KR102345702B1 - Method for inspecting adhesive film with through-hole - Google Patents

Abstract

(Project) To provide a method for inspecting an elongate pressure-sensitive adhesive film having a through hole, which can be preferably used as a surface protection film or mask when processing a predetermined portion of the long film.
(Solution Means) A method for inspecting a transparent adhesive film having a long resin film and an adhesive layer formed on one surface of the resin film, and having a through hole integrally penetrating the resin film and the adhesive layer, the method comprising: It includes the process of imaging the surface of an adhesion film and obtaining image data of the surface, and the process of analyzing the image data and examining the through hole, Imaging of the surface of the adhesion film is one side of the adhesion film The inspection method carried out by irradiating light to and imaging the reflected light.

Description

Inspection method of an adhesive film having a through hole {METHOD FOR INSPECTING ADHESIVE FILM WITH THROUGH-HOLE}

The present invention relates to a method for inspecting an adhesive film having a through hole.

DESCRIPTION OF RELATED ART Some image display apparatuses, such as a cellular phone and a notebook personal computer (PC), are equipped with internal electronic components, such as a camera. For the purpose of improving the camera performance of such an image display apparatus, etc., various examination is made|formed (for example, patent documents 1-7). However, with the rapid spread of smart phones and touch panel type information processing devices, further improvement in camera performance and the like is desired. Moreover, in order to respond to the diversification of the shape of an image display apparatus, and high functionalization, the polarizing plate which has polarization performance partially is calculated|required. It is desired to manufacture an image display device and/or a part thereof at an acceptable cost in order to industrially and commercially realize such a request, and various considerations remain in order to establish such a technology.

Japanese Patent Laid-Open No. 2011-81315 Japanese Laid-Open Patent Publication No. 2007-241314 Specification of US Patent Application Publication No. 2004/0212555 Korean Patent Publication No. 10-2012-0118205 Korean Patent Publication No. 10-1293210 Japanese Laid-Open Patent Publication No. 2012-137738 Specification of US Patent Application Publication No. 2014/0118826

The present invention has been made in order to solve the above conventional problems, and its main object is to be preferably used as a surface protection film or mask when processing a predetermined portion of a long film, a long adhesive having a through hole An object of the present invention is to provide a method for inspecting a film.

The present invention provides a method for inspecting a transparent adhesive film comprising a long resin film and an adhesive layer formed on one surface of the resin film, and having a through hole integrally penetrating the resin film and the adhesive layer. . The inspection method of the present invention includes a step of imaging the surface of the adhesive film to obtain image data of the surface, and a step of analyzing the image data and inspecting the through hole, wherein the imaging of the surface of the adhesive film is , it is implemented by irradiating light to one surface of the adhesion film, and imaging the reflected light.

In one embodiment, light is irradiated perpendicularly|vertically to one surface of the said adhesion film so that the optical axis of irradiation light may become parallel to an imaging optical axis.

In one embodiment, the said adhesive film further has the elongate separator affixed to the said adhesive layer so that peeling is possible.

In one embodiment, the said penetration hole has penetrated the said separator, the said resin film, and the said adhesive layer integrally.

In one embodiment, the said adhesive film is used as a surface protection film or a mask at the time of selectively processing a predetermined part of a long film.

According to another aspect of this invention, the manufacturing method of the elongate adhesive film which has a penetration hole is provided. The manufacturing method of this invention prepares a transparent adhesive film which has an elongate resin film and the adhesive layer formed on one side of the resin film, The resin film and this adhesive layer form a through hole integrally penetrating and inspecting the adhesive film by the inspection method.

ADVANTAGE OF THE INVENTION According to this invention, it is elongate and the inspection method of the adhesive film which has a penetration hole is provided. Such an adhesive film can be preferably used, for example, as a surface protection film or mask at the time of selectively processing a predetermined part of a film (typically a long film). By using the inspection method of the present invention, an adhesive film having a through hole excellent in shape precision and the like is obtained, and as a result, selective processing using the adhesive film can be performed with high precision.

