CN100395519C

CN100395519C - Figure checking device

Info

Publication number: CN100395519C
Application number: CNB2004100475469A
Authority: CN
Inventors: 林宏树; 永森进一
Original assignee: Ushio Denki KK
Current assignee: Ushio Denki KK
Priority date: 2003-05-21
Filing date: 2004-05-21
Publication date: 2008-06-18
Anticipated expiration: 2024-05-21
Also published as: KR100671770B1; TW200506346A; TWI276793B; CN1573280A; JP4228778B2; KR20040100874A; JP2004347417A

Abstract

To accurately implement an automatic pattern inspection using a transmission light even if an adhesive layer is formed on a substrate and has minute unevenness. The pattern 5a on a TAB tape is fed to an inspection part by a tape feeding mechanism and irradiated with illumination light from a transmissive illumination means. An image of the pattern is picked up by a CCD line sensor. The transmissive illumination means comprises two illumination means obliquely disposed and obliquely irradiates the pattern with the illumination light. The picked-up image is transmitted to a control part and compared with an inspecting master pattern image. The quality of the pattern is determined. The illumination light preferably irradiates from the outside of a viewing field of the CCD line sensor, and a light shielding plate preferably covers the inside of the viewing field of the CCD line sensor 1b instead of the transmissive illumination means obliquely disposed. Since the transmissive illumination means is constituted as above, the TAB tape can be irradiated with a moderately diffused light and the image can be obtained without spots and irregularity.

Description

Image inspecting device

Technical field

The present invention relates to a kind of image checking mehtod and device, be particularly related to utilizing TAB (Tape Automated Bonding) the band irradiating illumination light of dress band mode, utilize camera head to take to be formed on TAB with on integrated circuit (IC) figures, the image checking mehtod and the device that carry out visual examination automatically.

Background technology

Semiconductor devices advances multiterminal and the microminiaturization of lead-in wire for adapting to the requirement of highly integrated and High Density Packaging.From helping the angle of this multiterminal and microminiaturization, adopt with semi-conductor chip be located at film like TAB with on the method that is connected of a plurality of lead-in wires.

Figure 11 represents structure one example of TAB band.

TAB is with in 101, on the resin film 102 about (most), wide 35～165 μ m about thick 20～150 μ m at 25～75 μ m, except that the both sides periphery that forms perforation 103, shown in Figure 11 (a), be coated with the bonding agent 104 about thick 10～15 μ m, and shown in Figure 11 (b), on bonding agent 104, paste metal formings 105 such as Copper Foil.

By exposure and etching, process this metal forming 105, shown in Figure 11 (c), form circuit figures 106.At this moment, do not remove the layer of bonding agent 104, and original state keeps.

The TAB that Figure 12 represents to form actual graphical is with 101 example.

In Figure 12, inner white rectangle is the wired circuit figure for the peristome (device aperture) 110,111 that semi-conductor chip is installed.

Such TAB with 101 manufacturing process in, need to check whether correctly to form the wired circuit figure, adopt image inspecting device to check.

Image inspecting device, the TAB that will check with the illumination light illumination is with 101, with the state (outward appearance) of camera head or visual detection circuitous pattern, by itself and test pattern are compared, judges whether formed figure is qualified.In recent years, also adopting a kind of like this automatic checking device, it compares the test pattern of storage and the side circuit figure that utilizes camera head to take at the storage portion stores test pattern of the control part of testing fixture, and whether judge automatically qualified.

For taking figure, in method, the method that adopts catoptrical method and adopt transmitted light is arranged to TAB band irradiating illumination light.

Adopt catoptrical method to be: from top (forming a side of figure) the irradiating illumination light of TAB band, from the irradiating illumination direction of light, the method for the circuitous pattern image that the reflected light that observation is with by TAB forms, for example, utilize the imaging apparatus photographic images, and carry out Flame Image Process.

For example, in patent documentation 1, disclose and adopted catoptrical image inspecting device.

The method of above-mentioned patent documentation 1 record is: the band that forms figure is shone the light that sends from lighting device, utilize ccd video camera to take the band that illuminated device illuminates the position, and output to computing machine, carry out Flame Image Process with computing machine, check the defective of figure.

In addition, adopt the method for transmitted light to be: from below (with the relative side of a side that the forms figure) illumination of TAB band, utilization is located at the imaging apparatus of TAB band top (side relative with a side of irradiating illumination light), the circuitous pattern image that the transmitted light that shooting is with through TAB forms.

