JP2006112845A - Pattern inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the contrast between a wiring part and a resin film part to easily detect a wiring pattern by reflective illumination. <P>SOLUTION: A TAB tape 5 having the wiring pattern formed thereon is unwound from a feed-out reel 11 to be fed to an inspection part 1 and illuminated by a reflective illumination means 1a to image the inspection pattern on the TAB tape 5 by an imaging means 1b in the inspection part 1. The image of the imaged inspection pattern is sent to a control part 4 and compared with a reference pattern to judge the quality of the pattern. The light source of the reflective illumination means 1a is, for example, an infrared LED for emitting, for example, only light with a wavelength of 500 nm or above. Since the wavelength of is illuminated only by the light with the wavelength of 500 nm or above which penetrates the TAB tape 5, an image of good contrast can be obtained. Further, if the infrared reflectivity of a stage 1c is not set to 10% or below and the stage 1c is not provided, an image further good in contrast can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pattern inspection apparatus, and in particular, illuminates illumination light on a TAB (Tape Automated Bonding) tape based on a tape carrier system, and a pattern such as an integrated circuit (IC) formed on the TAB tape is captured by an imaging unit. The present invention relates to a pattern inspection apparatus that performs imaging and automatically inspects an appearance.

In the semiconductor device, the number of leads and the miniaturization are progressing in response to the demand for high integration and high-density mounting. A method of connecting a semiconductor chip to a large number of lead wires provided on a film-like TAB tape is adopted because it is advantageous for this increase in the number of pins and miniaturization.
FIG. 7 shows the procedure and structure (cross-sectional view) for producing a TAB tape.
The TAB tape is formed of a polyimide resin film having a thickness of about 20 to 150 μm (many 25 to 75 μm) and a width of about 35 to 165 mm, as shown in FIG. An adhesive having a thickness of about 10 to 15 μm is applied except for the peripheral portions on both sides where the perforation holes 103 are formed. A metal foil 105 such as a copper foil is affixed thereon as shown in FIG.
In order to form the wiring pattern 106, as shown in FIG. 7C, the metal foil (copper foil) 105 is processed by exposure and etching.

FIG. 8 shows a TAB tape on which a wiring pattern is formed as described above.
As shown in the figure, a plurality of identical circuits are continuously formed on a strip-shaped tape (TAB tape) formed of a resin film 102 of polyimide resin or the like and having perforation holes 103 on both sides. .
A portion surrounded by a dotted line in the figure shows one wiring pattern (referred to as one piece), and a wiring pattern 111 is formed on each piece. The rectangular inside is an opening (device hole) 110 for attaching a semiconductor chip.
In such a TAB tape manufacturing process, it is necessary to inspect whether the wiring pattern is correctly formed, and the inspection is performed by a wiring pattern inspection apparatus.

The wiring pattern inspection device illuminates the TAB tape to be inspected with illumination light, detects the state (appearance) of the wiring pattern with an imaging device or visually, and compares the formed wiring pattern with the master pattern (reference pattern). Judge the quality.
In recent years, a master pattern (reference pattern) is stored in advance in the storage means of the control unit of the inspection apparatus, and the stored master pattern is compared with the actual wiring pattern captured by the imaging apparatus, and automatically Automatic inspection devices for determining pass / fail are also being used.
As a method for illuminating the pattern inspection apparatus, there are a method using reflected light and a method using transmitted light.
In the method using reflected light, illumination light is irradiated from the illumination means provided on the side where the wiring pattern of the TAB tape is formed, and the reflected light from the pattern is imaged and observed by the imaging means provided on the same side as the illumination means. It is a method to do. About the method using reflected light, it describes in patent document 1, patent document 2, etc., for example.
On the other hand, the method using transmitted illumination is a method of imaging and observing light transmitted through the TAB tape by an imaging unit provided on the opposite side of the tape from the illumination unit.
JP 2002-250700 A Japanese Patent Laid-Open No. 10-185832

