JP6630527B2 - Inspection method of adhesive film having through hole - Google Patents

Description

  The present invention relates to a method for inspecting an adhesive film having a through hole.

  Some image display devices such as mobile phones and notebook personal computers (PCs) are equipped with internal electronic components such as cameras. Various studies have been made for the purpose of improving the camera performance and the like of such an image display device (for example, Patent Documents 1 to 7). However, with the rapid spread of smartphones and touch panel type information processing devices, further improvements in camera performance and the like are desired. Further, in order to cope with the diversification of the shape of the image display device and the enhancement of its function, a polarizing plate partially having a polarization performance is required. Although it is desirable to manufacture the image display device and / or its components at an acceptable cost in order to realize these needs industrially and commercially, various studies are required to establish such technology. Matters are left.

JP 2011-81315 A JP 2007-241314 A US Patent Application Publication No. 2004/0212555 Korean Published Patent No. 10-2012-0118205 Korean Patent No. 10-1293210 JP 2012-137738 A US Patent Application Publication No. 2014/0118826

  The present invention has been made to solve the above conventional problems, and its main object is to provide a through-hole that can be suitably used as a surface protection film or a mask when processing a predetermined portion of a long film. An object of the present invention is to provide a method for inspecting a long pressure-sensitive adhesive film having the following.

The present invention has a long resin film and an adhesive layer provided on one surface of the resin film, and has a through hole integrally penetrating the resin film and the adhesive layer. Provided is a method for inspecting an adhesive film. The inspection method of the present invention includes a step of imaging the surface of the adhesive film to obtain image data of the surface, and a step of analyzing the image data to inspect the through-hole, Is performed by irradiating one surface of the adhesive film with light and imaging the reflected light.
In one embodiment, light is irradiated perpendicular to one surface of the adhesive film so that the optical axis of the irradiation light is parallel to the imaging optical axis.
In one embodiment, the pressure-sensitive adhesive film further includes a long separator temporarily detachably attached to the pressure-sensitive adhesive layer.
In one embodiment, the through-hole penetrates the separator, the resin film, and the pressure-sensitive adhesive layer integrally.
In one embodiment, the pressure-sensitive adhesive film is used as a surface protective film or a mask when selectively treating a predetermined portion of a long film.
According to another aspect of the present invention, there is provided a method for producing a long adhesive film having a through hole. The production method of the present invention has a long resin film and a pressure-sensitive adhesive layer provided on one surface of the resin film, preparing a transparent pressure-sensitive adhesive film, the resin film and the pressure-sensitive adhesive layer Forming a through hole integrally penetrating; and inspecting the pressure-sensitive adhesive film by the inspection method.

  ADVANTAGE OF THE INVENTION According to this invention, the inspection method of the adhesive film which is elongate and has a through-hole is provided. Such an adhesive film can be suitably used, for example, as a surface protection film or mask when selectively treating a predetermined portion of a film (typically, a long film). By using the inspection method of the present invention, an adhesive film having a through-hole excellent in shape accuracy and the like can be obtained, and as a result, selective treatment using the adhesive film can be performed with high accuracy.

FIG. 2 is a schematic perspective view of an adhesive film that can be used in the inspection method of the present invention. It is a schematic sectional drawing of the adhesive film of FIG. It is a schematic sectional drawing of another adhesive film which can be provided to the inspection method of this invention. FIG. 3 is a schematic diagram illustrating one embodiment of the inspection method of the present invention.

  Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these embodiments.

[A. Adhesive film that can be used in the inspection method of the present invention]
A-1. Whole constitution of the pressure-sensitive adhesive film The pressure-sensitive adhesive film that can be subjected to the inspection method of the present invention has a long resin film and a pressure-sensitive adhesive layer provided on one surface of the resin film, and the resin film and the pressure-sensitive adhesive It has a through hole integrally penetrating the agent layer. In the present specification, “elongate” means an elongated shape whose length is sufficiently long with respect to the width, for example, an elongated shape whose length is 10 times or more, preferably 20 times or more with respect to the width. Including.