Compare with adopting catoptrical method, adopt the method for transmitted light to be fit to the figure inspection.Its reason below is described.

As shown in figure 13, when metal formings such as etching Copper Foil formed figure, the cross section of the figure of formation was a trapezoidal shape, if compare the size of figure upper side wider degree a and downside width b, then downside width b is wide.As everyone knows, this is that the diffusion when inner etching and speed form because etching liquid is from the surface of Copper Foil.

When checking such figure, when adopting reflected light as illumination light, imaging apparatus is captured in the light of the surface reflection of wiring image, and the part beyond it is then dark.

Therefore, shown in Figure 14 (a), even wiring figure in downside and adjacent figure short circuit, the image of shooting is also broken forth as the normal figure of short circuit not.Therefore, omission defective sometimes.

In addition, when adopting transmitted light, the imaging apparatus collection sees through the light of resin film, and the part beyond it is then dark.

Therefore, shown in Figure 14 (b), if wiring figure in downside and adjacent figure short circuit, therefore the then image short circuit of Pai Sheing, breaks forth as thick abnormal graph, therefore, can detect defective.

Patent documentation 1: the spy opens the 2000-182061 communique.

But, when adopting transmitted light, following problem appears.As mentioned above, on the resin film that forms the TAB band, have the adhesive phase that is used for the jointing metal paper tinsel, after forming figure, this layer also remains on the resin film.

As everyone knows, the surface of the adhesive phase after peeling off Copper Foil by etching has the concavo-convex of countless a few μ mm.At first, adhesive surface is smooth.But,, be used for by the strong joint of anchor (anchor) effect, so it is replicated on the surface of bonding agent owing on the back side of Copper Foil, be formed with many minute protrusions.

If the bonding agent after making illumination light see through Copper Foil to peel off, then illumination light is concavo-convexly carried out diffuse reflection diffusion and deepening because of what duplicate from the Copper Foil quilt cover, produces the spot or the inequality of black on the image of taking with ccd video camera etc.

When carrying out Flame Image Process under the state that can see such spot or inequality,, then its part as wiring is handled if spot or inequality are positioned near the figure.When testing fixture compares itself and test pattern, with spot or uneven, be judged as defective goods sometimes as the rugosity misidentification that connects up.

In addition, near spot figure or inequality are not identified as dust sometimes, are judged as defective goods.Like this, although be not unacceptable product in fact, device is judged as defective, flase drop occurs and surveys.

When adopting transillumination, because of the small concavo-convex spot that causes or the uneven flase drop that produces of such adhesive phase are surveyed, so, adopt the automatic checking device of the figure of transmitted light to be difficult to practicability.When using indirect illumination, shine secretlyer during owing to the shooting adhesive phase, so, do not produce such problem.

Summary of the invention

The present invention proposes for solving the problem that exists in the above-mentioned conventional art, even purpose is to form the small concavo-convex layer that has as adhesive phase on substrate, does not also produce flase drop and surveys, and can realize adopting the figure self-verifying of transmitted light.

For addressing the above problem, camera head is configured in a side opposite with lighting device with respect to substrate, from the visual field external exposure of camera head illumination light, substrate is carried out transillumination as diffused light.

For example, diffusing panel is set, the light source that penetrates illumination light is configured in the outside, visual field, make its central ray (the light that penetrates from lighting source, the light of light intensity maximum) not be directly incident on camera head in the part of the illumination light that penetrates lighting device.

Perhaps, camera head is configured to: the central ray oblique illumination of light source that makes above-mentioned lighting device is to substrate, and makes above-mentioned central ray not be directly incident on it to be subjected to the camera head of image planes with respect to the substrate configured in parallel.

In addition, configuration covers the shadow shield of the visual field inner region of above-mentioned camera head between lighting device and substrate, so that the central ray of light source of illumination device is not directly incident on camera head.

Herein, the visual field of above-mentioned camera head is meant the scope (zone) on the object plane that is subjected to imaging on the image planes of imaging apparatus, when above-mentioned camera head was linear transducer, the visual field width was not more than 1mm, the length of length for determining according to the length that is subjected to pixel spare of camera head.

When adopting linear transducer as camera head, because the visual field width is narrow as mentioned above, above-mentioned lighting device and camera head are together scanned on the Width of visual field, obtain the figure on the substrate.

