CN107036547A - The inspection method and manufacture method of the bonding film of lengthwise shape with through hole - Google Patents
The inspection method and manufacture method of the bonding film of lengthwise shape with through hole Download PDFInfo
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- CN107036547A CN107036547A CN201610868229.6A CN201610868229A CN107036547A CN 107036547 A CN107036547 A CN 107036547A CN 201610868229 A CN201610868229 A CN 201610868229A CN 107036547 A CN107036547 A CN 107036547A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/49—Scattering, i.e. diffuse reflection within a body or fluid
- G01N21/53—Scattering, i.e. diffuse reflection within a body or fluid within a flowing fluid, e.g. smoke
- G01N21/534—Scattering, i.e. diffuse reflection within a body or fluid within a flowing fluid, e.g. smoke by measuring transmission alone, i.e. determining opacity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
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- Chemical Kinetics & Catalysis (AREA)
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- Adhesive Tapes (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention provides a kind of inspection method and manufacture method of the bonding film of the lengthwise shape with through hole, and the bonding film can rightly be used as surface protection film or mask when handling the predetermined part of lengthwise shape film.A kind of inspection method, it is the method checked transparent bonding film, the bonding film has a resin film and the adhesive phase located at a face of the resin film of lengthwise shape, and with by the through hole of the resin film and the adhesive phase integratedly insertion, the inspection method includes：The process for being shot to the surface of the bonding film and obtaining the view data on the surface；And process to check the through hole is analyzed the view data, it is to be shot to carry out by a face irradiation light to the bonding film and the reflected light to the light for the shooting on the surface of the bonding film.
Description
Technical field
The present invention relates to the inspection method and manufacture method of the bonding film of the lengthwise shape with through hole.
Background technology
For the image display device of mobile phone, notebook personal computer (PC) etc., exist and be equipped with camera
Deng the image display device of internal electron parts.For the purpose of camera performance to improve such image display device etc.,
Various researchs (for example, patent document 1~7) are carried out.But, due to the board-like information processor of smart mobile phone, touch surface
Quick popularization, it may be desirable to further improve camera performance etc..In addition, shape in order to tackle image display device is more
Sample and multifunction, it is desirable to partly polarization plates with polarization property.In order to industrially realize these phases with commercial
Hope, it may be desirable to the cost manufacture image display device that can be allowed and/or its parts, as a result, such in order to determine
Technology, also remains various research items.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2011-81315 publications
Patent document 2：Japanese Unexamined Patent Publication 2007-241314 publications
Patent document 3：No. 2004/0212555 specification of U.S. Patent Application Publication No.
Patent document 4：KR published patent 10-2012-0118205 publications
Patent document 5：Korean Patent No. 10-1293210 publications
Patent document 6：Japanese Unexamined Patent Publication 2012-137738 publications
Patent document 7：No. 2014/0118826 specification of U.S. Patent Application Publication No.
The content of the invention
Problems to be solved by the invention
The present invention the problem of solving above-mentioned conventional in order to make, and its main purpose is to provide a kind of with insertion
The inspection method of the bonding film of the lengthwise shape in hole, the bonding film can rightly be used as carrying out in the predetermined part to lengthwise shape film
Surface protection film or mask when processing.
The solution used to solve the problem
The present invention provides a kind of method for checking transparent bonding film, and the bonding film has the resin film of lengthwise shape and is located at
The adhesive phase in one face of the resin film, and with by the through hole of the resin film and the adhesive phase integratedly insertion.
The inspection method of the present invention includes：The process for being shot to the surface of the bonding film and obtaining the view data on the surface；It is right
The view data is analyzed the process to check the through hole, and the shooting on the surface of the bonding film passes through one to the bonding film
The individual face irradiation light and reflected light to the light is shot to carry out.
In 1 technical scheme, with the optical axis of irradiation light with shooting the parallel mode of optical axis one to above-mentioned bonding film
Face vertically irradiation light.
In 1 technical scheme, above-mentioned bonding film also has is temporarily fixed on above-mentioned adhesive in the way of it can peel off
The barrier film of the lengthwise shape of layer.
In 1 technical scheme, above-mentioned through hole is integral by above-mentioned barrier film, above-mentioned resin film and above-mentioned adhesive phase
Ground insertion.