1 is a schematic perspective view of an adhesive film that can be provided in the inspection method of the present invention.
FIG. 2A is a schematic cross-sectional view of the pressure-sensitive adhesive film of FIG. 1 .
2B is a schematic cross-sectional view of another adhesive film that may be provided in the inspection method of the present invention.
3 is a schematic diagram illustrating an embodiment of one of the inspection methods of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described, this invention is not limited to these embodiment.

[A. Adhesive film that may be provided in the inspection method of the present invention]

A-1. Overall composition of the adhesive film

The adhesive film which can be provided in the inspection method of this invention has a long resin film and the adhesive layer formed on one side of the resin film, It has a penetration hole which penetrates integrally through this resin film and this adhesive layer. As used herein, "long shape" means an elongate shape with a length sufficiently long with respect to the width, and includes, for example, an elongate shape with a length of 10 times or more, preferably 20 times or more with respect to the width.

1 is a schematic perspective view of an adhesive film that may be provided in the inspection method of the present invention, and FIG. 2A is a cross-sectional view thereof. The adhesion film 100 is elongate, and as typically shown in FIG. 1, it is wound up in roll shape. The adhesive film 100 has the long resin film 10 and the adhesive layer 20 formed in one surface of the resin film 10. The adhesive film 100 has the through-hole 30 which penetrates the resin film 10 and the adhesive layer 20 integrally. The through-holes 30 may be arranged at predetermined intervals (ie, in a predetermined pattern) in the long direction and/or the width direction. The arrangement pattern of the through-holes 30 may be appropriately set according to the purpose. For example, as shown in FIG. 1, the through-hole 30 can be arrange|positioned at substantially equal intervals also in any of a long direction and a width direction. In addition, "substantially equally spaced in both the long direction and the width direction" means that the intervals in the long direction are equally spaced and the intervals in the width direction are equally spaced, and the intervals in the long direction and the width direction are They don't have to be equal. For example, when the space|interval of a long direction is made into L1 and the space|interval of the width direction is made into L2, L1 = L2 may be sufficient and L1 ≠ L2 may be sufficient. Or the through-hole 30 may be arrange|positioned at substantially equal intervals in the direction of a long picture, and may be arrange|positioned by the space|interval which differs in the width direction; It may be arrange|positioned at different intervals in the elongate direction, and may be arrange|positioned at substantially equal intervals in the width direction (all are not shown in figure). When the through-holes are arranged at different intervals in the elongate direction or the width direction, all of the intervals of the adjacent through-holes may differ, or only a part (intervals of specific adjacent through-holes) may differ. Moreover, a some area|region may be prescribed|regulated by the long direction of the adhesion film 100, and the space|interval of the through-hole 30 in a long direction and/or the width direction may be set for each area|region.

Practically, as shown in FIG. 2B, the elongate separator 22 is temporarily affixed to the adhesive layer 20 so that peeling is possible, and while protecting an adhesive layer until actual use, roll formation is enabled. In this case, the through hole 30 has penetrated the separator 22, the adhesive layer 20, and the resin film 10 integrally, as shown to FIG. 2B.

As for the planar view shape of the through hole 30, any suitable shape may be adopted depending on the purpose. Specific examples include a circle, an ellipse, a square, a square, and a rhombus.

Typically, the pressure-sensitive adhesive film that can be provided in the inspection method of the present invention is transparent. The transmittance of light with a wavelength of 550 nm of the adhesive film (except through holes) is, for example, 80% or more, preferably 90% or more. By having such a transmittance|permeability, when the adhesive film is used as a surface protection film or a mask at the time of processing a predetermined part of a film, the processing condition with the adhesive film and the film to be processed bonding together. It can be confirmed (for example, the shape inspection of the non-polarization part of a polarizer, an optical inspection, etc. are performed).

