判定手法即可。 上述良否的判定是針對T A B膠帶上的各檢查圖案5 a 執行，上述檢查的結果，判斷TAB膠帶上的圖案5 a屬於 不良的話，T A B膠帶上的不良圖案的位置會被記憶在控制 部4，該圖案被搬送到標誌部3時，會被捲繞在施以所謂 著色、穿孔的標記的捲繞捲輪]2。 於第3圖表示上述檢查部1的詳細構成例。同圖乃如 -12- (10) 1276793 第1圖所示，表示採用從光源被放射的光的中心光線是以 相對於TAB膠帶5而傾斜被照射的方式被傾斜配置的兩 個照明手段的情形的構成例，同圖（a )是表示從TAB膠 帶5的搬送方向觀看的圖，（b)是表示從CCD直列式感 測器lb側觀看TAB膠帶5的圖。再者，第3圖是表示 CCD直列式感測器1 b、透過照明手段1 a相對於膠帶的搬 送方向，在正交的方向進行掃描的情形。 在檢查部1設置具有開口部的工件台1 c，TAB膠帶5 上的檢查圖案5 a停在工件台1 c上的特定位置的話，即利 用掃描手段2在同圖（a) 、（ b )的箭頭方向（TAB膠帶 5的寬度方向）.掃描透過照明手段l a、CCD直列式感測器 1 b，照明光即經由上述開口部從傾斜方向照射到TAB膠 帶5上的檢查圖案5a。而且，穿透檢查圖案5的光會在 C C D直列式感測器1 b被受光，檢查圖案5 a的圖像會被取 入到CCD直列式感測器lb。 C C D直列式感測器1 b的視野乃如同圖（a ) 、 （ b ) 所示，掃描方向的寬度a很窄，正交於掃描方向之方向的 長度b比檢查圖案5a之同方向的長度還長。另外，正交 於透過照明手段1 a的CCD直列式感測器〗b的掃描方向 之方向的長度，如同圖（b )所示，比c C D直列式感測器 1 b之視野的長度b還長。 因而，藉由一次在同圖的箭頭方向掃描CCD直列式 感測器1 b，就能將檢查圖案5 a全體的圖像取入到c c D直 列式感測器]b。再者，CCD直列式感測器]b的掃描方向 -13^ (11) 1276793 的視野的寬度實際爲數// m。 上述透過照明手段1 a的光源1 d例如LED光源、鹵 素光源等可適當選擇射出穿透TAB膠帶5之波長的光的 光源，在透過照明手段1 b的光射出口設置屬於擴散板1 e 之例如毛玻璃。 但僅設置上述擴散板1 e，從光源1 d射出的照明光無 法成爲充分的擴散光，會經由TAB膠帶5的檢查圖案5a 而讓從透過照明手段1 b被放射之強度比較大的中心光線 射入到CCD直列式感測器1 b。因此，照這樣進行照明， 會與習知同樣的，產生因亂反射引起明亮度的差異。 於是，本實施例是以從光源被放射的中心光線不會直 接射入到C C D直列式感測器1 b的方式，傾斜的配置透過 照明手段1 a，對TAB膠帶5而言，光成爲傾斜射入。 若根據這樣，被適度擴散的照明光就會照射到TAB 膠帶5 ’如前述，在圖像上不易出現因亂反射的污點、斑 點。 再者，取代設置上述擴散板1 e，可以將光源1 d的封 體做結霜（沙滑動）加工。 第4圖是表示透過照明手段1 a的光源1 d爲採用L E D 光源，在透過照明手段1 a的射出口設置擴散板1 e的情形 的配光圖案、和透過照明手段〗a的配置例的圖。上述透 過照明手段1 a的LED光源是將複數LED複數並列在同圖 的紙面前後方向，如前述，其紙面前後方向的長度比 C C D直列式感測器]b之視野的長度b還長，配光圖案5 a -14- (12) 1276793 的形狀在紙面的前後方向大致相同。 此例是以從透過照明手段1 a射出的光的中心光線和 C CD直列式感測器1 b的光軸的角度成爲〗5度地傾斜配 置著透過照明手段1 a，在紙面的左右方向掃描上述透過 照明手段1 a和CCD直列式感測器1 b，來拍攝檢查圖案 5 a的圖像。 如同圖所示，LED光源的配光特性，是比較中心光線 的光量比中心光線以外的光量還強，不過像這樣配置透過 照明手段1 a，可將適度擴散的照明光照射到tab膠帶5 〇 再者，上述說明是將透過照明手段1 a、C C D直列式 感測器1 b在相對於T A B膠帶5的搬送方向而正交的方向 進行掃描，不過也可將透過照明手段1 a、C CD直列式感 測器1 b在TAB膠帶5的搬送方向進行掃描。 第5圖乃如習知例所說明，表示經由TAB膠帶在 C C D直列式感測器的正下方配置在透過照明手段，利用 C C D直列式感測器而受像的圖像的亮度分佈特性的圖， 第6圖是表示如本實施例從傾斜方向照射照明光，且利用 C C D直列式感測器而受像的圖像的亮度分佈特性的圖， 橫軸是表示圖像上的位置、縱軸是表示亮度。 第7圖是表示形成在TAB膠帶上的檢查圖案5a的一 部分（配線圖案）的圖，第5圖、第6圖是利用C C D直 列式感測器來受像第7圖所示的配線圖案，且直線狀地在 正交於配線圖案的方向（以第7圖的箭頭所示）掃描所受 -15- (13) 1276793 像的圖像上時的亮度分佈特性的圖。第5圖所示的「線條 」的部分是屬於配線圖案，「空間」的部分是屬於樹脂薄 膜（塗佈黏著劑之有凹凸的部分）。 如第5圖、第6圖所示，「線條」的部分因不透光故 拍攝到暗黑，「空間」的部分因透光故拍攝到明亮。 如習知例，從CCD直列式感測器的正下方照明的情 形，如第 5圖所示，空間的部分的明亮度，大致在6 0〜 8 〇的範圍會散亂，亮度小的部分即爲污點的部分。 第5圖所示的習知例的情形，空間的部分的明亮度散 亂的緣故，圖像處理上述圖像並自動檢查之際，較暗的部 分例如與亮度8 0相比，亮度6 0的部分被拍攝成較暗，儘 管實際上會穿透照明光，但有誤認爲配線較粗的可能性。 對此，如本實施例，從斜向來照射照明光的時候，如 第6圖所示，幾乎不會受到污點的影響，空間部分的明亮 度幾乎相等。因此，上述圖像進行圖像處理並自動檢查之 際，就能確實的區別線條和空間，就不會形成誤檢測。 第1圖、第3圖、第4圖是表示從斜向來照射照明光 的情形，不過如第8圖所示，即使將透過照明手段1 a配 置在CCD直列式感測器lb之視野的外側，還是可得到伺 樣的效果。 即，從透過照明手段1 a被放射的中心光線不會直接 射入到CCD直列式感測器lb，穿透TAB膠帶5的照明光 ，會成爲有凹凸的部分或沒有的部分均爲相同程度加以擴 散的光而射入到攝影元件，就能得到與第3圖的情形同樣 -16 - (14) 1276793 的或是斑點少的圖像。 另外，如第9圖所示，可以在照明手段和基板之間配 置著覆蓋上述攝影手段之視野內的領域的遮光構件6，來 自照明手段的光源，其中心光線就不會直接射入到攝影手 段。若配置此種遮光部材6，與第1圖、第3圖、第7圖 同樣的，穿透TAB膠帶5的照明光，會成爲有凹凸的部 分或沒有的部分均爲相同程度加以擴散的光而射入到攝影 元件，就能得到與第3圖之情形同樣的或是斑點少的圖像 〇 第10圖是表示光源採用鹵素光源時的前述檢查部1 的構成例圖。 如同圖所示，從鹵素光源2 1射出的光是用反射鏡1 a 聚光，經由選擇濾波器22a、光纖22b而穿透TAB膠帶5 之波長的光，對TAB膠帶5而言，會被導入到被傾斜配 置的兩個光射出部22c，且從光射出部22c射出。 光射出部22c會將光纖22b的前端聚束爲長方形，在 其光射出口設置擴散板1 e。從光射出部2 2 c射出的長方 形光會被照射到TAB膠帶5，利用設置在TAB膠帶5之 上側的CCD直列式感測器1 b而受光。 上述光射部22c和CCD直列式感測器lb，乃如前述 ，拍攝利用圖未表示的掃描手段所掃描的檢查圖案的圖像 [發明效果] -17- (15) 1276793 如以上說明’於本發明中，從攝影手段之視野外來照 射屬於擴散光的照明光，對基板進行透過照明並利用攝影 元件來拍攝基板上的圖案，進行基板上之圖案的檢查，不 會因站著劑之凹凸的亂反射爲原因產生明亮度的不同。因 此’在所拍攝的圖像上污點、斑點也很少，就沒有以此爲 原因之配線較粗的誤認，能防止過度檢測。 【圖式簡單說明】 第1圖是表示本發明之實施例的圖案檢查裝置的構成 例圖。 第2圖是表示在攝影手段的正下方配置照明光源的時 候和在攝影手段的視野外配置照明光源的時候的基板上的 凹凸部分之光的亂反射形態的圖。 第3圖是表示檢查部之詳細構成例的圖。 第4圖是表示透過照明手段之光源採用LED光源， 在透過照明手段的射出口設置擴散板時的配光圖案、和透 過照明手段之配置例的圖。 第5圖是表示透過TAB膠帶在CCD直列式感測器的 正下方配置透過照明手段，利用c c D直列式感測器而受 像的圖像之亮度特性的圖° 第6圖是表示將透過照明手段配置在C C D直列式感 測器之視野外側的時候’利用C C D直列式感測器而受像 的圖像之亮度分佈特性的圖。 第7圖是表示形成在屬於檢查對象的TAB膠帶上的 -18 - (16) 1276793 檢查圖案（配線圖案）的一部分的圖。 第8圖是表示在透過照明手段配置在CCD直列式感 測器之視野外側的時候的檢查部的構成例圖。 第9圖是表示在CCD直列式感測器之視野內配置遮 光板的時候的檢查部之構成例圖。 第1 〇圖是表示採用鹵素光源時的透過照明手段的構 成例圖。 第1 1圖是表示TAB膠帶之構造的其中一例的圖。 第1 2圖是表示形成圖案的TAB膠帶之例的圖。 第1 3圖是表示蝕刻銅箔等之金屬箔而形成圖案之時 ，所形成的圖案之斷面的圖。 第1 4圖是說明當照明光採用落射光時，漏看圖案不 良的圖。 [圖號說明]1276793 (1) 玖 发明 发明 发明 发明 发明 发明 发明 发明 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案A pattern inspection method and apparatus for taking a pattern such as an integrated circuit ( 1 C ) on a TAB tape by photographing and automatically performing an appearance inspection. [Prior Art] The semiconductor device is required for high integration and high-density mounting, and facilitates multi-pinning and miniaturization of leads. Since it is advantageous for the multi-pinning and miniaturization, a method of connecting a semiconductor wafer to a plurality of leads provided on a film-like TAB tape is employed. An example of the structure of the TAB tape is shown in Fig. 1 . The TAB tape 101 is on the resin film 1 〇 2 having a thickness of about 20 to 150 / / m (mostly 2 5 to 7 5 / m) and a width of about 5 5 to 1 6 5 mm, except that the perforation 1 0 3 is formed. The adhesive 1 〇 4 having a thickness of about 1 〇 1 / 5 5 / m is applied as shown in Fig. 1 (b), as shown in Fig. 1 (b). A metal foil 1 〇 5 such as copper foil is attached. The metal foil 105 is processed by exposure and etching, and as shown in Fig. 1(c), a pattern such as a circuit is formed. At this time, the layer of the adhesive i 〇 4 is not removed and remains. An example of a TAB tape forming a continuous pattern] 〇1 is shown in Fig. 2 (2) 1276793 in Fig. 2, and an inner white rectangle means an opening (device hole) in which a semiconductor wafer is mounted 1 1 0, 1 1 1 refers to the wiring circuit pattern. In the manufacturing process of such a TAB tape 101, it is necessary to check whether or not the wiring circuit pattern is normal using a pattern inspection device. The pattern inspection device illuminates the TAB tape 101 to be inspected by illumination light, and detects the state (appearance) of the circuit pattern by a photographing device or a visual inspection, and judges whether the formed pattern is good or not in comparison with the reference pattern. In recent years, the reference pattern is stored in the memory unit of the control unit of the inspection device, and the reference pattern that is stored and the actual circuit pattern captured by the imaging device are compared, and the automatic inspection device that automatically determines the quality is used. In order to take a picture, the method of illuminating the TAB tape with illumination light is as follows: a method of emitting light and a method of transmitting light. The method of using the epi-illumination light is to irradiate the illumination light from above the TAB tape (the side on which the pattern is formed), and observe the circuit pattern image of the reflected light from the TAB tape from the direction in which the illumination light is irradiated, for example, the Rayleigh photographic element is photographed and Perform image processing. For example, Japanese Patent Laid-Open Publication No. 1 discloses a pattern inspection device using epi-illumination. According to the above-mentioned Japanese Patent Publication No. 1, it is described that the tape on which the pattern is formed is irradiated with light from the illumination device, and the tape which is illuminated by the illumination device is captured by the CCD camera, and is output to a computer, and the image is processed by the computer. Like, detecting a defect in the pattern. On the other hand, the method of transmitting illumination is to illuminate from below the TAB tape (the side opposite to the side on which the pattern is formed), and set it above the TAB tape using the 5-5 (3) 1276793 (with illumination illumination). The photographic element on the opposite side of the side of the light captures a circuit pattern image of the transmitted light that penetrates the TAB tape. The method of transmitting light is more suitable for pattern inspection than the method of using the falling light. The reason for this is explained below. As shown in Fig. 1, when a metal foil such as a copper foil is etched to form a pattern, the cross section of the formed pattern is trapezoidal, and the width a on the upper side of the pattern is smaller than the width b on the lower side. The width b of the side is wider. This is based on the diffusion and velocity of the etching solution from the surface of the copper foil to the inside, which is very difficult. When such a pattern is inspected, if the illumination light is epitaxial light, the photographic element captures light reflected on the surface of the wiring pattern, and the other portions become dark. Therefore, as shown in Fig. 14(a), even if the pattern of the wiring forms a short circuit with the pattern adjacent to the lower side, the photographed image captures a normal pattern without a short circuit. Therefore, there will be a situation in which a leak is bad. On the other hand, when