Utilize the figure of the substrate image of camera head shooting to be transferred to control part, be carried out Flame Image Process, compare, judge whether figure is qualified on the substrate with the test pattern of storing in advance.

The reason that produces spot or inequality on transmitted light images thinks as follows.

Shown in Fig. 2 (a), to the adhesive phase incident illumination light time, when the part of the light incident no concave-convex of the composition of vertical incidence substrate, this light directly sees through.In addition, inciding when having concavo-convex part, because of the diffuse reflection diffusion, therefore the composition of the light that directly sees through reduces.

When camera head being configured in respect to the opposite side with above-mentioned lighting device of substrate, from the central ray of the maximum light intensity of above-mentioned lighting device, approximate vertical incides the part of the no concave-convex of aforesaid substrate.

The major part of this light directly sees through and incides imaging apparatus, and the part of no concave-convex is shone brightlyer on the image that is subjected to picture by camera head.

In addition, inciding when having concavo-convex part, as mentioned above, owing to,, also reduce the composition of the light of direct transmission even the big center line of above-mentioned light intensity incides this part because of the diffuse reflection diffusion.Therefore, having concavo-convex part in the image that is subjected to picture with camera head is shone secretlyer.That is, be subjected in the image of picture at pixel spare being shot, luminance difference appears in the part.

In addition, if the light source of lighting device is configured in outside the visual field of imaging apparatus, so that be directly incident on imaging apparatus by substrate from the central ray of the light source of lighting device, then the bigger central ray of intensity that penetrates from this light source can not be directly incident on camera head by the part of the no concave-convex on the substrate.

That is,, then shown in Fig. 2 (b),, also reduce the high light composition that directly sees through and incide imaging apparatus in the part of no concave-convex even to the less diffused light of the part incident intensity of no concave-convex if as above be provided with.Therefore, the situation that impinges perpendicularly on the part of the no concave-convex on the aforesaid substrate with the central ray that sends from lighting device is compared, and the part of no concave-convex is shone secretlyer.

In addition, incide under the situation with concavo-convex part, shown in Fig. 2 (b), shine secretlyer equally having concavo-convex part diffusion at above-mentioned diffused light.

Therefore, compare, have concavo-convex part or do not have concavo-convex part, in brightness, all do not have big difference, on the image of taking, be difficult for producing spot or inequality with the situation shown in Fig. 2 (a).

In the present invention, as mentioned above, owing to the substrate outside the visual field that the light source with lighting device is configured in camera head throws light on, so, be not prone to spot or inequality that diffuse reflection causes on the image, can not prevent the flase drop survey because of spot or uneven mistake identification wiring rugosity.

Description of drawings

Fig. 1 represents the configuration example of the image inspecting device of the embodiment of the invention.

Fig. 2 be illustrated in camera head just below the light of configuration jog during lighting source and when outside the visual field of camera head, disposing lighting source, on the substrate by the situation of diffusion.

Fig. 3 represents the detailed configuration example of inspection portion.

Fig. 4 represents to use led light source as transmission illuminator, and the configuration example of luminous intensity distribution figure when the exit wound of bullet of transmission illuminator is provided with diffusing panel and transmission illuminator.

Fig. 5 represents TAB is with between the centre, and disposes transmission illuminator under ccd linear sensor, and the light characteristic of the image of taking with ccd linear sensor is shown.

Fig. 6 is illustrated under the situation of visual field outside configuration transmission illuminator of ccd linear sensor, the Luminance Distribution characteristic of the image of taking with ccd linear sensor.

Fig. 7 is illustrated in as the TAB that checks object with a part that goes up the inspection figure (wiring figure) that forms.

The configuration example of the inspection portion when Fig. 8 is illustrated in the visual field outside configuration transmission illuminator of ccd linear sensor.

The configuration example of the inspection portion when Fig. 9 is illustrated in configuration transmission illuminator in the visual field of ccd linear sensor.

The configuration example of the transmission illuminator when Figure 10 represents to adopt the halogen light source.

Figure 11 represents the structure of a routine TAB band.

Figure 12 represents to be formed with the example of the TAB band of figure.

The section of formed figure when Figure 13 is illustrated in metal forming such as etch Copper Foil and forms figure.

Figure 14 is the underproof figure of figure of omission when illustrating as irradiates light employing reflected light.

Embodiment

In addition, the explanation substrate is the situation of TAB band in following embodiment, but the present invention also can be applicable to inspection except that the TAB band, that utilize the various substrates of transillumination light.