A-2. resin film

The resin film 10 can function as a base material of the adhesion film 100 . The resin film is preferably a film having high hardness (eg, elastic modulus). This is because the deformation of the through hole at the time of conveyance and/or bonding can be prevented. Examples of the material for forming the resin film include ester-based resins such as polyethylene terephthalate-based resins, cycloolefin-based resins such as norbornene-based resins, olefinic resins such as polypropylene, polyamide-based resins, polycarbonate-based resins, and these Copolymer resin etc. are mentioned. Preferably, it is an ester-type resin (especially polyethylene terephthalate-type resin). If it is such a material, an elasticity modulus is sufficiently high, and there exists an advantage that the deformation|transformation of a penetration hole does not generate|occur|produce easily even if it applies tension|tensile_strength at the time of conveyance and/or bonding.

The thickness of the resin film is typically 20 µm to 250 µm, preferably 30 µm to 150 µm. If it is such a thickness, even if it applies tension|tensile_strength at the time of conveyance and/or bonding, it has the advantage that the deformation|transformation of a penetration hole does not generate|occur|produce easily.

The elastic modulus of the resin film is preferably 2.2 kN/mm 2 to 4.8 kN/mm 2 . If the elastic modulus of a resin film is such a range, even if it applies tension|tensile_strength at the time of conveyance and/or bonding, it has the advantage that the deformation|transformation of a penetration hole does not generate|occur|produce easily. In addition, an elastic modulus is measured based on JISK6781.

The tensile elongation of the resin film is preferably 90% to 170%. If the tensile elongation of a resin film is such a range, it has an advantage that it is hard to fracture|rupture during conveyance. In addition, tensile elongation is measured based on JISK6781.

A-3. adhesive layer

As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, any suitable pressure-sensitive adhesive may be employed. As base resin of an adhesive, an acrylic resin, a styrene resin, and silicone resin are mentioned, for example. From the viewpoints of chemical resistance, adhesion to prevent intrusion of the processing liquid during immersion, and the degree of freedom to an adherend, acrylic resins are preferred. As a crosslinking agent which may be contained in an adhesive, an isocyanate compound, an epoxy compound, and an aziridine compound are mentioned, for example. The pressure-sensitive adhesive may contain, for example, a silane coupling agent. The formulation prescription of an adhesive can be set suitably according to the objective.

The thickness of an adhesive layer becomes like this. Preferably they are 1 micrometer - 60 micrometers, More preferably, they are 3 micrometers - 30 micrometers. When thickness is too thin, adhesiveness will become inadequate and a bubble etc. may enter into an adhesion interface. When thickness is too thick, it will become easy to generate|occur|produce problems, such as an adhesive protruding.

A-4. separator

The separator 22 has a function as a protective material which protects an adhesion film (adhesive layer) until it uses for practical use. Moreover, by using a separator, an adhesion film can be wound up favorably in roll shape. As the separator, for example, a plastic (e.g., polyethylene terephthalate (PET), polyethylene, polypropylene) film, nonwoven fabric coated with a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent. Or paper etc. are mentioned. Any appropriate thickness can be employ|adopted for the thickness of a separator according to the objective. The thickness of the separator is, for example, 10 µm to 100 µm.

[B. method of inspection]

The inspection method of this invention includes the process of obtaining image data of the surface by imaging the surface of the said adhesion film, The process of analyzing the obtained image data and test|inspecting the penetration hole.

B-1. imaging

3 is a schematic diagram illustrating an embodiment of one of the inspection methods of the present invention. In the said embodiment, the inspection method of this invention is implemented using the inspection apparatus 200. As shown in FIG. The inspection apparatus 200 includes an illumination unit 220 and an imaging unit 240 arranged on one side of an adhesive film 100 to be inspected, a light shielding material 260 arranged on the other side, and an imaging unit ( 240) and an image analysis unit 280 connected thereto. The light blocking material 260 may be omitted depending on the purpose or the like.