transmitted light is used, the image capturing element captures light transmitted through the resin film, and the other portions become dark. Therefore, as shown in Fig. 14(b), when the pattern of the wiring is short-circuited with the pattern adjacent to the lower side, the captured image is photographed with a thick abnormal pattern due to the short circuit, and thus a defect can be detected. [Patent Document 1] Japanese Patent Laid-Open No. 2 0 0 0 - 1 8 2 0 6 1 (4) 1276793 [Problem to be solved by the invention] However, when light is transmitted, the following problems occur. As described above, on the resin film forming the TAB tape, there is a layer for adhering the adhesive of the metal foil, and the pattern remains after being formed on the resin film. The copper foil is etched by the surface of the adhesive layer after being peeled off, and it is known that there are innumerable numbers of m m. The surface of the adhesive is originally flat. However, since the back surface of the copper foil is strongly adhered by the bonding effect, a large number of minute projections are formed, which are transferred to the surface of the adhesive. When the adhesive that has been peeled off from the copper foil transmits the illumination light, the unevenness that is transferred through the back surface of the copper foil causes the illumination light to diffuse due to the scattering of the illumination light, and the image captured by the CCD camera or the like generates black. Blots, spots. If image processing is performed in a state where such stains or spots are seen, if there are stains or spots near the pattern, it is treated as part of the wiring. When the inspection device is compared with the reference pattern, the wiring is mistaken. Thick, judged to be a bad product. In addition, if there are no stains or spots near the pattern, it is recognized as dust and it is judged that the product is defective. In this way, it is not actually a bad situation, but the device judges to be a bad so-called over-detection situation. When the illumination is transmitted, the fine unevenness of the adhesive layer causes stains and spots to cause excessive detection, and the use of an automatic inspection device that transmits a pattern of light is difficult. When the illumination is reflected, the darkness is emitted when the adhesive layer is photographed, and this problem does not occur. The present invention is an invention for solving the above problems of the prior art, and the object -7 - 1276793 (5) is that even if a layer having minute irregularities such as an adhesive layer is formed on a substrate, excessive detection does not occur, and Realize automatic inspection using patterns that transmit light. [Means for Solving the Problem] In order to solve the above problem, the imaging means is disposed on the opposite side of the illumination means with respect to the substrate, and illumination light belonging to the diffused light is irradiated from the field of view of the imaging means to transmit the substrate. illumination. For example, a diffusing plate is provided in a portion where the illumination light of the illumination means is emitted, and the light source that emits the illumination light is not directly incident on the photographing means by the center light (the light having the highest light intensity among the light emitted from the illumination source) 'The outside of the field of view of the means of photography. Alternatively, the center light is not directly applied to the light source in which the light source of the illumination means is disposed such that the center light ray is obliquely irradiated, and the image receiving surface is parallel to the substrate. Injection. Further, a light shielding plate covering the field in the field of view of the imaging means is disposed between the illumination means and the substrate, and the light source from the illumination means does not directly enter the imaging means. Here, the field of view of the above-mentioned photographing means refers to the range (area) of the image on the object surface of the image receiving surface of the photographing element. When the photographing means is an in-line sensor, the width is less than or equal to mm, and the length corresponds to The length of the imaging means determined by the length of the