  FIG. 1 is a schematic perspective view of an adhesive film that can be used in the inspection method of the present invention, and FIG. 2A is a cross-sectional view thereof. The adhesive film 100 has a long shape, and is typically wound in a roll shape as shown in FIG. The adhesive film 100 has a long resin film 10 and an adhesive layer 20 provided on one surface of the resin film 10. The adhesive film 100 has a through-hole 30 that penetrates the resin film 10 and the adhesive layer 20 integrally. The through holes 30 may be arranged at predetermined intervals (that is, in a predetermined pattern) in the longitudinal direction and / or the width direction. The arrangement pattern of the through holes 30 can be appropriately set according to the purpose. For example, as shown in FIG. 1, the through holes 30 can be arranged at substantially equal intervals in both the long direction and the width direction. Note that "substantially equal intervals in both the longitudinal direction and the width direction" means that the intervals in the longitudinal direction are equal intervals, and that the intervals in the width direction are equal intervals. It is not necessary that the interval in the scale direction is equal to the interval in the width direction. For example, when the interval in the long direction is L1 and the interval in the width direction is L2, L1 = L2 or L1 ≠ L2. Alternatively, the through holes 30 may be arranged at substantially equal intervals in the longitudinal direction and at different intervals in the width direction; arranged at different intervals in the elongated direction and substantially in the width direction. They may be arranged at equal intervals (all not shown). When the through-holes are arranged at different intervals in the longitudinal direction or the width direction, the intervals between adjacent through-holes may all be different, or only a part (the interval between specific adjacent through-holes) may be different. Good. Alternatively, a plurality of regions may be defined in the longitudinal direction of the adhesive film 100, and the intervals between the through holes 30 in the longitudinal direction and / or the width direction may be set for each region.

  Practically, as shown in FIG. 2B, a long separator 22 is temporarily attached to the pressure-sensitive adhesive layer 20 in a releasable manner to protect the pressure-sensitive adhesive layer until actual use and to enable roll formation. I have. In this case, as shown in FIG. 2B, the through hole 30 integrally penetrates through the separator 22, the pressure-sensitive adhesive layer 20, and the resin film 10.

  Any appropriate shape can be adopted as the plan view shape of the through hole 30 depending on the purpose. Specific examples include a circle, an ellipse, a square, a rectangle, and a diamond.

  Typically, the adhesive film that can be subjected to the inspection method of the present invention is transparent. The transmittance of light having a wavelength of 550 nm of the adhesive film (excluding through holes) is, for example, 80% or more, and preferably 90% or more. By having such a transmittance, when the pressure-sensitive adhesive film is used as a surface protective film or a mask when processing a predetermined portion of the film, the pressure-sensitive adhesive film and the film to be processed are left bonded together. The processing status can be confirmed (for example, shape inspection, optical inspection, and the like of the non-polarized portion of the polarizer can be performed).

A-2. Resin film The resin film 10 can function as a base material of the adhesive film 100. As the resin film, a film having high hardness (for example, elastic modulus) is preferable. This is because the deformation of the through-hole during transportation and / or lamination can be prevented. Examples of the material for forming the resin film include ester resins such as polyethylene terephthalate resins, cycloolefin resins such as norbornene resins, olefin resins such as polypropylene, polyamide resins, polycarbonate resins, and copolymer resins thereof. Is mentioned. Preferably, it is an ester resin (particularly, a polyethylene terephthalate resin). With such a material, there is an advantage that the elastic modulus is sufficiently high and deformation of the through-hole hardly occurs even when a tension is applied during transportation and / or lamination.

  The thickness of the resin film is typically from 20 μm to 250 μm, and preferably from 30 μm to 150 μm. With such a thickness, there is an advantage that deformation of the through-hole hardly occurs even when tension is applied during transport and / or lamination.

The elastic modulus of the resin film is preferably from 2.2 kN / mm ^{2 to} 4.8 kN / mm ² . When the elastic modulus of the resin film is in such a range, there is an advantage that deformation of the through-hole hardly occurs even when a tension is applied during transportation and / or lamination. The elastic modulus is measured according to JIS K6781.

  The tensile elongation of the resin film is preferably 90% to 170%. When the tensile elongation of the resin film is in such a range, there is an advantage that the resin film is not easily broken during transportation. The tensile elongation is measured according to JIS K6781.

A-3. Pressure-sensitive adhesive layer Any appropriate pressure-sensitive adhesive can be adopted as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer. Examples of the base resin of the pressure-sensitive adhesive include an acrylic resin, a styrene resin, and a silicone resin. Acrylic resins are preferred from the viewpoints of chemical resistance, adhesion for preventing the intrusion of the treatment liquid during immersion, and the degree of freedom for the adherend. Examples of the crosslinking agent that can be included in the pressure-sensitive adhesive include an isocyanate compound, an epoxy compound, and an aziridine compound. The pressure-sensitive adhesive may include, for example, a silane coupling agent. The formulation of the adhesive can be set appropriately according to the purpose.