In embodiment shown in FIG. 3, light is irradiated with respect to one surface of the adhesion film 100 from the illumination part 220 formed in one side of the said adhesion film 100, and the imaging provided in the one side. The reflected light is imaged by the unit 240 . By imaging reflected light, the test|inspection of the penetration hole formed in the transparent adhesive film can be performed preferably. Preferably, the illumination unit 220 is a coaxial falling illumination unit, and the light is vertically irradiated to one surface of the adhesive film 100 so that the optical axis of the irradiated light is parallel to the imaging optical axis. Here, "the optical axis of the irradiated light is parallel to the imaging optical axis" includes that the optical axis of the irradiated light is coaxial with the imaging optical axis. In addition, "irradiating light perpendicularly to one surface of the adhesive film" means substantially perpendicular to the main surface of the adhesive film (for example, 90 ° ± 2 °, preferably at an irradiation angle of 90 ° ± 1 ° ) including irradiating light. By irradiating the light in this way, the reflection of the irradiated light does not occur in the through-hole portion, while the specular reflected light can be satisfactorily obtained in the other portions.

Irradiation of the said light may be performed to the resin film side of an adhesion film, and may be performed to the pressure-sensitive adhesive layer side (the separator side when present). From the viewpoint of preferably obtaining specular light, it is preferable to irradiate light to the surface with higher smoothness.

Imaging may be performed, conveying an elongate adhesion film in a long direction, and may be performed after stopping conveyance. By imaging while conveying, the stop of a conveyance line can be avoided and inspection efficiency can be improved.

The lighting unit 220 may be configured using any suitable light source. A white light source may be sufficient as a light source, and a monochromatic light source may be sufficient as it. A fluorescent lamp, a halogen lamp, a metal halide lamp, LED etc. are mentioned as a specific example of a light source. In the case of performing coaxial falling illumination, the illumination unit 220 is typically configured using a light source, a half mirror, an optical lens (telecentric lens, etc.), and the half mirror uses an adhesive film ( While being reflected toward 100 ), the light reflected by the adhesive film 100 is transmitted to the imaging unit 240 side.

The imaging unit 240 is typically a camera configured using a lens and an image sensor. Preferably, one or more imaging parts are provided so that the full width of an adhesion film may be imaged. Moreover, the imaging part is preferably set so that it may image at predetermined intervals according to the conveyance speed of an adhesion film, and, thereby, it becomes possible to image the image continuous in a long direction by this.

The light-shielding material 260 is formed in the other side of the adhesion film (Hereinafter, it may call a "non-irradiation side"). By providing a light-shielding material, it can prevent that light enters from the non-irradiation side of an adhesion film, and the reflected light in the part except a through hole can be imaged preferably. Such an effect can be obtained particularly preferably when the conveying line is configured such that an upstream or downstream portion (upstream portion in Fig. 3) of the pressure-sensitive adhesive film is present on the non-irradiated side of the imaging target region of the pressure-sensitive adhesive film. This is because it is possible to prevent the upstream or downstream portion from reflecting the irradiated light that has passed through the through hole, and the reflected light from passing through the through hole again and entering the imaging unit.

The image picked up by the imaging unit 240 is typically transferred to the image analysis unit 280 as an electrical signal.

B-2. test

Next, based on the obtained image, the penetration hole of an adhesion film is test|inspected. Typically, the presence or absence of a through hole, shape, arrangement pattern, etc. are inspected. The inspection can be performed by having the image analysis unit 280 analyze the image data transferred from the imaging unit 240 .