image element. (6) 1276793 When the in-line sensor is used as the imaging means, as described above, since the field of view is narrow, the illumination means is scanned in the direction of the field of view with the imaging means to obtain the pattern on the substrate. The pattern of the image of the substrate photographed by the photographing means is sent to the control unit, and the image is processed to determine whether the pattern on the substrate is good as compared with the reference pattern previously stored. In the image of the transmitted light, stains and spots are considered to be the following reasons. For example, as shown in Fig. 2(a), when the illumination light is incident on the adhesive layer, the substrate is incident at a right angle. If the light is incident on the non-concave portion of the substrate, the light will go straight. On the other hand, when it is incident on the uneven portion, it is diffused by the chaotic reflection, and the component of the straight-through light is reduced. When the photographing means is disposed on the opposite side of the illumination means with respect to the substrate, the illumination is from the above illumination. Means, the center light having the highest light intensity is incident at a slightly right angle to the portion of the substrate where there is no unevenness. Most of the light is incident on the photographic element as it is, and a portion that is bright and has no irregularities is formed on the image received by the photographic means. Further, when it is incident on the uneven portion, as described above, it is diffused by the scattered reflection, and even if the center light having the large light intensity is incident on the portion, the composition of the straight light is reduced. Therefore, a portion having dark concavities and the like is illuminated on the image received by the photographing means. That is, the partial brightness differs for the image to be imaged by the imaged element. On the other hand, the center light from the light source of the illumination means does not pass through (7) (7) 1276793. When the substrate is directly incident on the imaging element and the light source of the illumination means is disposed outside the field of view of the imaging element, the intensity emitted from the light source is emitted. The larger central light does not pass through the non-concave portion of the substrate and is directly incident on the photographing means. In other words, as shown in Fig. 2(b), even if the diffused light having a small light intensity is incident on the portion where there is no unevenness, the portion of the glare that directly enters and enters the photographic element in the portion where there is no unevenness. Fewer. Therefore, compared with the case where the illumination means is incident at a right angle to the center light to the portion of the substrate where the unevenness is not present, the portion having no unevenness emits dark. Further, when the diffused light is incident on the uneven portion, as shown in Fig. 2(b), it is diffused by the uneven portion, and the same dark light is emitted. Therefore, compared with the case shown in Fig. 2(a), the portion having the unevenness and the portion having no brightness are not greatly different, and the image to be photographed is less likely to be stained or spotted. In the present invention, as described above, the substrate on which the light source of the illumination means is disposed outside the field of view of the photographing means is illuminated, and it is difficult to cause stains and spots on the image due to disordered reflection, and the wiring is not thicker for this reason. Misunderstanding can prevent over-examination. [Embodiment] [Embodiment of the Invention] Fig. 1 is a view showing an example of the configuration of a pattern inspecting apparatus according to an embodiment of the present invention. Further, in the following embodiments, the case of -10-(8) 1276793 in which the substrate is a TAB tape will be described. However, the present invention is applicable to inspection using various substrates that transmit illumination light in addition to the TAB tape. As shown in the figure, the pattern inspection device of the present embodiment includes a tape conveyance mechanism 1 that is configured by a delivery