As described above, the illumination method for the illumination light of the pattern inspection apparatus includes a method using reflected light. In the case of a pattern inspection apparatus using reflected light, a wiring pattern (hereinafter also referred to as a pattern) is a wiring portion. And the other part are input to the imaging means (eye in the case of visual observation) as a contrast difference.
FIG. 9 shows an example of a wiring pattern imaged using reflected light. As shown in the figure, since the wiring portion is made of metal, it reflects the illumination light well and appears bright on the image sensor. On the other hand, the portion of the polyimide resin film which is the base other than the wiring becomes dark.
However, in a pattern inspection apparatus using reflected light, an image with a small contrast (contrast) between the wiring portion and the other resin film portion (hereinafter sometimes referred to as poor contrast) may be captured.
Even such an image with poor contrast can be inspected by adjusting the brightness, color tone, etc. of the image if it is a conventional so-called rough pattern (thick wiring and wide space between wirings).
Recently, however, the pattern has become dense (thin wiring is narrow and the space between the wirings is narrow), and it is difficult to perform inspection by adjusting only the image.
The present invention has been made in view of the above circumstances, and in a pattern inspection apparatus that detects a pattern from reflected illumination, the contrast between the wiring portion and the resin film portion is increased so that the wiring pattern can be easily detected. For the purpose.

As a result of examining the above-mentioned problems, it was found that the contrast of the reflected image was deteriorated due to “reflection from the resin film (tape)” and “reflection from the stage”. This point will be described in detail below.
(1) About reflection from the tape.
FIG. 10 shows the transmittance of a typical polyimide resin film (thickness 75 μm) used for the TAB tape. The vertical axis represents the transmittance (%), and the horizontal axis represents the wavelength (nm).
As shown in the figure, light having a wavelength of 500 nm or less hardly transmits through a polyimide resin film (hereinafter also referred to as a TAB tape or a tape). Some light that is not transmitted is absorbed, but some is reflected. The light is transmitted at a wavelength of about 500 nm or more. At 700 nm, the transmittance is about 40%, and at 850 nm, it is about 60%, and is almost saturated. Conventionally, a general halogen lamp is used as a light source of illumination means for a pattern inspection apparatus. From a general halogen lamp using tungsten as a filament, continuous light having a peak near a wavelength of 1000 nm is emitted.
As described above, in the reflected illumination, the condition for obtaining a pattern image with a large contrast (hereinafter sometimes referred to as good contrast) is that the wiring part reflects the illumination light and is input to the image sensor as a bright part. In other portions, the illumination light is not reflected and is input to the image sensor as a dark portion.

However, the conventional halogen lamp illumination with white light includes a component having a wavelength of 500 nm or less. Therefore, as shown in FIG. 11, when the TAB tape 5 is irradiated with light from the illuminating means 1a using the white light and picked up by the image pickup means 1b, the light component having a wavelength of 500 nm or less is a portion of the resin film other than the wiring. However, it is reflected and enters the image sensor 1b. Therefore, an image with poor contrast as described above may be obtained.
As a countermeasure, in the present invention, the illumination unit and the imaging unit of the inspection apparatus are configured as follows.
(I) As a lighting means, a light source that emits only light having a wavelength of 500 nm or longer and that does not emit light having a wavelength of 500 nm or shorter, which is relatively well transmitted through the polyimide resin, is used. The imaging means uses an element having sensitivity to at least light having a wavelength of 500 nm or more.
In this case, an LED that emits infrared light (infrared LED) can be used as the light source of the illumination means.
As such an infrared LED, for example, one that emits light having a wavelength of 700 nm, one that emits light having a wavelength of 850 nm, and the like are commercially available. In the case of an LED having a peak wavelength of 700 nm, for example, the half width is 20 nm, and in the case of an LED having a wavelength of 850 nm, for example, the half width is 40 nm.
In addition, as an imaging unit, there are a CCD (Charge Coupled Device) camera and a CMOS (Complementary Metal Oxide Semiconductor). FIG. 12 is a spectral sensitivity curve (catalog value) of a commercially available CCD camera. Whether an LED with a wavelength of 700 nm or an LED with a wavelength of 850 nm is used, the CCD camera has light receiving sensitivity.
Therefore, the CCD and CMOS can be used as an imaging means when such a light source is used.
By adopting the above configuration, the illumination means does not emit light of 500 nm or less reflected by the tape, and illumination is performed only with light having a wavelength of 500 nm or more that is transmitted through the tape. it can. In the present invention, light having a wavelength of 500 nm or more, including light emitted from the LED having the wavelength of 700 nm or 850 nm, is referred to as infrared light.