The image inspecting device of present embodiment, as shown in Figure 1, have: by transmit tape transport 10 that TAB constitutes with 5 output panel 11 or closed reel 12 etc., to from the TAB of output panel 11 outputs with 5 irradiating illumination light and take figure 5a inspection portion 1, make the scanister 2 in the enterprising line scanning of inspection figure 5a of TAB band of inspection portion 1, to the labeling section 3 of defective figure additional marking.In addition, also have control part 4, the figure that this control part 4 is relatively taken and as the parent form of standard, and judge the whether qualified of goods, and the running of control inspection portion 1, scanister 2, labeling section 3 and tape transport 10.

Inspection portion 1 comprises: 2 transmission illuminator 1a, and TAB is with 5 from the rear side illumination; Camera head 1b is with 5 between the centre with TAB, is located at and transmission illuminator 1a relatively on the position, to being formed on TAB and taking with the circuit figures 5a on 5 by seeing through the illumination light of TAB with 5.

Transmission illuminator 1a suitable selects output to see through the light source of TAB with the light of 5 wavelength.Camera head 1b is for example ccd linear sensor that the wavelength of illumination light is had luminous sensitivity, below, the situation that adopts ccd linear sensor as camera head 1b is described.In addition,, also can adopt the ccd sensor that all to take whole inspection figure, come replaced C CD linear transducer as long as can make the light quantity of transmission illuminator 1a fully big.

Scanister 2 on the inspection figure 5a of TAB band, scans ccd linear sensor 1b and transmission illuminator 1a on the paper fore-and-aft direction of this figure, obtains TAB with 5 general image.

In Fig. 1, when TAB with 5 the figure 5a that checks object that becomes, when being sent on the assigned position of inspection portion 1 by above-mentioned tape transport 10, stop TAB in this position and be with 5, and utilize above-mentioned scanister 2 to make transmission illuminator 1a, ccd linear sensor 1b the enterprising line scanning of paper fore-and-aft direction at this figure.Thus, from the illumination light that above-mentioned transmission illuminator 1a penetrates, see through TAB with on inspection figure 5a, 1b accepts by ccd linear sensor, is taken the image of checking figure 5a by ccd linear sensor 1b.

This image is sent to control part 4, and at control part 4, the image of the inspection figure 5a that will be taken by ccd linear sensor 1b and the inspection that is stored in advance in the control part 4 compare with parent form (test pattern) image, judge whether inspection figure 5a's is qualified.

Above-mentioned inspection parent form can be taken qualified actual product by utilizing camera head in advance, and based on the graphic making of this shooting, also can make according to cad data.

In addition,, proposed several different methods in the past, can therefrom select suitable decision method about the whether qualified decision method of figure.

To TAB with on the figure 5a that respectively checks carry out the result of the above-mentioned inspection of above-mentioned whether qualified judgement, when judge TAB with on figure 5a when defective, with TAB with on the location storage of defective figure to control part 4, when this figure is sent to labeling section 3, implement mark painted or perforation, then, be wound up on the closed reel 12.

Fig. 3 represents the detailed configuration example of above-mentioned inspection portion 1.Among this figure, show the example of the situation of 2 lighting devices that adopt tilted configuration, be with 5 oblique illumination so that make the central ray of the light of emitting from light source as shown in Figure 1 with respect to TAB, this figure (a) is the figure that observes with 5 direction of transfer from TAB, (b) is to observe TAB with 5 figure from ccd linear sensor 1b side.In addition, figure 3 illustrates ccd linear sensor 1b, transmission illuminator 1a, with the situation of the enterprising line scanning of direction of the direction of transfer quadrature of band.

In inspection portion 1, setting has the worktable 1c of peristome, when the precalculated position that the inspection figure 5a of TAB on 5 stopped on the worktable 1c, utilize scanister 2, make transmission illuminator 1a, ccd linear sensor 1b in the enterprising line scanning of the direction of arrow of these figure (a) and (b) (TAB with 5 Width); From the direction that tilts, by above-mentioned peristome to TAB with the inspection figure 5a irradiating illumination light on 5.Then, accept to see through the light of checking figure 5a, check that the image of figure 5a is gathered by ccd linear sensor 1b by ccd linear sensor 1b.