  The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 60 μm, and more preferably 3 μm to 30 μm. If the thickness is too small, the adhesiveness becomes insufficient, and air bubbles and the like may enter the adhesive interface. If the thickness is too large, problems such as sticking out of the pressure-sensitive adhesive are likely to occur.

A-4. Separator The separator 22 has a function as a protective material for protecting the pressure-sensitive adhesive film (pressure-sensitive adhesive layer) until practical use. Further, by using the separator, the pressure-sensitive adhesive film can be favorably wound into a roll. Examples of the separator include plastic (eg, polyethylene terephthalate (PET), polyethylene, polypropylene) films, nonwoven fabrics, and the like, which are surface-coated with a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent. Paper and the like. Any appropriate thickness can be adopted for the thickness of the separator depending on the purpose. The thickness of the separator is, for example, 10 μm to 100 μm.

[B. Inspection methods]
The inspection method of the present invention includes a step of imaging the surface of the pressure-sensitive adhesive film to obtain image data of the surface, and a step of analyzing the obtained image data to inspect the through-hole.

B-1. FIG. 3 is a schematic diagram illustrating one embodiment of the inspection method of the present invention. In the embodiment, the inspection method of the present invention is performed using the inspection device 200. The inspection device 200 includes an illumination unit 220 and an imaging unit 240 arranged on one side of the adhesive film 100 to be inspected, a light shielding material 260 arranged on the other side, and an image analysis unit connected to the imaging unit 240. 280. The light blocking member 260 may be omitted depending on the purpose or the like.

  In the embodiment shown in FIG. 3, light is radiated to one surface of the adhesive film 100 from the illumination unit 220 provided on one side of the adhesive film 100, and an image is provided on the one side. The reflected light is imaged by the unit 240. By imaging the reflected light, the inspection of the through-hole formed in the transparent adhesive film can be suitably performed. Preferably, the illumination unit 220 is a coaxial epi-illumination unit, and irradiates the light vertically to one surface of the adhesive film 100 such that the optical axis of the irradiation light is parallel to the imaging optical axis. Here, "the optical axis of the irradiation light is parallel to the imaging optical axis" includes that the optical axis of the irradiation light is coaxial with the imaging optical axis. Further, "irradiating light perpendicular to one surface of the adhesive film" means substantially perpendicularly to the main surface of the adhesive film (for example, at an irradiation angle of 90 ° ± 2 °, preferably 90 ° ± 1 °). ) Including irradiating light. By irradiating light in this way, reflection of irradiation light does not occur in the through-hole portion, but satisfactorily regular reflection light can be obtained in other portions.

  The light irradiation may be performed on the resin film side of the pressure-sensitive adhesive film, or may be performed on the pressure-sensitive adhesive layer side (if present, on the separator side). From the viewpoint of suitably obtaining regular reflection light, it is preferable to irradiate the surface with the higher smoothness with light.

  The imaging may be performed while transporting the long adhesive film in the longitudinal direction, or may be performed after transport is stopped. By performing imaging while transporting, it is possible to avoid stopping the transport line and improve inspection efficiency.

  The lighting unit 220 can be configured using any appropriate light source. The light source may be a white light source or a monochromatic light source. Specific examples of the light source include a fluorescent lamp, a halogen lamp, a metal halide lamp, and an LED. When performing coaxial epi-illumination, the illumination unit 220 is typically configured using a light source, a half mirror, an optical lens (such as a telecentric lens), and the like. The light is reflected toward the imaging unit 240 while being reflected toward the imaging unit 240.

  The imaging unit 240 is typically a camera configured using a lens and an image sensor. One or more imaging units are preferably provided so that the entire width of the adhesive film can be imaged. Further, the imaging unit is preferably set to perform imaging at predetermined intervals in accordance with the transport speed of the adhesive film, so that continuous images can be taken in the longitudinal direction.