(Ii) A halogen lamp containing light having a wavelength of 500 nm or more is used as the light source of the illumination means, and the imaging means uses an element (CCD camera or CMOS) that is sensitive to light having a wavelength of 500 nm or more as described above.
A filter that cuts light of 500 nm or less is used in combination between the illumination unit and the tape or between the tape and the imaging unit.
An example of a filter that cuts light of 500 nm or less is an infrared transmission filter. As the infrared transmission filter, for example, an infrared transmission filter that cuts light having a wavelength of 720 nm or less and transmits a wavelength longer than that is commercially available, and such a filter may be used.
By providing the infrared transmission filter as described above between the illumination means and the tape, the tape is not irradiated with light of 500 nm or less. Therefore, the light component reflected from the tape is reduced, and it can be expected to obtain an image with good contrast.
Further, by providing the infrared transmission filter between the tape and the image pickup means, light of 500 nm or less reflected from the tape does not enter the image pickup device. Therefore, it can be expected to obtain an image with good contrast.
(Iii) A halogen lamp containing light having a wavelength of 500 nm or more is used as the light source of the illumination means, and the imaging means has no sensitivity at a wavelength of 500 nm or less and has an sensitivity only in the infrared light region, for example, an infrared CCD Use the camera.
In this case, since there is no sensitivity to light of 500 nm or less reflected from the tape, it is expected that an image with good contrast will be obtained as in the case where the above infrared transmission filter is provided on the light incident side of the imaging means. it can.
(2) About reflection from the stage.
By simply configuring the illumination unit and the imaging unit as described above, it is not possible to obtain a sufficiently high contrast image. Further examination of this cause revealed the following.
Conventionally, when a pattern is imaged by irradiating illumination light to a TAB tape, the tape is placed on the side opposite to the side on which the illumination means is provided so that the tape does not deviate from the imaging position or the focal position of the imaging device. A stage having a flat surface is provided to hold the tape by suction. However, during imaging, illumination light having a wavelength of 500 nm or more that has passed through the TAB tape is reflected by the surface of the stage, is again transmitted through the tape, and is received by the imaging device. As a result, the contrast of the image is deteriorated.
As a countermeasure, the inspection apparatus is configured as follows.
(I) The infrared reflectance of the stage that sucks and holds the tape during pattern imaging is 10% or less. In order to reduce the reflectance of infrared rays to 10% or less, “treat the surface of the stage with black alumite”, “paint with a color with little reflection”, “matte with frosting”, and the like.
With this configuration, it is possible to reduce the amount of light that is transmitted through the tape again and received by the imaging device, and an image with good contrast can be expected.
(Ii) As means for holding the tape at the time of pattern imaging, a means for holding and fixing the peripheral portion other than the inspection area of the tape is provided in place of the stage for sucking and holding the tape. As a result, as in the case of using the stage, it is possible to prevent the imaging tape from being displaced from the imaging position or the focal position of the imaging device due to vibration or the like.
On the other hand, since there is no reflection of the illumination light transmitted through the tape, the light transmitted through the tape is not received by the image sensor, and an image with good contrast can be expected.

In the present invention, the following effects can be obtained.
(1) In a pattern inspection apparatus that detects a pattern from reflected illumination, a light source that emits light having a wavelength of at least 500 nm is used as an illumination unit, and an imaging unit having sensitivity at a wavelength of 500 nm or more is used. Therefore, the reflected light component from the resin film can be reduced, and light having a wavelength of 500 nm or less reflected from the resin film can be cut.
For this reason, an image with good contrast between the wiring portion and the resin film portion can be obtained, and the wiring pattern can be easily detected.
(2) In the above (1), the periphery of the resin film can be obtained without reducing the infrared reflectance of the stage surface provided on the opposite side of the illumination means to the tape to 10% or less, or without providing a stage for holding the tape. By providing a means for gripping and applying tension to the resin film by the gripping means during imaging, the influence of reflected light on the stage surface can be reduced or eliminated, and an image with better contrast Can be obtained.