The visual field of ccd linear sensor 1b, shown in these figure (a) and (b), the width a of direction of scanning is narrow, with the length b of the direction of direction of scanning quadrature greater than the equidirectional length of checking figure 5a.In addition, with the length of the direction of the direction of scanning quadrature of the ccd linear sensor 1b of transmission illuminator 1a, shown in this figure (b), greater than the length of the visual field of ccd linear sensor 1b.

Therefore, by making ccd linear sensor 1b run-down on the direction of arrow of this figure, can will check that the image acquisition of figure 5a integral body is to ccd linear sensor 1b.In addition, the width of the visual field of the direction of scanning of ccd linear sensor 1b is actual is a few μ m.

As the light source 1d of above-mentioned transmission illuminator 1a, for example, can suitably select led light source, halogen light source etc. can penetrate the light source with the light of 5 wavelength through TAB, at the light exit wound of bullet of transmission illuminator 1a, for example frosted glass of diffusing panel 1e is set.

But, if above-mentioned diffusing panel 1e only is set, can not make the illumination light that penetrates from light source 1d fully form diffused light, with 5 inspection figure 5a, the central ray that the intensity of emitting from transmission illuminator 1b is bigger incides ccd linear sensor 1b by TAB.Therefore, same when such direct illumination, produce the luminance difference that diffuse reflection causes.

For this reason, in the present embodiment, tilted configuration transmission illuminator 1a, so that the central ray of emitting from light source is not directly incident on ccd linear sensor 1b, the light oblique incidence is with 5 to TAB.

If like this configuration, then the illumination light of appropriate diffusion is radiated at TAB and is with 5, can not be prone to foregoing spot or the inequality that causes because of diffuse reflection.

In addition, seal that also can frost (frosted) light source for processing 1d replaces above-mentioned diffusing panel 1e is set.

Fig. 4 represents to adopt led light source, the luminous intensity distribution figure when the exit wound of bullet of transmission illuminator 1a is provided with diffusing panel 1e and the configuration example of transmission illuminator 1a as the light source 1d of transmission illuminator 1a.The led light source of above-mentioned transmission illuminator 1a is arranged the light source of a plurality of LED for multiple row on the paper fore-and-aft direction of this figure, as mentioned above, the length of the direction before and after this paper is greater than the length b of the visual field of ccd linear sensor 1b, and the shape of luminous intensity distribution figure 5a is roughly the same on the fore-and-aft direction of paper.

In this example, tilted configuration transmission illuminator 1a is so that the angle of the optical axis of the central ray of the light that penetrates from transmission illuminator 1a and ccd linear sensor 1b reaches 15 degree; On the left and right directions of paper,, take the image of checking figure 5a to above-mentioned transmission illuminator 1a and ccd linear sensor 1b.

As shown in the drawing, about the light distribution characteristic of led light source, the light quantity of central ray is better than the light beyond the central ray relatively, still, by such configuration transmission illuminator 1a, can be to the illumination light of TAB with the appropriate diffusion of 5 irradiations.

In addition, in the above description, make transmission illuminator 1a, ccd linear sensor 1b with the direction enterprising line scanning of TAB with 5 direction of transfer quadrature, but also can make transmission illuminator 1a, ccd linear sensor 1b at TAB with the enterprising line scanning of 5 direction of transfer.

Fig. 5 is expression as explanation in the prior embodiment, with TAB band between the centre, with transmission illuminator be configured in ccd linear sensor under, and show the Luminance Distribution characteristic of the image of gathering with ccd linear sensor.Fig. 6 represents as shown in this embodiment, from the oblique direction illumination light, and the Luminance Distribution characteristic of the image of gathering with ccd linear sensor is shown, the position on the transverse axis presentation video, and the longitudinal axis is represented brightness.

Fig. 7 is illustrated in TAB with a part (wiring figure) that goes up the inspection figure 5a that forms.Fig. 5, Fig. 6 represent to take as shown in Figure 7 wiring figure by ccd linear sensor, with the direction (direction shown in the arrow of Fig. 7) of wiring figure quadrature on, the figure of the Luminance Distribution characteristic when linearity ground scans the image of being gathered.The part of " circuit " shown in Figure 5 is a wiring figure, and the part in " space " is resin film (coating adhesive, have concavo-convex part).

As Fig. 5, shown in Figure 6, the part of " circuit " is because light tight, thus take to darker, and the part printing opacity in " space ", so take brighter.

As shown in example in the past, when throwing light under ccd linear sensor, as shown in Figure 5, the brightness of space segment is roughly inhomogeneous in 60～80 scope, and the little part of brightness is the part of spot.