reel 11 that conveys the TAB tape 5, a winding reel 12, and the like, and a delivery reel 1 1 The TAB tape 5 to be sent is irradiated with illumination light, and the inspection unit 1 of the photographing pattern 5 a scans the scanning means 2 of the inspection unit 1 on the inspection pattern 5 a of the TAB tape 2 , and the marker portion 3 of the defective pattern filling mark 3 . Further, the control unit 4 for controlling the operation of the inspection unit 1, the scanning unit 2, the indicator unit 3, and the tape transport mechanism 1 is controlled while comparing the photographed pattern with the main pattern serving as the reference. The inspection unit 1 is formed by illuminating the two illuminating means 1a of the TAB tape 5 from the back side, and the illuminating light is formed by the TAB tape 5 which is disposed at a position opposed to the transmission illuminating means 1a via the TAB tape 5. The light-receiving means 1a is formed by the photographing means 1b of the pattern 5a of the circuit of the TAB tape 5, and is a light source which appropriately selects and outputs light of a wavelength which penetrates the TAB tape 5. The photographing means 1b is, for example, a CCD in-line sensor having a light-sensing sensitivity at the wavelength of illumination light. Hereinafter, a case where a CCD in-line sensor is used for the photographing means 1b will be described. Further, if the amount of light passing through the illumination means 1a is extremely large, instead of the CCD in-line sensor', a CCD sensor capable of taking a comprehensive inspection pattern can be used. The scanning means 2 is on the inspection pattern 5a of the TAB tape 5, and the CCD inline sensor 1b is scanned in the rear direction of the paper of the same figure and the illumination 1 - 11 - (9) (9) 1276793 means 1 a to obtain the TAB tape. The overall image of 5. In the first drawing, when the inspection pattern 5a to be inspected by the TAB tape 5 is transported to the specific position of the inspection unit 1 via the tape conveyance mechanism 1A, the TAB tape 5 is stopped at the position, and the scanning means 2 is used. The CCD in-line sensor 1 b is scanned through the illumination means 1 a in the rear direction of the paper of the same figure. Thereby, the illumination light emitted from the transmitted light illumination means 1a penetrates the inspection pattern 5a on the TAB tape, and is received by the CCD inline sensor lb, and the image of the inspection pattern 5a is taken into the CCD inline type. Sensor 1 b. This image is sent to the control unit 4, and the control unit 4 compares the image of the inspection pattern 5a taken in via the CCD in-line sensor 1b with the main pattern for inspection in the control unit 4 ( The reference pattern is an image. It is judged whether or not the inspection pattern 5a is good or not. The main pattern for inspection may be an actual product that is good by a photographing means in advance, and a pattern created based on the photographed pattern may be a pattern made of CAD data. Further, the method of determining the quality of the pattern is to provide various methods from the conventional method, and among these methods, an appropriate determination method may be selected. The determination of the above-mentioned quality is performed on each of the inspection patterns 5a on the TAB tape. As a result of the above inspection, if it is determined that the pattern 5a on the TAB tape is defective, the position of the defective pattern on the TAB tape is memorized in the control unit 4. When the pattern is conveyed to the indicator portion 3, it is wound around a winding reel 2 to which a so-called colored and perforated mark is applied. A detailed configuration example of the inspection unit 1 is shown in Fig. 3 . Fig. -12- (10) 1276793 Fig. 1 shows two illumination means in which the center ray of the light radiated from the light source is obliquely irradiated with respect to the TAB tape 5 In the configuration example of the case, (a) is a view which is seen from the conveyance direction of the TAB tape 5, and (b) is a figure which shows the TAB tape 5 from the CCD in-line sensor lb side. Further, Fig. 3 shows a case where the CCD in-line sensor 1b scans in the orthogonal direction by the direction in which the illumination means 1a is transported with respect to the tape. The inspection unit 1 is provided with a workpiece stage 1 c having an opening, and the inspection pattern 5 a on the TAB tape 5 is stopped at a specific position on the workpiece stage 1 c, that is, by the scanning means 2 in the same figure (a), (b) The direction of the arrow (the width direction of the TAB tape 5) is scanned by the illumination means 1a and the CCD inline sensor 1b, and the illumination light is irradiated onto the inspection pattern 5a of the TAB tape 5 from the oblique direction via the opening. Moreover, the light penetrating the inspection pattern 5 is received by the C C D inline sensor 1 b, and the image of the inspection pattern 5 a is taken into the CCD inline sensor 1b. The field of view of the CCD in-line sensor 1 b is as shown in Figs. (a) and (b), and the width a in the scanning direction is narrow, and the length b in the direction orthogonal to the scanning direction is longer than the length in the same direction as the inspection pattern 5a. Still long. Further, the length in the direction orthogonal to the scanning direction of the CCD in-line sensor _b transmitted through the illumination means 1a is as shown in (b), the length b of the field of view of the c-CD inline sensor 1b. Still long. Therefore, by scanning the CCD in-line sensor 1 b in the direction of the arrow in the same figure at one time, the image of the entire inspection pattern 5 a can be taken into the c c D in-line sensor] b. Furthermore, the scanning direction of the CCD in-line sensor]b -13^ (11) The width of the field of view of 1276793 is actually a number / / m. The light source 1d that has passed through the illumination means 1a, for example, an LED light source, a halogen light source, or the like, can appropriately select a light source that emits light that penetrates the wavelength of the TAB tape 5, and is disposed at the light exit port of the transmission illumination means 1b to belong to the diffusion plate 1e. For example, frosted glass. However, only the diffusing plate 1 e is provided, and the illumination light emitted from the light source 1 d cannot be sufficiently diffused light, and the center light of the intensity transmitted from the transmitted illumination means 1 b is relatively transmitted through the inspection pattern 5a of the TAB tape 5 . Injection into the CCD inline sensor 1 b. Therefore, illumination is performed in this manner, and similarly to the conventional one, a difference in brightness due to chaotic reflection occurs. Therefore, in the present embodiment, the center light emitted from the light source is not directly incident on the CCD in-line sensor 1 b, and the oblique arrangement is transmitted through the illumination means 1 a. For the TAB tape 5, the light becomes inclined. Injection. According to this, the appropriately diffused illumination light is irradiated onto the TAB tape 5'. As described above, stains and spots due to irregular reflection are less likely to occur on the image. Further, instead of providing the above-described diffusing plate 1 e, the sealing body of the light source 1 d can be subjected to frosting (sand sliding) processing. Fig. 4 is a view showing an arrangement example of a light distribution pattern in which the light source 1d transmitted through the illumination means 1a is an LED light source, and the diffusing plate 1e is provided in the exit opening of the illumination means 1a. Figure. The LED light source that passes through the illumination means 1 a is a plurality of LEDs arranged in parallel in front of the paper in the same figure. As described above, the length of the front and back of the paper is longer than the length b of the field of view of the CCD inline sensor. The shape of the light pattern 5 a -14- (12) 1276793 is substantially the same in the front-rear direction of the paper surface. In this example, the transmission illuminating means 1a is disposed obliquely at an angle of 5 degrees from the central ray of the light emitted from the illuminating means 1a and the optical axis of the CCD in-line sensor 1b, in the left-right direction of the paper surface. The above-described transmitted illumination means 1a and the CCD in-line sensor 1b are scanned to take an image of the inspection pattern 5a. As shown in the figure, the light distribution characteristics of the LED light source