FIG. 1 is a block diagram showing a schematic configuration of a wiring pattern inspection apparatus according to a first embodiment of the present invention. In addition, although the following examples explain the inspection of the wiring pattern of the TAB tape, the present invention is also applicable to the case where the pattern formed on the polyimide resin film is inspected by reflected illumination light outside the TAB tape. The same can be applied.
The pattern inspection apparatus according to the present embodiment includes a tape transport mechanism 10, and the TAB tape 5 on which the wiring pattern is formed is unwound from the feed reel 11 of the tape transport mechanism 10 and wound on the take-up reel 12.
In the vicinity of the take-up reel 12, a marker portion 3 for marking a defective pattern is provided. In the marker portion 3, a pattern determined to be defective is punched by a punch, or a mark such as color coating is applied so that the portion can be immediately confirmed visually as a defective product.
The TAB tape 5 delivered from the delivery reel 11 is sent to the inspection unit 1. A conveyance roller (not shown) is provided on the conveyance downstream side of the inspection unit 1, and a brake roller (not shown) is provided on the conveyance upstream side of the inspection unit 1. Tension is applied in the transport direction to prevent sagging of the TAB tape 5 in the inspection unit 1.
The inspection unit 1 includes a reflected illumination unit 1 a and an imaging unit 1 b that images a pattern 5 a such as a circuit formed on the TAB tape 5 with illumination light reflected by the TAB tape 5. Further, a stage 1c that holds the TAB tape 5 by suction during imaging is provided on the opposite side of the reflected illumination means 1a with respect to the TAB tape 5. This stage 1c can also be removed.

The light source of the reflective illumination unit 1a is, for example, an infrared LED that emits light having a wavelength of 850 nm. In this infrared LED, the peak wavelength of the emitted light is 850 nm and the half width is 40 nm as described above. This LED is generally used in, for example, a television remote controller.
In this embodiment, a CCD camera is used as the imaging means 1b. The light receiving sensitivity of the CCD is in a practical range up to a wavelength of about 400 to 1000 nm as shown in FIG. In FIG. 12, the horizontal axis indicates the wavelength (nm) and the vertical axis indicates the response characteristics. In this figure, the 10 μm pixel and 7 μm pixels are shown, but both are in the practical range up to a wavelength of about 400 to 1000 nm. In addition to the CCD, a CMOS can be used as the imaging unit 1b.

The scanning unit 2 scans the imaging unit 1b and the reflected illumination unit 1a on the inspection pattern 5a of the TAB tape 5 in the left-right direction on the paper surface of the drawing, and the entire inspection region (region where the pattern is formed) of the TAB tape 5. Get the image.
Note that the scanning direction by the scanning unit 2 may be the front-rear direction of the drawing sheet. In this case, the reflected illumination unit 1a is arranged in a state rotated by 90 ° about the optical axis of the imaging unit 1b. .
In addition, the captured image pattern is compared with a reference master pattern to determine the quality of the product, and the control unit 4 that controls the operation of the inspection unit 1, the scanning unit 2, the marker unit 3, and the tape transport mechanism 10. Is provided. A reference pattern (master pattern) serving as a reference for pattern inspection is input to the control unit 4 in advance. Note that the reference pattern may be an image obtained by capturing an actual pattern determined to be non-defective, or may be one using CAD data.
At the time of pattern inspection on the TAB tape, the TAB tape 5 is illuminated by the reflective illumination means 1a, and the reflected light from the TAB tape 5 enters the imaging means 1b. The image of the inspection pattern imaged by the imaging means 1b is sent to the control unit 4 and compared with the reference pattern, and the quality of the pattern is determined.

Using the apparatus shown in FIG. 1, the wiring pattern formed on the TAB tape was imaged when the stage holding the TAB tape was variously changed to one having a different reflectance and when the stage was not provided.
The result is shown in FIG. FIG. 3 shows the surface reflectance of each stage. The reflectivity was measured using a Ushio Electric reflectometer (URE).
In addition, the transmittance | permeability in wavelength 850nm of the resin film used for the TAB tape in a present Example is about 60% as shown in the said FIG.
2A shows the case where the surface of the stage is an aluminum plate (reflectance at a wavelength of 850 nm is about 60%), and FIG. 2B shows the case where the surface is a copper plate (the reflectance at a wavelength of 850 nm is about 65%). In both cases, the captured image has a small contrast between the wiring pattern and the resin film, and it is difficult to detect the wiring pattern.

FIG. 2C shows the case where the stage surface is colored blue, and FIG. 2D shows the case where the stage surface is colored orange (both have a reflectance of about 10% at a wavelength of 850 nm).
In contrast to the above (a) and (b), the picked-up image in the case of coloring has a higher contrast between the wiring pattern and the resin film, and this enables detection of the wiring pattern and image processing. .
FIG. 2 (e) shows a case where the stage surface is colored gray (reflectance at a wavelength of 850 nm is about 5%), FIG. 2 (f) shows a case where the surface is black anodized (glossy black), and FIG. In this case, the surface of black anodized is frosted with sandpaper (glossy black).
(F) (g) The reflectance at a wavelength of 850 nm is 2-3%. The contrast of the captured image is further increased compared to (c) and (d).
Therefore, by providing a member having a reflectance of the illumination light wavelength of 10% or less on the side opposite to the side irradiated with the illumination light of the TAB tape, an image with a large contrast can be taken.