Under the situation of example in the past shown in Figure 5, the uneven luminance of space segment, therefore, when above-mentioned image being carried out Flame Image Process and carrying out self-verifying, for dark part, for example the part of brightness 60 is compared with the part of brightness 80 and is taken to darker, even in fact illumination light sees through, also might think dark part by mistake the wiring rugosity.

To this, as present embodiment, from the oblique direction illumination light time, as shown in Figure 6, and the influence that almost is speckless, the brightness of space segment is almost equal.Therefore, when above-mentioned image is carried out Flame Image Process and self-verifying, can reliably distinguish circuit and space, can not survey by flase drop.

In Fig. 1, Fig. 3, Fig. 4, the situation when showing from the oblique direction illumination light still, as shown in Figure 8, even transmission illuminator 1a is configured in outside the visual field of ccd linear sensor 1b, also can access same effect.

Promptly, the central ray of emitting from transmission illuminator 1a is not directly incident on ccd linear sensor 1b, so, see through TAB with in 5 the illumination light, the light that sees through its irregular part and do not have a concavo-convex part is all as the light of dispersing equal extent, incide imaging apparatus, the same with the situation of Fig. 3, can access immaculate or not have uneven image.

In addition, as shown in Figure 9, also can be between lighting device and substrate, configuration covers the light-blocking member 6 of the visual field inner region of above-mentioned camera head, and the central ray that penetrates from the light source of lighting device is directly incident on the camera head.If dispose such light-blocking member 6, then same with Fig. 1～Fig. 3, Fig. 7, see through TAB with 5 illumination light, the light that sees through its irregular part and do not have a concavo-convex part is all as the light of diffusion equal extent, incide imaging apparatus, the same during with Fig. 3, can access immaculate or not have uneven image.

Figure 10 is the figure of the configuration example of the above-mentioned inspection portion 1 of expression when adopting the halogen light source as light source.

Light as shown in the drawing, as to send from halogen light source 21 with reflective mirror 21a optically focused by selective filter 22a, optical fiber 22b, and sees through the light of TAB with 5 wavelength, is directed into 2 light injection part 22c with 5 tilted configuration with respect to TAB, penetrates from light injection part 22c.

Light injection part 22c brings the front end of optical fiber 22b together the rectangularity shape, at its light exit wound of bullet diffusing panel 1e is set.Be with on 5 at TAB from the OBL rayed that light injection part 22c penetrates, accept light by being located at the ccd linear sensor 1b of TAB with 5 upsides.

Above-mentioned smooth injection part 22c and ccd linear sensor 1b as mentioned above, utilize not shown scanister scanning, take the image of checking figure.

The invention effect

In sum, in the present invention, from the visual field external exposure of the camera head photograph as diffused light Mingguang City carries out transillumination to substrate, and with the figure on the picture pick-up device shooting substrate, to substrate On figure check, so, not because of the concavo-convex diffuse reflection that causes of adhesive cause bright Degree difference. Therefore, in the image of taking, spot or uneven less can be because of spot or inequality Cause misidentification wiring rugosity, can prevent error detection.

Claims

1. image inspecting device utilizes imaging apparatus that the substrate that sticks on metal forming on this bonding agent in adhesive-applying on the resin film and processing and form wiring figure is taken, and checks automatically, it is characterized in that having:

Take the camera head of substrate surface;

Lighting device is outside the visual field of the above-mentioned camera head of a side opposite with above-mentioned camera head, to the illumination light of aforesaid substrate irradiation as diffused light;

Control device is used to above-mentioned camera head in the figure of the substrate image taken from the illumination light that sees through aforesaid substrate of above-mentioned lighting device and the test pattern stored in advance compares and checks.

2. as the image inspecting device of claim 1 record, it is characterized in that:

Part in the illumination light that penetrates above-mentioned lighting device is provided with diffusing panel, and the central ray that penetrates the light source of above-mentioned illumination light is configured to oblique illumination to substrate.

3. image inspecting device utilizes imaging apparatus that the substrate that sticks on metal forming on this bonding agent in adhesive-applying on the resin film and processing and form wiring figure is taken, and it is characterized in that having:

Take the camera head of substrate surface;

Lighting device is in a side opposite with above-mentioned camera head, to the illumination light of aforesaid substrate irradiation as diffused light;

Shadow shield is configured between above-mentioned lighting device and the substrate, covers the visual field inner region of above-mentioned camera head;