In 1 technical scheme, above-mentioned bonding film is used as the predetermined partially selectively progress in the film to lengthwise shape
Surface protection film or mask when processing.
According to another technical scheme of the present invention, it is possible to provide the manufacture method of the bonding film of the lengthwise shape with through hole.
The manufacture method of the present invention includes：Prepare transparent bonding film, the bonding film has the resin film of lengthwise shape and located at the resin
The adhesive phase in one face of film；Formed the through hole of the resin film and the adhesive phase integratedly insertion；And utilize
Above-mentioned inspection method checks the bonding film.
The effect of invention
According to the present invention, it is possible to provide the inspection method of a kind of lengthwise shape and the bonding film with through hole.Such bonding
Film can properly use oppose such as film (being the film of lengthwise shape as representative) it is predetermined partially selectively handled when
Surface protection film or mask.By using the inspection method of the present invention, it can obtain with the excellent through hole such as form accuracy
Bonding film, as a result, the processing using the selectivity of the bonding film can be carried out with higher precision.
Brief description of the drawings
Fig. 1 is the approximate three-dimensional map for the bonding film for being available for the inspection method of the present invention.
Fig. 2A is the general profile chart of Fig. 1 bonding film.
Fig. 2 B are the general profile charts for another bonding film for being available for the inspection method of the present invention.
Fig. 3 is the skeleton diagram for 1 embodiment for illustrating the inspection method of the present invention.
Description of reference numerals
10th, resin film；20th, adhesive phase；30th, through hole；100th, bonding film；200th, check device；220th, Lighting Division；
240th, shoot part；260th, light screening material；280th, graphical analysis portion.
Embodiment
Hereinafter, embodiments of the present invention are illustrated, the present invention is not limited to these embodiments.
[A. is available for the bonding film of the inspection method of the present invention]
A-1. the overall structure of bonding film
Being available for the bonding film of the inspection method of the present invention has the resin film of lengthwise shape and one located at the resin film
The adhesive phase in face, and with by the through hole of the resin film and the adhesive phase integratedly insertion.In this manual,
" lengthwise shape " refers to length relative to the sufficiently long elongated shape of width, including such as length is more than 10 times of width, preferably
It is more than 20 times of elongated shape.
Fig. 1 is the approximate three-dimensional map for the bonding film for being available for the inspection method of the present invention, and Fig. 2A is its sectional view.Bonding film
100 be lengthwise shape, as representative, as shown in Figure 1 wound into rolls.Bonding film 100 has the He of resin film 10 of lengthwise shape
Adhesive phase 20 located at a face of resin film 10.Bonding film 100 has resin film 10 and adhesive phase 20 integratedly
The through hole 30 of insertion.Through hole 30 can alongst and/or width is at predetermined intervals (i.e., with predetermined figure
Case) configuration.The configuration pattern of through hole 30 can rightly be set according to purpose.For example, as shown in figure 1, through hole 30 can be along
Either direction in length direction and width substantially to configure at equal intervals.In addition, " alongst and width
Either direction in direction is substantially with equal intervals " interval that refers to length direction is at equal intervals and the interval of width is
At equal intervals, the interval of length direction and the interval of width are without equal.For example, the interval of length direction is being set to L1,
, both can be with L1=L2 when the interval of width is set into L2, can also L1 ≠ L2.Or, Ke Yishi, through hole 30 is along length
Direction is spent substantially to configure and configure at different intervals along width at equal intervals；Can also be, alongst
At different intervals configuration and along width substantially to configure at equal intervals (not shown).In through hole along length
In the case that direction or width are configured at different intervals, the interval of adjacent through hole both can be all different, also might be used
It is different with only a part (the specifically interval of adjacent through hole).Alternatively, it is also possible to be, in the length direction of bonding film 100
Multiple regions are provided, the interval of the through hole 30 on length direction and/or width is set respectively in regional.
In terms of practical application, as shown in Figure 2 B, it is fixed with temporarily in the way of it can peel off on adhesive phase 20 vertical
The barrier film 22 of long shape, adhesive phase is protected untill actual use, and can roll to be formed.In this case, such as
Shown in Fig. 2 B, through hole 30 is by barrier film 22, adhesive phase 20 and the integratedly insertion of resin film 10.