FIG. 4 shows a schematic configuration diagram of a wiring pattern inspection apparatus according to a second embodiment of the present invention.
As in FIG. 1, the TAB tape 5 is unwound from the delivery reel 11 of the tape transport mechanism 10 and is taken up by the take-up reel 12.
In the vicinity of the take-up reel 12, a marker portion 3 for marking a defective pattern is provided.
The TAB tape 5 delivered from the delivery reel 11 is sent to the inspection unit 1. The inspection unit 1 is composed of, for example, the reflective illumination unit 1a including an infrared LED that emits light having a wavelength of 850 nm, and the imaging unit 1b including a CCD camera that images the pattern 5a.
The scanning unit 2 scans the imaging unit 1b and the reflected illumination unit 1a on the inspection pattern 5a of the TAB tape 5 in the horizontal direction of the drawing.
At the time of pattern inspection on the TAB tape, the TAB tape 5 is illuminated by the reflection illumination means 1a, and the reflected light from the TAB tape 5 enters the imaging means 1b. The image of the inspection pattern imaged by the imaging means 1b is sent to the control unit 4 and compared with the reference pattern, and the quality of the pattern is determined.

In this embodiment, the stage for sucking and holding the tape shown in FIG. 1 is eliminated, and a tape gripping means 21 for gripping and fixing a peripheral portion other than the inspection area of the tape is provided.
FIG. 5 is a plan view of the inspection unit 1. As shown in the figure, the tape gripping means 21 is provided at the four corners of the peripheral portion of the inspection area, and includes a grip portion 22 for gripping the TAB tape 5 and a grip drive portion 23.
The grip portion 22 grips a peripheral portion that is not the inspection area of the TAB tape 5, and the grip drive portion 23 pulls the tape in the width direction (up and down in the figure) to apply tension, so that the tape does not move during imaging. To fix.

FIG. 6 is a diagram illustrating a detailed configuration example of the tape gripping means 21. This figure shows the configuration of the tape gripping means 21 as viewed from the transport direction.
The grip portion 22 grips the peripheral portion of the TAB tape 5 by the grip portions Gr1 and Gr2, and the grip portion 22 moves in the horizontal direction of the drawing by the grip drive portion 23.
The grip drive unit 23 includes a ball screw 23b that is rotated by a feed motor 23a. The ball screw 23b is rotated by the feed motor 23a, and the grip unit 22 that engages with the ball screw 23b is in the horizontal direction in FIG. Move in the width direction.
The grip portion 22 has a structure in which the peripheral portion of the TAB tape 5 is sandwiched from above and below by the grip portion Gr1 of the upper member 22a and the grip portion Gr2 of the lower member 22b. A shaft 22c is attached to the lower member 22b and is fixed to the grip fixing base 22d.
The upper member 22a is attached to the lower member 22b via a shaft 22e, and rotates about the shaft 22e. The upper member 22a and the lower member 22b are biased in the direction in which the gripping portions Gr1 and Gr2 are opened by springs 22f on the opposite sides of the gripping portions Gr1 and Gr2 of the upper member 22a and the lower member 22b.
An air cylinder 22g is attached to the lower member 22b, and the drive shaft of the air cylinder 22g protrudes through the lower member 22b, and the tip of the air cylinder 22g is opposite to the grip portion Gr1 across the shaft 22e of the upper member 22a. It is in contact with the side. For this reason, when the air cylinder 22g is driven, the upper member 22a rotates about the shaft 22e, and the grip portions Gr1 and Gr2 are closed.

FIG. 2 (h) shows the experimental results when the stage for sucking and holding the tape is eliminated, the peripheral part other than the inspection area of the tape is gripped and fixed by the tape gripping means 21.
The illumination light transmitted through the TAB tape 5 is not reflected and therefore does not enter the image sensor. Therefore, an image with good contrast can be obtained.

  In the said 1st, 2nd Example, although LED which radiates | emits 850 nm light was used as a light source of the reflective illumination means 1a, if it is LED which radiates | emits the light of wavelength 500nm which permeate | transmits the TAB tape 5, other LEDs can be used. For example, an LED that emits light having a wavelength of 700 nm can be used in the same manner. Even when an LED that emits light having a wavelength of 700 nm is used, the same effects as those of the first and second embodiments can be obtained. .