The analysis of the image data can be performed based on, for example, luminance information. Specifically, in the image data (reflected light image data) obtained in the embodiment shown in FIG. 3 , the luminance of the through-hole portion that does not reflect the irradiated light is lowered, and the luminance of the other portions is increased. Therefore, based on the contrast ratio in the obtained image data, the through-hole portion can be specified and the shape thereof can be inspected. For example, an image used as a model is registered in advance, and the specified through-hole can be determined to be normal or abnormal with reference to the degree of conformity with the shape of the model image, the area (number of pixels), and the like. In another embodiment, by enlarging and displaying the obtained image data on the display monitor (not shown) connected to the image analysis part, an inspector can visually recognize recognition of a penetration hole and test|inspect a shape, etc. Inspection of the presence or absence of a through hole or arrangement pattern can be similarly performed based on the luminance information.

[C. Manufacturing method of adhesive film]

The manufacturing method of the adhesive film of this invention prepares a transparent adhesive film which has an elongate resin film and the adhesive layer formed in one surface of this resin film, Penetration which penetrates integrally through this resin film and this adhesive layer It includes forming a ball, and inspecting an elongate adhesive film having a through hole by the above inspection method.

C-1. long adhesive film

A long adhesive film is typically obtained by laminating|stacking an adhesive layer on one surface of a long resin film. The pressure-sensitive adhesive layer may be laminated by any suitable method. As a specific example, the method of apply|coating and drying an adhesive solution on a resin film, the method of forming an adhesive layer on a separator, and transferring the said adhesive layer to a resin film, etc. are mentioned. Examples of the coating method include roll coating methods such as reverse coating and gravure coating, spin coating method, screen coating method, fountain coating method, dipping method, and spraying method.

When the pressure-sensitive adhesive film further has a separator temporarily attached to the pressure-sensitive adhesive layer to be peelable, the separator may be laminated on a laminate of a resin film/adhesive layer, a pressure-sensitive adhesive layer is formed on the separator, and a laminate of the separator/adhesive You may laminate|stack on a resin film.

About a resin film, an adhesive layer, and a separator, it is as having demonstrated in A section.

C-2. formation of through holes

Next, a penetration hole is formed in the said adhesive film (a laminated body of a resin film/adhesive layer, or a laminated body of a resin film/adhesive layer/separator). The through hole integrally penetrates the resin film and the pressure-sensitive adhesive layer (and the separator, if present). The through hole may be formed, for example, by cutting the adhesive film or removing a predetermined portion of the adhesive film (eg, laser ablation or chemical dissolution). As a cutting method, the method of mechanically cutting using, for example, cutting blades (punching type), such as a Thompson blade and a pinnacle blade, a water jet, etc., and the method of irradiating a laser beam and cutting are mentioned.

Cutting with a cutting blade can be performed by any suitable mode. For example, you may implement using the punching apparatus which arrange|positioned the some cutting blade by the predetermined|prescribed pattern, and you may implement by moving a cutting blade using the same apparatus as an XY plotter. In this way, since it can be cut by moving the cutting blade to correspond to a predetermined position of the adhesive film, it is possible to form a through hole in a desired position of the adhesive film with high precision. In one embodiment, the cutting|disconnection by a cutting blade can be performed, interlocking with the said conveyance suitably, carrying out roll conveyance of a long adhesive film. In more detail, a through hole can be formed in the desired position of an adhesive film by adjusting the timing of a cutting|disconnection and/or the moving speed of a cutting blade suitably in consideration of the conveyance speed of an adhesive film. In addition, the said punching apparatus may be a recipe system (flat punching|punching), and a rotary system (rotation) may be sufficient as it.

As the laser used for cutting, any suitable laser can be employed as long as it can cut the pressure-sensitive adhesive film. Preferably, a laser capable of emitting light having a wavelength within the range of 193 nm to 10.6 μm is used. Concrete examples are, CO ₂ laser, a gas laser such as an excimer laser; solid-state lasers such as YAG lasers; A semiconductor laser is mentioned. Preferably a CO ₂ laser is used. The irradiation condition of the laser light during cutting may be set to any suitable condition according to, for example, a laser to be used. The output conditions are, for example, 0.1 W to 250 W when a _{CO 2 laser is used.}

The laser ablation is effected by any suitable modality. As a laser used for laser ablation, any suitable laser can be employ|adopted. As a specific example, the same laser as the laser used at the time of the said cutting is mentioned. The irradiation conditions (output conditions, movement speed, number of times) of laser light at the time of laser ablation are, Any suitable conditions can be employed depending on the area of the through hole or the like.