The plan view shape of through hole 30 can be according to purpose using any appropriate shape.As concrete example, circle can be included
Shape, ellipse, square, rectangle, rhombus.
As representative, it is transparent to be available for the bonding film of the inspection method of the present invention.The bonding film (except through hole it
Wavelength outside) is, for example, more than 80% for the transmissivity of 550nm light, and preferably more than 90%.By with such transmission
Rate, in the case of the surface protection film or mask when being used as handling the predetermined part of film by the bonding film, energy
It is enough to keep confirming treatment situation the bonding film and state that the film of process object is fitted (for example, progress polarizer
Shape inspection, the optical check in unpolarized portion etc.).
A-2. resin film
Resin film 10 can as the base material of bonding film 100 function.For resin film, preferred hardness is (for example, elasticity
Modulus) higher film.The reason is that the deformation of through hole when can prevent from conveying and/or fitting.It is used as the formation of resin film
Material, can include the cyclenes system resins such as the fat system such as polyethylene terephthalate system resin resin, norbornene resin,
The olefin-based resins such as polypropylene, polyamide series resin, polycarbonate-based resin, their copolymer resin etc..Preferably fat
It is resin (especially, polyethylene terephthalate system resin).If such material, then flexible modulus is enough
Height, tension force is applied when conveying and/or laminating, it is also difficult to produce advantage as the deformation of through hole.
As representative, the thickness of resin film is 20 μm~250 μm, preferably 30 μm~150 μm.If such thickness
Degree, then with when conveying and/or laminating apply tension force, also be difficult to produce through hole deformation as advantage.
For the modulus of elasticity of resin film, preferably 2.2kN/mm2~4.8kN/mm2.If the modulus of elasticity of resin film is
Such scope, then with when conveying and/or laminating apply tension force, also be difficult to produce through hole deformation as it is excellent
Point.In addition, modulus of elasticity is foundation JIS K 6781 to determine.
For the tensile elongation of resin film, preferably 90%~170%.If the tensile elongation of resin film is so
Scope, then with being difficult to be broken such advantage in conveying.In addition, tensile elongation is foundation JIS K 6781 to survey
It is fixed.
A-3. adhesive phase
, can be using any appropriate adhesive as the adhesive for forming adhesive phase.As the base resin of adhesive,
Such as acrylic resin, phenylethylene resin series, silicon-type resin can be included.For chemical resistance, for preventing dipping
When treatment fluid immersion adaptation, the viewpoints such as the free degree of adherend are set out, preferred acrylic resin.It is used as bonding
The crosslinking agent that agent can contain, can include such as isocyanate compound, epoxide, dimethyleneimine compound.Adhesive
Such as silane coupler can also be contained.The cooperation prescription of adhesive can rightly be set according to purpose.
For the thickness of adhesive phase, preferably 1 μm~60 μm, more preferably 3 μm~30 μm.If thickness is excessively thin,
Then cohesive becomes insufficient, there is a situation where that bubble etc. enters adhesive interface.If thickness is blocked up, it is easy to generation adhesive and overflows
A problem that going out.
A-4. barrier film
Barrier film 22 has the function as protection materials of protecting bonding film (adhesive phase) untill practical application.
In addition, by using barrier film, bonding film can be coiled into web-like well.As barrier film, it can include using for example
The removers such as silicon-type remover, fluorine system remover, long chain alkyl acrylate series stripping agent carry out the modeling after the coating of surface
Expect (for example, polyethylene terephthalate (PET), polyethylene, polypropylene) film, non-woven fabrics or paper etc..For barrier film
Thickness, can be according to purpose using any appropriate thickness.The thickness of barrier film is, for example, 10 μm~100 μm.
[B. inspection methods]
The inspection method of the present invention includes：The view data on the surface is shot and is obtained to the surface of above-mentioned bonding film
Process；And the process analyzed the view data obtained and checked the through hole.
B-1. shoot
Fig. 3 is the skeleton diagram for 1 embodiment for illustrating the inspection method of the present invention.In this embodiment, it is of the invention
Inspection method carried out using check device 200.Check device 200 has：It is configured at the one of the bonding film 100 of check object
The Lighting Division 220 and shoot part 240 of side；It is configured at the light screening material 260 of opposite side；And the figure being connected with shoot part 240
As analysis portion 280.Light screening material 260 can be omitted according to purpose etc..
In the embodiment shown in Fig. 3, the Lighting Division 220 from the side located at above-mentioned bonding film 100 is to bonding film 100
A face irradiation light, shot using the reflected light of 240 pairs of light of shoot part located at the side.By shooting reflection
Light, rightly can carry out being formed at the inspection of the through hole of transparent bonding film.Preferably, Lighting Division 220 is coaxially to fall
Lighting Division is penetrated, with the optical axis of irradiation light with shooting the parallel mode of optical axis to a face of bonding film 100 vertically irradiation light.
This, " optical axis of irradiation light is parallel with shooting optical axis " includes the optical axis of irradiation light with shooting light shaft coaxle.In addition, " to bonding film
A face vertically irradiation light " include it is substantially vertical relative to the interarea of bonding film (such as with 90 ° ± 2 °, preferably with
90 ° ± 1 ° of irradiating angle) irradiation light.By such irradiation light, in insertion bore portion, the reflection of irradiation light is not produced, separately
On the one hand, normal reflection light can be obtained well in other parts.
The irradiation of above-mentioned light can both be carried out in the resin film side of bonding film, (can also have isolation in adhesive phase side
The situation of film, is barrier film side) carry out.For the viewpoint for rightly obtaining normal reflection light, preferably shone to the higher face of smoothness
Penetrate light.
Both the bonding film of lengthwise shape can be alongst conveyed while being shot on one side, can also stop conveying and come
Shot.By conveying while shot, the stopping of conveying production line can be avoided and inspection efficiency is improved.
Any appropriate light source can be used to constitute for Lighting Division 220.Light source both can be white light source or monochrome
Light source.As the concrete example of light source, fluorescent lamp, halogen tungsten lamp, metal-halide lamp, LED etc. can be included.Carrying out coaxially falling to penetrate photograph
In the case of bright, as representative, Lighting Division 220 is constituted using light source, half-reflecting mirror, optical lens (telecentric mirror is first-class) etc.,
Half-reflecting mirror reflects the light projected from light source towards bonding film 100, and makes the light that is reflected from bonding film 100 to shoot part
240 sides are passed through.
As representative, shoot part 240 is the camera constituted using camera lens and imaging sensor.Shoot part preferably with
The mode that can be shot to the whole width of bonding film is provided with one or more.In addition, shoot part is preferably set to according to viscous
The transporting velocity for closing film is shot at predetermined intervals, thereby, it is possible to shoot alongst continuous image.
Light screening material 260 is located at the opposite side (situation for existing below referred to as " non-irradiated side ") of bonding film.By setting
Light screening material, can prevent that the non-irradiated side of light from bonding film is incident, the reflected light to the part in addition to through hole is appropriate
Ground is shot.The bat of bonding film is especially being present in the upstream of the bonding film or downstream part (in Fig. 3, upstream portion)
Take the photograph the non-irradiated side of subject area mode constitute conveying production line in the case of, can rightly obtain such effect.It is former
Because being, the upstream or downstream part are reflected the irradiation light for having passed through through hole, can prevent the reflected light again by
Through hole and enter shoot part.
As representative, image is sent as electric signal to graphical analysis portion 280 obtained from being shot from shoot part 240.
B-2. check
Then, the through hole of bonding film is checked based on the image obtained.As representative, have to through hole
Nothing, shape, configuration pattern etc. are checked.The inspection can analyze the figure sent from shoot part 240 by graphical analysis portion 280
Carried out as data.
The analysis of view data can be carried out based on such as monochrome information.Specifically, in the embodiment party shown in Fig. 3
View data (reflected light is as data) obtained in formula, the brightness step-down for the insertion bore portion not reflected irradiation light,
The brightness of other parts is uprised.Thus, insertion bore portion is carried out based on the contrast ratio in the view data obtained special
It is fixed, it check that its shape.For example, the image as model can be pre-registered, between the shape with reference to model image
Consistent degree, area (pixel count) etc. by specific through hole be determined as it is normal or abnormal.In another embodiment, it will be obtained
The view data amplification obtained is shown in the display monitor (not shown) being connected with graphical analysis portion, and inspector by visual observation can
Carry out the inspection of identification and the shape of through hole etc..Also the presence or absence of through hole can similarly be carried out based on monochrome information, matched somebody with somebody
The inspection of placing graphic pattern.
[manufacture method of C. bonding films]
The manufacture method of the bonding film of the present invention includes：Prepare transparent bonding film, the bonding film has the tree of lengthwise shape
Adipose membrane and the adhesive phase located at a face of the resin film；Form the resin film and the adhesive phase that integratedly insertion is passed through
Through hole；And the bonding film of the lengthwise shape with through hole is checked using above-mentioned inspection method.
C-1. the bonding film of lengthwise shape
As representative, the bonding film of lengthwise shape can fold adhesive phase by a surface layer of the resin film in lengthwise shape and obtain
.Adhesive phase can be laminated by any appropriate method.As concrete example, the coating adhesive on resin film can be included molten
Liquid simultaneously makes the method for binder solution drying, forms adhesive phase on barrier film and the adhesive phase is replicated in into resin film
Method etc..As coating process, rolling method, spin-coating method, silk screen coating process, spraying process such as inverse painting, gravure coating can be included
(Japanese：Off ァ ウ Application テ ン コ ー テ ィ Application グ methods), infusion process, spray-on process (Japanese：ス プ レ ー methods).
In the case where bonding film also has and is temporarily fixed on the barrier film of adhesive phase in the way of it can peel off, isolation
Film can both be laminated in the layered product of resin film/adhesive phase, and adhesive phase can also be formed on barrier film, and will isolation
The laminate layers of film/adhesive are laminated on resin film.
For resin film, adhesive phase and barrier film, as being illustrated in A.
C-2. the formation of through hole
Then, in above-mentioned bonding film (layered product of resin film/adhesive phase or the layer of resin film/adhesive phase/barrier film
Stack) form through hole.Through hole is by resin film and adhesive phase (in the case where there is barrier film, and barrier film) one
The insertion of body ground.Through hole can for example, by bonding film cut-out or bonding film predetermined portions removal (for example, laser ablation or
Chemolysis) and formed.As cutting-off method, it can include and use such as Thomson knife, sharp knife (Japanese：ピ Na Network Le sword) etc.
The method that cutoff tool (blanking die), high pressure waterjet etc. come the method for mechanical cutting, irradiation laser to be cut off.
The cut-out of cutoff tool can be carried out by any appropriate pattern.Configured in a predetermined pattern for example, can both use
Have the blanking apparatus of multiple cutoff tools to carry out, can also use XY cut paint instrument as device carry out cutoff tool movement.
In such manner, it is possible to make cutoff tool move to cut off in the corresponding mode in the predetermined position with bonding film, therefore, it is possible to high-precision
Spend the desired position in bonding film and form through hole., can be while will for the cut-out of cutoff tool in 1 embodiment
The bonding film of lengthwise shape conveys (Japanese with roller：ロ ー Le is transported) while appropriately linking to carry out with the conveying.More specifically,
At the time of by considering the transporting velocity of bonding film come to cut-out and/or the translational speed of cutoff tool is rightly adjusted, from
And through hole can be formed in the desired position of bonding film.(beaten in addition, above-mentioned blanking apparatus both can be reciprocating manner
It is flat：It is flat to beat Chi) or rotation mode (rotation).
, can be using any appropriate laser as long as bonding film can be cut off as laser used in cut-out.It is preferred that
, use can radiate the laser of the light of the wavelength in the range of 193nm~10.6 μm.As concrete example, CO can be included2
The gas lasers such as laser, excimer laser；The solid state lasers such as YAG laser；Semiconductor laser.Preferably use
CO2Laser., can be according to for example used laser setup into arbitrarily just for the irradiation condition of laser when cut-out
When condition.Using CO2In the case of laser, power output condition is, for example, 0.1W~250W.
Above-mentioned laser ablation can be carried out by any appropriate pattern.As laser used in laser ablation, it can adopt
With any appropriate laser.As concrete example, the laser that used laser is same when can including with above-mentioned cut-out
Device., can be according to bonding film for the irradiation condition (power output condition, translational speed, number of times) of laser in laser ablation
Formation material, the thickness of bonding film, the plan view shape of through hole, the through hole of (being substantially resin film and adhesive phase)
Area etc. is using any appropriate condition.
When bonding film is cut off, preferably by fitting (Japanese：When て materials) it is connected to the one side of bonding film.It is specific and
Speech, fitting is connected to the bonding film surface of cutting direction end side.By using fitting, after severance by fitting from
When bonding film is peeled off, perforation slag can be also removed simultaneously.Specifically, can be by the state of perforation slag is attached to fitting
Fitting is peeled off from bonding film.As a result, productivity ratio can be improved especially.In addition, by using fitting, can suppress by cutting off
The deformation of caused bonding film.For example, in the case where being cut off using cutoff tool, can especially suppress the change of adhesive phase
Shape.
In a preferred embodiment, the midway of fitting is cut into from bonding film surface, and forms above-mentioned through hole.Root
According to such form, can be formed well by above-mentioned resin film and adhesive phase (and in the case where there is barrier film,
Also include barrier film) integratedly insertion through hole.In addition, when fitting is peeled off from bonding film, the slag that will can perforate is good
Remove well.
As above-mentioned fitting, polymeric membrane is preferably used.As polymeric membrane, it can be used same with above-mentioned resin film
Film.Moreover, (such as modulus of elasticity is relatively low) film soft as can also using polyolefin (for example, polyethylene) film.1
In individual embodiment, as polymeric membrane, the higher film of hardness (for example, modulus of elasticity) is preferably used.The reason is that can be good
Suppress the deformation of the bonding film caused by cut-out well.The thickness of polymeric membrane is preferably 20 μm~100 μm.
Preferably, fitting fits in bonding film using adhesive.By the way that fitting is fitted in into bonding film, Neng Goufang
A problem that only fitting is offset when cut-out.In addition, when fitting is peeled off from bonding film, can remove well
Perforation slag.As the adhesive that fitting is fitted, if with after severance can by fitting from bonding film peel off it is viscous
With joint efforts, so that it may use any appropriate adhesive.In 1 embodiment, adhesive phase is formed with fitting in advance.Formed
1 μm~50 μm are preferably in the thickness of the adhesive phase of fitting.
In 1 embodiment, preferably make the shape of fitting corresponding with the shape of bonding film.For example, relative to vertical
The bonding film of long shape, can be used the fitting of lengthwise shape.According to such shape, when fitting is peeled off from bonding film,
Perforation slag can be removed well.In addition, perforation slag can be removed continuously, productivity ratio can be extraordinarily improved.
It is preferred that breaking when through hole is formed from the barrier film lateral incision of bonding film.By disconnected from barrier film lateral incision, it can press down
Make the influence that the laminating of the bonding film to being obtained by cut-out is brought.Specifically, in the case of using cutoff tool cut-out, bonding
The adhesive phase of film can follow cutoff tool and deform.If disconnected from resin film lateral incision, adhesive phase is to the bonding film obtained
Heave bonding surface side, it is possible in the periphery formation bellying of through hole.If as a result, by the bonding film obtained fit in by
Viscous thing, then can produce bubble on the periphery of through hole.On the other hand, if disconnected from barrier film lateral incision, adhesive phase can be followed and cut
Breaking and deform, but the periphery of the bonding surface side of the through hole of the bonding film obtained is smooth state (for example, arc surface),
Even if fitting in generation of the adherend prevented also from bubble.In addition, by disconnected from barrier film lateral incision, using the feelings of fitting
Under condition, when fitting is peeled off from bonding film after severance, perforation slag can be removed well.Slag of for example only perforating can be prevented
A part (being barrier film part as representative) be removed such unfavorable condition.
As described above, can be with predetermined configuration pattern in bonding film formation through hole.
C-3. the inspection of bonding film
After through hole is formed, the inspection of bonding film is carried out using above-mentioned inspection method.Preferably, in being used as resin
After the bonding film formation through hole of the layered product of film/adhesive phase/barrier film, continuously checked.Specifically, formed
After through hole, checked for the time being without batching bonding film.So, formed through hole after continuously checked, to whether
It is formed with the through hole with desired shape to be differentiated, so as to prevent the formation for example with through hole bad
Bonding film is for practical application.
In 1 embodiment, after inspection, bonding film is not batched in rolls, so that it may for practical application.Implement another
In mode, after inspection, bonding film is batched in rolls, can be taken care of and be arrived for practical application.
[purposes of D. bonding films]
Bonding film with above-mentioned through hole rightly can be used as example to film (being the film of lengthwise shape as representative)
It is predetermined partially selectively handled when surface protection film or mask.As the concrete example of the selective processing,
Can include decolouring, coloring, perforation, development, etching, the patterning formation of layer (for example, active energy beam hardening resin),
Chemical modification, heat treatment., can be while with roller conveying while continuously being located by using the bonding film with through hole
Reason, therefore, it is possible to make the treatment effeciency of processing of various selectivity very high.Moreover, by using viscous with through hole
Film is closed, the part that optionally handle on the whole of the film in lengthwise shape critically can be controlled and be configured, therefore,
In the film severing from the lengthwise shape in the case of the final products of preliminary dimension, it can significantly suppress each final products
The deviation of quality.In 1 embodiment, the bonding film with through hole can be made optionally being decolourized to polarizer
Used when making the polarizer (being the polarizer of lengthwise shape as representative) with unpolarized portion.By by with through hole
Bonding film be used for the purposes, can rightly be formed can be corresponding with the camera section of image display device etc. unpolarized portion, because
This, can be achieved the low cost height suitable for the multifunction of the electronic devices such as image display device and the polarizer of multifunction
The large-duty manufacture of yield rate.
Industrial applicability
The inspection method of the present invention rightly can be used in the manufacture of bonding film, and the bonding film rightly can be used as right
Film (being the film of lengthwise shape as representative) it is predetermined partially selectively handled when surface protection film or mask.
Claims (6)
1. a kind of inspection method of the bonding film of the lengthwise shape with through hole, it is the side checked transparent bonding film
Method, the bonding film has a resin film and the adhesive phase located at a face of the resin film of lengthwise shape, and with this is set
The through hole of adipose membrane and the adhesive phase integratedly insertion, wherein,
The inspection method includes：
The process for being shot to the surface of the bonding film and obtaining the view data on the surface；And
Process to check the through hole is analyzed the view data,
The shooting on the surface of the bonding film is clapped by a face irradiation light to the bonding film and the reflected light to the light
Take the photograph to carry out.
2. the inspection method of the bonding film of the lengthwise shape according to claim 1 with through hole, wherein,
With the optical axis of irradiation light with shooting the parallel mode of optical axis to a face of the bonding film vertically irradiation light.
3. the inspection method of the bonding film of the lengthwise shape according to claim 1 or 2 with through hole, wherein,
The bonding film also has the barrier film for the lengthwise shape that described adhesive layer is temporarily fixed in the way of it can peel off.
4. the inspection method of the bonding film of the lengthwise shape according to claim 3 with through hole, wherein,
The through hole by the barrier film, the resin film and described adhesive layer integratedly insertion.
5. according to the inspection method of the bonding film of the lengthwise shape according to any one of claims 1 to 4 with through hole, its
In,
The bonding film be used as partially selectively handling in predetermined to the film of lengthwise shape when surface protection film
Or mask.
6. a kind of manufacture method of the bonding film of the lengthwise shape with through hole, it includes：
Prepare the resin film with lengthwise shape and adhesive phase, the transparent bonding film located at a face of the resin film；
Formed the through hole of the resin film and the adhesive phase integratedly insertion；And
Inspection method using the bonding film of the lengthwise shape with through hole any one of Claims 1 to 55 is viscous to this
Film is closed to be checked.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-194596 | 2015-09-30 | ||
| JP2015194596A JP6630527B2 (en) | 2015-09-30 | 2015-09-30 | Inspection method of adhesive film having through hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107036547A true CN107036547A (en) | 2017-08-11 |
| CN107036547B CN107036547B (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610868229.6A Active CN107036547B (en) | 2015-09-30 | 2016-09-29 | Method for inspecting and manufacturing vertically long adhesive film having through hole |
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| Country | Link |
|---|---|
| JP (1) | JP6630527B2 (en) |
| KR (1) | KR102345702B1 (en) |
| CN (1) | CN107036547B (en) |
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| JP2017067655A (en) | 2017-04-06 |
| KR20170038725A (en) | 2017-04-07 |
| JP6630527B2 (en) | 2020-01-15 |
| CN107036547B (en) | 2020-10-30 |
| KR102345702B1 (en) | 2021-12-30 |
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