Moreover, even if it is not a light source which radiates | emits monochromatic light of an infrared region like said LED but a light source which radiates | emits continuous light like a halogen lamp and a xenon lamp, it contains light with a wavelength of 500 nm or more If it is, it can be used similarly.
In that case, a filter that cuts a wavelength of 500 nm or less, for example, an infrared transmission filter may be provided between the reflective illumination unit 1a and the TAB tape 5 or between the TAB tape 5 and the imaging unit 1b.
If an infrared transmission filter is provided between the reflective illumination unit 1 a and the TAB tape 5, the reflected light of 500 nm or less is not irradiated on the TAB tape 5. If an infrared transmission filter is provided between the TAB tape 5 and the imaging means 1b, light of 500 nm or less reflected from the TAB tape 5 does not enter the imaging element 1b. For this reason, an image with good contrast can be obtained as in the first and second embodiments.
Further, instead of providing the above infrared transmission filter between the tape and the image pickup means 1b, the image pickup means 1b is an image pickup element having no sensitivity at a wavelength of 500 nm or less and having sensitivity only in the infrared light region, for example, red An external CCD camera may be used.

It is a figure which shows schematic structure of the wiring pattern inspection apparatus of 1st Example of this invention. It is a figure which shows the image of the wiring pattern imaged with the apparatus of the Example of this invention. It is a figure which shows the surface reflectance at the time of changing the material of a stage surface, a color, etc. It is a figure which shows schematic structure of the wiring pattern inspection apparatus of 2nd Example of this invention. It is a top view of the inspection part of the 2nd example of the present invention. It is a figure which shows the detailed structural example of a tape holding means. It is a figure which shows the procedure in which a TAB tape is made, and the structure of a TAB tape. It is a figure which shows the TAB tape in which the wiring pattern was formed. It is a figure which shows an example of the wiring pattern imaged using reflected light. It is a figure which shows the transmittance | permeability of the typical polyimide resin film (thickness 75 micrometers) used for a TAB tape. It is a figure which shows a mode that the light from an illumination means is reflected in the part of a resin film. It is a figure which shows the spectral sensitivity curve of the CCD camera generally marketed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Test | inspection part 1a Reflection illumination means 1b Image pickup means 1c Stage 2 Scanning means 3 Marker part 4 Control part 5 TAB tape 5a Inspection pattern 10 Tape conveyance mechanism 11 Sending reel 12 Take-up reel 21 Tape grip means 22 Grip part 23 Grip drive part

Claims (5)

In the pattern inspection apparatus that inspects the appearance of the pattern by illuminating the pattern formed on the polyimide resin film with illumination light and imaging the reflected light from the pattern,
Illuminating means having LEDs that emit infrared light;
A pattern inspection apparatus comprising: an imaging unit having a CCD or a CMOS having sensitivity in an infrared light region provided on the same surface side as the illumination unit with respect to the resin film. In the pattern inspection apparatus that inspects the appearance of the pattern by illuminating the pattern formed on the polyimide resin film with illumination light and imaging the reflected light from the pattern,
Illumination means having a lamp that emits light including infrared light;
An image pickup means having a CCD or CMOS having sensitivity in the infrared light region provided on the same side as the illumination means with respect to the resin film, and inserted in the optical path of illumination light from the illumination means to the image pickup means A pattern inspection apparatus comprising a filter for cutting light having a wavelength of 500 nm or less. In the pattern inspection apparatus that inspects the appearance of the pattern by illuminating the pattern formed on the polyimide resin film with illumination light and imaging the reflected light from the pattern,
Illumination means having a lamp that emits light including infrared light;
A pattern inspection apparatus comprising: an imaging element provided on the same surface side as the illumination unit with respect to the resin film and having no sensitivity at a wavelength of 500 nm or less and sensitivity in an infrared light region. At the time of imaging, a stage that holds the resin film by suction is provided
4. The pattern inspection apparatus according to claim 1, wherein the stage has a surface infrared reflectance of 10% or less. 4. The apparatus according to claim 1, wherein a means for holding the periphery of the resin film is provided in place of the stage for adsorbing and holding the resin film, and tension is applied to the resin film by the holding means during imaging. Pattern inspection equipment.

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