are such that the amount of light of the center light is stronger than the amount of light other than the center light. However, by arranging the illumination means 1 a as described above, the moderately diffused illumination light can be irradiated onto the tab tape 5 〇 Further, in the above description, the illuminating means 1a and the CCD inline sensor 1b are scanned in a direction orthogonal to the transport direction of the TAB tape 5, but the illumination means 1a, CCD may be transmitted. The in-line sensor 1 b scans in the transport direction of the TAB tape 5. FIG. 5 is a view showing a luminance distribution characteristic of an image received by a CCD in-line sensor through a TAB tape placed directly under the CCD in-line sensor via a TAB tape, and is imaged by a CCD in-line sensor, as described in a conventional example. Fig. 6 is a view showing a luminance distribution characteristic of an image which is irradiated with illumination light from an oblique direction and which is received by a CCD in-line sensor as in the present embodiment, wherein the horizontal axis represents the position on the image and the vertical axis represents brightness. Fig. 7 is a view showing a part (wiring pattern) of the inspection pattern 5a formed on the TAB tape, and Figs. 5 and 6 are diagrams showing the wiring pattern shown in Fig. 7 by a CCD in-line sensor, and A graph of luminance distribution characteristics when the image subjected to the -15-(13) 1276793 image is scanned linearly in a direction orthogonal to the wiring pattern (indicated by an arrow in FIG. 7). The portion of "line" shown in Fig. 5 belongs to the wiring pattern, and the portion of "space" belongs to the resin film (the portion where the adhesive is applied with irregularities). As shown in Fig. 5 and Fig. 6, the part of the "line" is dark due to opacity, and the portion of "space" is bright due to light transmission. As is conventionally known, in the case of illumination from directly under the CCD in-line sensor, as shown in Fig. 5, the brightness of the portion of the space is scattered in a range of approximately 60 to 8 ,, and the portion having a small luminance is scattered. It is the part of the stain. In the case of the conventional example shown in Fig. 5, the brightness of the portion of the space is scattered, and when the image is processed and the image is automatically checked, the darker portion is, for example, brighter than the brightness 80. The part was shot darker, although it actually penetrated the illumination, but it was mistaken for the possibility of thick wiring. On the other hand, as in the present embodiment, when the illumination light is irradiated obliquely, as shown in Fig. 6, it is hardly affected by the stain, and the brightness of the space portion is almost equal. Therefore, when the image is image-processed and automatically checked, the lines and spaces can be surely distinguished, and false detection is not formed. Fig. 1, Fig. 3, and Fig. 4 show the case where the illumination light is irradiated obliquely. However, as shown in Fig. 8, even the transmission illumination means 1a is disposed outside the field of view of the CCD inline sensor lb. , still get the effect of the servo. That is, the center light emitted from the transmission illumination means 1a is not directly incident on the CCD inline sensor lb, and the illumination light penetrating the TAB tape 5 becomes a portion having irregularities or the same portion. When the diffused light is incident on the imaging element, an image of the same -16 (14) 1276793 or less speckle as in the case of Fig. 3 can be obtained. Further, as shown in Fig. 9, a light shielding member 6 covering a field in the field of view of the imaging means may be disposed between the illumination means and the substrate, and the light source from the illumination means may not directly enter the center light. means. When such a light-shielding member 6 is disposed, as in the first, third, and seventh drawings, the illumination light that penetrates the TAB tape 5 becomes a portion in which the uneven portion or the non-existing portion is diffused to the same extent. When it is incident on the imaging element, an image similar to the case of Fig. 3 or a small number of spots can be obtained. Fig. 10 is a view showing an example of the configuration of the inspection