  The light shielding material 260 is provided on the other side of the adhesive film (hereinafter, may be referred to as “non-irradiation side”). By providing the light-blocking material, light can be prevented from entering from the non-irradiation side of the adhesive film, and the reflected light at the portion excluding the through-hole can be appropriately imaged. Such an effect is particularly preferable when the transport line is configured such that the upstream or downstream portion (the downstream portion in FIG. 3) of the adhesive film is present on the non-irradiation side of the imaging target region of the adhesive film. Can be obtained. This is because the upstream or downstream portion reflects the irradiation light that has passed through the through-hole, and can prevent the reflected light from again passing through the through-hole and entering the imaging unit.

  The image captured by the imaging unit 240 is typically sent to the image analysis unit 280 as an electric signal.

B-2. Inspection Next, the through-hole of the adhesive film is inspected based on the obtained image. Typically, the presence or absence, shape, arrangement pattern, and the like of the through holes are inspected. The inspection can be performed by the image analysis unit 280 analyzing the image data sent from the imaging unit 240.

  The analysis of the image data can be performed, for example, based on the luminance information. Specifically, in the image data (reflected light image data) obtained in the embodiment shown in FIG. 3, the brightness of the through-hole portion that does not reflect the irradiation light is low, and the brightness of the other portions is high. Therefore, it is possible to specify the through-hole portion based on the contrast ratio in the obtained image data and inspect the shape thereof. For example, an image serving as a model is registered in advance, and the specified through-hole can be determined to be normal or abnormal with reference to the degree of coincidence with the shape of the model image, the area (the number of pixels), and the like. In another embodiment, the inspector visually recognizes the through-hole and inspects the shape and the like by enlarging and displaying the obtained image data on a display monitor (not shown) connected to the image analyzer. be able to. Inspection of the presence or absence of the through-hole and the arrangement pattern can be similarly performed based on the luminance information.

[C. Method for producing adhesive film]
The method for producing a pressure-sensitive adhesive film of the present invention comprises preparing a transparent pressure-sensitive adhesive film having a long resin film and a pressure-sensitive adhesive layer provided on one surface of the resin film, the resin film and the pressure-sensitive adhesive. The method includes forming a through hole integrally penetrating the agent layer, and inspecting a long adhesive film having the through hole by the inspection method.

C-1. Long pressure-sensitive adhesive film A long pressure-sensitive adhesive film is typically obtained by laminating a pressure-sensitive adhesive layer on one surface of a long resin film. The pressure-sensitive adhesive layer can be laminated by any appropriate method. Specific examples include a method of applying and drying an adhesive solution on a resin film, and a method of forming an adhesive layer on a separator and transferring the adhesive layer to the resin film. Examples of the coating method include roll coating such as reverse coating and gravure coating, spin coating, screen coating, fountain coating, dipping, and spraying.

  When the pressure-sensitive adhesive film further has a separator temporarily attached to the pressure-sensitive adhesive layer in a releasable manner, the separator may be laminated on a laminate of a resin film / pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is formed on the separator. A laminate of the pressure-sensitive adhesive may be laminated on a resin film.

  The resin film, the pressure-sensitive adhesive layer and the separator are as described in section A.

C-2. Formation of Through Holes Next, through holes are formed in the pressure-sensitive adhesive film (resin film / pressure-sensitive adhesive layer laminate or resin film / pressure-sensitive adhesive layer / separator laminate). The through hole integrally penetrates the resin film and the pressure-sensitive adhesive layer (and the separator, if present). The through-hole may be formed, for example, by cutting the adhesive film or removing a predetermined portion of the adhesive film (for example, laser ablation or chemical dissolution). Examples of the cutting method include a method of cutting mechanically using a cutting blade (punching type) such as a Thomson blade or a picnic blade, a water jet, or a method of cutting by irradiating a laser beam.

  Cutting by the cutting blade may be performed in any suitable manner. For example, the cutting may be performed using a punching device in which a plurality of cutting blades are arranged in a predetermined pattern, or may be performed by moving the cutting blades using an apparatus such as an XY plotter. As described above, since the cutting blade can be moved and cut so as to correspond to a predetermined position of the adhesive film, a through hole can be formed at a desired position of the adhesive film with high accuracy. In one embodiment, the cutting by the cutting blade may be performed while appropriately conveying the long adhesive film while being conveyed in a roll. More specifically, by appropriately adjusting the timing of cutting and / or the moving speed of the cutting blade in consideration of the transport speed of the adhesive film, a through hole can be formed at a desired position of the adhesive film. The punching device may be a reciprocating method (flat punching) or a rotary method (rotation).