When cut|disconnecting an adhesion film, it is preferable to apply a protective material to one side of an adhesion film. Specifically, a protective material is applied to the surface of the adhesive film on the terminal side in the cutting direction. By using a protective material, when peeling a protective material from an adhesive film after cutting, a puncture scrap can also be removed simultaneously. Specifically, the protective material can be peeled from the pressure-sensitive adhesive film in a state where the puncture debris is adhered to the protective material. As a result, productivity can be remarkably improved. Moreover, the deformation|transformation of the adhesion film by cutting|disconnection can be suppressed by using a protective material. For example, when cutting with a cutting blade, especially the deformation|transformation of an adhesive layer can be suppressed.

In a preferable embodiment, it cuts from the surface of an adhesion film to the middle of a protective material, and forms the said through-hole. According to such an aspect, the penetration hole which penetrates integrally through the said resin film and the adhesive layer (and a separator when it exists) can be formed favorably. Moreover, when peeling a protective material from an adhesion film, puncture waste can be removed favorably.

As the protective material, a polymer film is preferably used. As the polymer film, the same film as the resin film may be used. Also, soft (eg, low modulus) films such as polyolefin (eg, polyethylene) films may be used. In one embodiment, a film having high hardness (eg, elastic modulus) is preferably used as the polymer film. It is because the deformation|transformation of the adhesion film by cutting|disconnection can be suppressed favorably. The thickness of the polymer film is preferably 20 µm to 100 µm.

Preferably, a protective material is pasted together with an adhesive film by an adhesive. By bonding a protective material to an adhesion film, problems, such as a protective material coming off at the time of cutting|disconnection, can be prevented. Moreover, when peeling a protective material from an adhesion film, puncture waste can be removed favorably. As an adhesive which bonds a protective material together, arbitrary appropriate adhesives can be used as long as it has the adhesive force which can peel a protective material from an adhesion film after cutting. In one embodiment, the adhesive layer is previously formed in the protective material. The thickness of the adhesive layer formed in the protective material becomes like this. Preferably they are 1 micrometer - 50 micrometers.

In one embodiment, it is preferable to make the shape of a protective material correspond to the shape of an adhesion film. For example, with respect to an elongate adhesive film, a elongate protective material is used. According to such a shape, when peeling a protective material from an adhesion film, puncture waste can be removed favorably. In addition, it is possible to continuously remove the drilling debris, so that productivity can be remarkably improved.

When forming the through hole, it is preferable to cut the pressure-sensitive adhesive film on the separator side. By cut|disconnecting at the separator side, the influence on bonding of the adhesion film obtained by cutting|disconnection can be suppressed. Specifically, when cutting with a cutting blade, the pressure-sensitive adhesive layer of the adhesive film may be deformed by following the cutting blade. When it cut|disconnects from the resin film side, an adhesive layer may swell on the adhesive surface side of the adhesive film obtained, and there exists a possibility that a bulging part may be formed in the periphery of a penetration hole. As a result, when the adhesive film obtained is pasted together to a to-be-adhered body, air|bubble may generate|occur|produce in the periphery of a through-hole. On the other hand, when cut from the separator side, the pressure-sensitive adhesive layer may be deformed following the cutting blade, but the periphery of the through hole on the pressure-sensitive adhesive surface side of the obtained pressure-sensitive adhesive film is smooth (for example, arc surface), and is attached to the adherend. However, the generation of air bubbles can be prevented. Moreover, when a protective material is used by cut|disconnecting at the separator side, when peeling a protective material from an adhesion film after cutting, puncture waste can be removed favorably. For example, it is possible to avoid the problem that only a part of the perforation debris (typically a separator part) is removed.

As described above, the through-holes may be formed in the pressure-sensitive adhesive film in a predetermined arrangement pattern.

C-3. Inspection of adhesive film

After formation of the through hole, the adhesive film is inspected by the inspection method described above. Preferably, after forming a penetration hole in the adhesive film which is a laminated body of a resin film/adhesive layer/separator, it tests continuously. After formation of a penetration hole, it test|inspects, without first winding up an adhesion film specifically,. In this way, by continuously inspecting after the formation of the through-holes to determine whether or not the through-holes having the desired shape are formed, for example, an adhesive film having poor formation of the through-holes is prevented from being practically provided. can do.

In one embodiment, after the inspection, the pressure-sensitive adhesive film can be put to practical use without being wound on a roll. In another embodiment, after inspection, the pressure-sensitive adhesive film may be wound on a roll and stored until put to practical use.

[D. Use of adhesive film]

The pressure-sensitive adhesive film having the above-mentioned through-holes can be preferably used as a surface protection film or mask when selectively processing a predetermined portion of a film (typically a long film), for example. Specific examples of the selective treatment include discoloration, coloring, perforation, development, etching, patterning (eg, formation of an active energy ray-curable resin layer), chemical modification, and heat treatment. By using the adhesive film which has a through-hole, since continuous processing as it is roll conveyance becomes possible, the processing efficiency of various selective processing can be made very high. In addition, by using the pressure-sensitive adhesive film having a through hole, it is possible to precisely control and arrange the portion to be selectively treated over the entire long film. It is possible to remarkably suppress the variation in quality for each. In one embodiment, the adhesive film which has a through hole selectively decolorizes a polarizer, and can be used when manufacturing the light polarizer (typically a long picture polarizer) which has a non-polarization part. By using the pressure-sensitive adhesive film having a through-hole for the application, a non-polarization portion capable of responding to a camera portion of an image display apparatus or the like can be preferably formed. · High yield and high productivity can be manufactured.

The inspection method of the present invention can be preferably used in the production of a pressure-sensitive adhesive film that can be preferably used as a surface protection film or a mask when a predetermined portion of a film (typically a long film) is selectively treated.

10: resin film
20: adhesive layer
30: through hole
100: adhesive film
200: inspection device
220: lighting unit
240: imaging unit
260: light blocking material
280: image analysis unit

Claims (6)

A method for inspecting a transparent adhesive film comprising a long resin film and an adhesive layer formed on one surface of the resin film, and having a through hole integrally penetrating the resin film and the adhesive layer, the method comprising:
A step of imaging the surface of the adhesive film to obtain image data of the surface;
Analyzing the image data and inspecting the through hole,
Imaging of the surface of the adhesion film is performed by irradiating light to one surface of the adhesion film, and imaging the reflected light,
The inspection method in which irradiation of the light is performed by irradiating light perpendicularly|vertically to one surface of this adhesive film so that the optical axis of irradiation light may become parallel to an imaging optical axis. The method of claim 1,
The inspection method in which the said adhesive film further has a long separator temporarily affixed to the said adhesive layer so that peeling is possible. 3. The method of claim 2,
The inspection method in which the said penetration hole has penetrated the said separator, the said resin film, and the said adhesive layer integrally. The method of claim 1,
The said adhesive film is used as a surface protection film or a mask at the time of selectively processing a predetermined part of a long film. The method of claim 1,
The inspection method which irradiates light to one surface of the said adhesion film in the state which has arrange|positioned the light-shielding material on the other side of the said adhesion film, and the reflected light is imaged. Preparing a transparent adhesive film having a long resin film and an adhesive layer formed on one surface of the resin film;
forming a through hole integrally penetrating the resin film and the pressure-sensitive adhesive layer; and
The manufacturing method of the elongate adhesive film which has a penetration hole including inspecting the adhesive film by the inspection method in any one of Claims 1-5.

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