unit 1 when the light source is a halogen light source. As shown in the figure, the light emitted from the halogen light source 21 is condensed by the mirror 1a, and the light of the wavelength of the TAB tape 5 is penetrated through the selection filter 22a and the optical fiber 22b, and the TAB tape 5 is It is introduced into the two light emitting portions 22c that are disposed obliquely, and is emitted from the light emitting portion 22c. The light emitting portion 22c bundles the front end of the optical fiber 22b into a rectangular shape, and a diffusing plate 1e is provided at the light exit opening. The rectangular light emitted from the light emitting portion 2 2 c is irradiated onto the TAB tape 5, and is received by the CCD in-line sensor 1 b provided on the upper side of the TAB tape 5. The light-emitting portion 22c and the CCD in-line sensor 1b are imaged by an inspection pattern scanned by a scanning means not shown as described above. [Effect of the Invention] -17- (15) 1276793 As described above In the present invention, the illumination light belonging to the diffused light is irradiated from the field of view of the photographing means, and the substrate is transmitted and illuminated, and the pattern on the substrate is photographed by the image capturing element, and the pattern on the substrate is inspected without being uneven by the standing agent. The chaotic reflection causes a difference in brightness. Therefore, there are few stains and spots on the captured image, and there is no such misunderstanding that the wiring is thick, and excessive detection can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of the configuration of a pattern inspecting apparatus according to an embodiment of the present invention. Fig. 2 is a view showing a state of disordered reflection of light on the uneven portion on the substrate when the illumination source is disposed directly under the photographing means and when the illumination source is disposed outside the field of view of the photographing means. Fig. 3 is a view showing a detailed configuration example of the inspection unit. Fig. 4 is a view showing an arrangement example of a light distribution pattern and a illuminating means when an optical source is used as a light source by means of an illumination means, and a diffusing plate is provided through an exit opening of the illumination means. Fig. 5 is a view showing a luminance characteristic of an image received by a cc D in-line sensor by a TAB tape placed directly under the CCD in-line sensor, and Fig. 6 is a view showing a transmission through illumination. A diagram of the luminance distribution characteristics of an image received by a CCD in-line sensor when the device is disposed outside the field of view of the CCD in-line sensor. Fig. 7 is a view showing a part of the -18 - (16) 1276793 inspection pattern (wiring pattern) formed on the TAB tape belonging to the inspection object. Fig. 8 is a view showing an example of the configuration of an inspection unit when the illumination means is disposed outside the field of view of the CCD inline sensor. Fig. 9 is a view showing an example of the configuration of an inspection unit when a light shielding plate is placed in the field of view of the CCD in-line sensor. Fig. 1 is a view showing an example of a configuration of a transmission means when a halogen light source is used. Fig. 1 is a view showing an example of the structure of a TAB tape. Fig. 12 is a view showing an example of a TAB tape on which a pattern is formed. Fig. 1 is a view showing a cross section of a pattern formed when a metal foil such as a copper foil is etched to form a pattern. Fig. 14 is a view for explaining that the leaking pattern is poor when the illumination light is used as the epi-illumination light. [Illustration number]
1 檢查部 la 透過照明手段 1 b 攝影手段（CCD直列式感測器） 1 c 工件台 Id 光源 1 e 擴散板 2 掃描手段 3 標誌部 4 控制部 - 19- (17)1276793 5 TAB膠帶 5 a 檢查圖案 10 膠帶搬送機構 11 遞送捲輪 12 捲繞捲輪 2 1 鹵素光源1 Inspection unit la Light transmission means 1 b Photographing means (CCD in-line sensor) 1 c Workpiece table Id Light source 1 e Diffuser 2 Scanning means 3 Marking part 4 Control section - 19- (17)1276793 5 TAB tape 5 a Inspection pattern 10 Tape conveying mechanism 11 Delivery reel 12 Winding reel 2 1 Halogen light source
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