As a laser used for cutting, any appropriate laser can be adopted as long as the adhesive film can be cut. Preferably, a laser capable of emitting light having a wavelength in the range of 193 nm to 10.6 μm is used. Specific examples include a gas laser such as a CO ₂ laser and an excimer laser; a solid laser such as a YAG laser; and a semiconductor laser. Preferably, a CO ₂ laser is used. At the time of cutting, the laser beam irradiation conditions can be set to any appropriate conditions, for example, depending on the laser used. The output condition is, for example, 0.1 W to 250 W when a CO ₂ laser is used.

  The laser ablation is performed in any suitable manner. Any appropriate laser can be adopted as a laser used for laser ablation. As a specific example, a laser similar to the laser used at the time of the above-mentioned cutting is mentioned. At the time of laser ablation, the irradiation conditions (output conditions, moving speed, number of times) of the laser beam are determined according to the material for forming the adhesive film (substantially, the resin film and the adhesive layer), the thickness of the adhesive film, and a plan view of the through hole. Any appropriate condition can be adopted according to the shape, the area of the through hole, and the like.

  When cutting the adhesive film, it is preferable to apply a patch to one side of the adhesive film. Specifically, a patch is applied to the surface of the adhesive film on the end side in the cutting direction. By using the patch, when the patch is peeled off from the adhesive film after cutting, perforation scum can be removed at the same time. Specifically, the patch can be peeled off from the adhesive film in a state where the perforated scum adheres to the patch. As a result, productivity can be significantly improved. In addition, by using the patch, deformation of the adhesive film due to cutting can be suppressed. For example, when cutting with a cutting blade, deformation of the adhesive layer can be particularly suppressed.

  In a preferred embodiment, the through-hole is formed by cutting the surface of the pressure-sensitive adhesive film halfway through the patch. According to such an embodiment, a through hole integrally penetrating the resin film and the pressure-sensitive adhesive layer (and the separator, if present) can be satisfactorily formed. Moreover, when peeling a backing material from an adhesive film, perforation | scuff scum can be removed satisfactorily.

  As the patch, a polymer film is preferably used. As the polymer film, a film similar to the above resin film can be used. Further, a soft (for example, low elastic modulus) film such as a polyolefin (for example, polyethylene) film can be used. In one embodiment, a film having high hardness (for example, elastic modulus) is preferably used as the polymer film. This is because deformation of the pressure-sensitive adhesive film due to cutting can be favorably suppressed. The thickness of the polymer film is preferably 20 μm to 100 μm.

  Preferably, the patch is attached to the adhesive film with an adhesive. By attaching the patch to the adhesive film, it is possible to prevent problems such as displacement of the patch during cutting. Moreover, when peeling a backing material from an adhesive film, perforation | scuff scum can be removed satisfactorily. Any appropriate pressure-sensitive adhesive may be used as the pressure-sensitive adhesive to be attached to the pressure-sensitive adhesive material, as long as the pressure-sensitive adhesive has an adhesive force capable of peeling the pressure-sensitive adhesive material from the pressure-sensitive adhesive film after cutting. In one embodiment, an adhesive layer is previously formed on the patch. The thickness of the pressure-sensitive adhesive layer formed on the patch is preferably 1 μm to 50 μm.

  In one embodiment, it is preferable to make the shape of the patch correspond to the shape of the adhesive film. For example, a long adhesive material is used for a long adhesive film. According to such a shape, when peeling the backing material from the adhesive film, perforation scum can be satisfactorily removed. In addition, perforation scum can be continuously removed, and productivity can be remarkably improved.

  In forming the through holes, it is preferable to cut the adhesive film from the separator side. By cutting from the separator side, the effect on the lamination of the adhesive film obtained by cutting can be suppressed. Specifically, when cutting with a cutting blade, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film may deform following the cutting blade. When cut from the resin film side, the pressure-sensitive adhesive layer may swell on the pressure-sensitive adhesive surface side of the obtained pressure-sensitive adhesive film, and a bulge may be formed on the periphery of the through hole. As a result, when the obtained adhesive film is attached to the adherend, bubbles may be generated around the through-hole. On the other hand, when cutting from the separator side, the pressure-sensitive adhesive layer can be deformed following the cutting blade, but the peripheral edge of the through-hole of the obtained pressure-sensitive adhesive film on the pressure-sensitive adhesive side is in a smooth state (for example, an arc-shaped surface). Even when attached to the body, the generation of bubbles can be prevented. In addition, by cutting from the separator side, when a patch is used, when peeling the patch from the adhesive film after cutting, perforation scum can be satisfactorily removed. For example, it is possible to prevent a problem that only a part (typically, a separator part) of the perforated waste is removed.

  As described above, through holes can be formed in the adhesive film in a predetermined arrangement pattern.

C-3. Inspection of pressure-sensitive adhesive film After the formation of the through holes, the pressure-sensitive adhesive film is inspected by the above-mentioned inspection method. Preferably, the inspection is performed continuously after forming the through-hole in the adhesive film which is a laminate of the resin film / the adhesive layer / the separator. Specifically, after forming the through-hole, the inspection is performed once without winding up the adhesive film. As described above, by continuously performing the inspection after the formation of the through-hole and determining whether or not the through-hole having a desired shape is formed, for example, an adhesive film having a formation defect of the through-hole is practically used. Can be prevented.

  In one embodiment, after inspection, the adhesive film can be put into practical use without being wound up on a roll. In another embodiment, after inspection, the adhesive film can be wound up on a roll and stored until ready for service.

[D. Use of adhesive film]
The pressure-sensitive adhesive film having the through holes can be suitably used, for example, as a surface protection film or a mask when selectively treating a predetermined portion of a film (typically, a long film). Specific examples of the selective treatment include decolorization, coloring, perforation, development, etching, patterning (for example, formation of an active energy ray-curable resin layer), chemical modification, and heat treatment. By using the pressure-sensitive adhesive film having the through-holes, continuous processing can be performed while the rolls are conveyed, so that the processing efficiency of various selective processing can be extremely increased. Furthermore, by using an adhesive film having a through-hole, it is possible to precisely control and arrange a portion to be selectively processed over the entire length of the long film. When the final product is cut, the variation in quality of each final product can be significantly suppressed. In one embodiment, the pressure-sensitive adhesive film having a through hole is used when a polarizer is selectively decolorized to produce a polarizer having a non-polarized portion (typically, a long polarizer). Can be By using a pressure-sensitive adhesive film having a through-hole for the purpose, a non-polarized portion corresponding to a camera portion or the like of an image display device can be suitably formed, so that multifunctional and highly functional electronic devices such as an image display device can be formed. Low-cost, high-yield, high-productivity production of polarizers suitable for manufacturing.

  The inspection method of the present invention is suitable for producing a pressure-sensitive adhesive film which can be suitably used as a surface protective film or a mask when selectively treating a predetermined portion of a film (typically, a long film). Can be used.

DESCRIPTION OF SYMBOLS 10 Resin film 20 Adhesive layer 30 Through-hole 100 Adhesive film 200 Inspection device 220 Illumination part 240 Imaging part 260 Light shielding material 280 Image analysis part

Claims (6)

Inspect a transparent adhesive film having a long resin film and an adhesive layer provided on one surface of the resin film, and having a through hole integrally penetrating the resin film and the adhesive layer. A way to
A step of imaging the surface of the adhesive film to obtain image data of the surface,
Analyzing the image data to inspect the through-hole,
The imaging of the surface of the adhesive film is performed by irradiating light to one surface of the adhesive film and imaging the reflected light thereof ,
An inspection method, wherein the irradiation of the light is performed by irradiating the light perpendicular to one surface of the adhesive film such that the optical axis of the irradiation light is parallel to the imaging optical axis . The inspection method according to claim 1, wherein the pressure-sensitive adhesive film further includes a long separator temporarily detachably attached to the pressure-sensitive adhesive layer. The inspection method according to claim 2 , wherein the through hole integrally penetrates the separator, the resin film, and the adhesive layer. The inspection method according to any one of claims 1 to 3 , wherein the pressure-sensitive adhesive film is used as a surface protective film or a mask when selectively treating a predetermined portion of the long film. The inspection method according to any one of claims 1 to 4, wherein in a state in which a light-blocking material is arranged on the other side of the adhesive film, one surface of the adhesive film is irradiated with light, and the reflected light is imaged. . Having a long resin film and an adhesive layer provided on one surface of the resin film, preparing a transparent adhesive film,
Forming a through hole integrally penetrating the resin film and the pressure-sensitive adhesive layer, and inspecting the pressure-sensitive adhesive film by the inspection method according to any one of claims 1 to 5,
A method for producing a long pressure-sensitive adhesive film having a through hole, comprising: