JP2010507261A - ポリマー基材上で物質をパターニングする方法 - Google Patents
ポリマー基材上で物質をパターニングする方法 Download PDFInfo
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- H05B2203/017—Manufacturing methods or apparatus for heaters
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
基材の調製
透明なポリカーボネートの250マイクロメートル厚のフィルム(コネチカット州フェアフィールド(Fairfield)のゼネラル・エレクトリック社(GE Plastics division)のGEプラスチックス事業部(General Electric Company)(マサチューセッツ州ピッツフィールド(Pittsfield))から商標名レキサン(Lexan)として入手可能)を、隆起した正方形で補完した凹部グリッドラインのレリーフパターンを用いて加熱エンボス加工に付した。エンボス加工用具は、直径10センチメートルの溶融石英の円形プレートから、光リソグラフィーと反応性イオンエッチング法とを用いて製造した。この用具は、幅が10マイクロメートル及び高さが約10マイクロメートルの隆起部であって、正方形グリッドのラインを200マイクロメートルピッチで画定する隆起部を含んでいた。エンボス加工は、モデル・オートM(Model AUTO M)積層プレス機(インディアナ州ウォバッシュ(Wabash)のカーバー社(Carver, Inc.)から入手可能)を用いて、エンボス加工用具をポリカーボネートフィルムに対して176℃で15分間10,000ニュートンの力で押圧することによって実施した。エンボス加工したフィルムには、幅が10マイクロメートル及び深さが約10マイクロメートルのチャネルであって、正方形グリッドのラインを200マイクロメートルピッチで画定するチャネルが含まれていた。エンボス加工した時点で、ポリカーボネートフィルムは、15オングストロームのチタン層を蒸着することによって先ず金属化して連結層を形成し、次いで加熱蒸発装置(ペンシルバニア州ピッバーグ(Pittsburgh)のカート・J・レスカー社(Kurt J. Lesker Co.)から入手可能)を用いて600オングストロームの金層を形成した。
ポリジメチルシロキサン(PDMS、ミシガン州ミッドランド(Midland)のダウ・コーニング社(Dow Corning Corporation)製のシルガード(Sylgard)(登録商標)184)の本質的に形状のないプレート2枚をシリコン単結晶に向けて投じた。プレートを飽和させるために、一方のプレートを、成型した平坦な面を大気に曝露しながら、5ミリモル濃度のオクタデカンチオールのエタノール溶液に2日間部分的に沈めた。続いて、二枚目のプレートを一枚目のプレートと手で接触させて、一枚目のプレートの上に30分間配置することで、二枚目のプレートのインク面を作製した。
SAM印刷された基材(機能化されていない10マイクロメートル幅の溝を有するもの)は、その後、液状エッチング液に15分間沈めることで、構造化された基材の凹部領域から金を取り除くことができる。金用の液状エッチング液は、例えば、0.02モル濃度の硝酸第二鉄と0.03モル濃度のチオ尿素との水溶液であり得る。
Claims (20)
- ポリマー基材上で第1物質をパターニングする方法であって、前記方法が、
凹部領域と、隣接する隆起領域と、を含むレリーフパターンの付いた主要表面を有する、ポリマーフィルム基材を提供する工程と、
前記ポリマーフィルム基材の前記主要表面上に第1物質を堆積させて、コーティングされたポリマーフィルム基材を形成する工程と、
前記コーティングされたポリマーフィルム基材の前記隆起領域の上に機能化材料の層を選択的に形成して、機能化された隆起領域と機能化されていない凹部領域とを形成する工程と、
前記ポリマー基材の機能化されていない凹部領域から前記第1物質を選択的にエッチングして、第1物質のパターニングされたポリマー基材を形成する工程と、を含む、方法。 - 前記ポリマーフィルム基材を機械的用具を用いて成型又はエンボス加工することによって、レリーフパターンの付いた前記主要表面を形成することを更に含む、請求項1に記載の方法。
- 前記提供工程が、透明なポリマーフィルム基材を提供することを含む、請求項1に記載の方法。
- 前記提供工程が、ポリオレフィン、ポリアミド、ポリイミド、ポリカーボネート、ポリエステル、ポリアクリレート、ポリメタクリレート、及び液晶ポリマーの群より選択されるポリマーを含むポリマーフィルム基材を提供することを含む、請求項1に記載の方法。
- 前記形成工程が、自己組織化単層を前記隆起領域の上に選択的に形成することを含み、前記自己組織化単層が、有機硫黄化合物、シラン、ホスホン酸、ベンゾトリアゾール、及びカルボン酸からなる群より選択される化学種を含む、請求項1に記載の方法。
- 前記エッチング工程の後で前記機能化材料を前記隆起領域から取り除くことを更に含む、請求項1に記載の方法。
- 第1物質を堆積する工程が、金属を前記ポリマーフィルム基材上に堆積することを含む、請求項1に記載の方法。
- 前記形成工程が、前記機能化材料を、前記コーティングされたポリマーフィルム基材の前記隆起領域の上にエラストマープレートを用いて選択的に適用することを含む、請求項1に記載の方法。
- 前記形成工程が、前記コーティングされたポリマーフィルム基材の前記隆起領域の上に前記機能化材料を、形状の無いエラストマープレートを用いて選択的に適用することを含む、請求項1に記載の方法。
- ポリマーフィルム基材上で第1物質をパターニングする前記方法が、ロールツーロール加工装置を用いて実施される、請求項1に記載の方法。
- 第1物質を堆積する工程が、金、銀、パラジウム、白金、ロジウム、銅、ニッケル、鉄、インジウム、スズ、並びにそれらの混合物、合金、又は化合物からなる群より選択される金属を10〜30000オングストローム堆積させることを含む、請求項1に記載の方法。
- 前記提供工程が、近接する隆起領域でそれぞれが囲まれた不連続な凹部領域の配列を含むレリーフパターンの付いた主要表面を有するポリマーフィルム基材を提供することを含む、請求項1に記載の方法。
- 前記提供工程が、近接する凹部領域で互いに単離された直線トレースの形状で複数の隆起領域を含むレリーフパターンの付いた主要表面を有するポリマーフィルム基材を提供することを含む、請求項1に記載の方法。
- 前記提供工程が、近接する凹部領域で互いに単離された直線トレースの形状で複数の隆起領域を含むレリーフパターンの付いた主要表面を有するポリマーフィルム基材を提供することを含み、前記隆起領域が、0.1〜10マイクロメートルの範囲の高さと0.25マイクロメートル〜2ミリメートルまでの範囲の幅とを有する、請求項13に記載の方法。
- 前記提供工程が、概ね平行な隣接する隆起領域間の距離が0.25マイクロメートル〜1センチメートルの範囲である、概ね平行な直線トレースの形状の複数の隆起領域を含むレリーフパターンの付いた主要表面を有するポリマーフィルム基材を提供することを含む、請求項13に記載の方法。
- ポリマーフィルムを含む物品であって、
前記ポリマーフィルムが、隆起領域と、隣接する凹部領域と、を含むレリーフ構造の付いた主要表面を有し、
前記隆起領域が第1物質で選択的にコーティングされており、前記第1物質が機能化分子を担持している、物品。 - 前記機能化分子が自己組織化単層の形状である、請求項16に記載の物品。
- 前記ポリマーフィルムが、厚さ5マイクロメートル〜1000マイクロメートルであり、ポリイミド、ポリエチレン、ポリプロピレン、ポリアクリレート、ポリ(メチルメタクリレート)、ビスフェノールAのポリカーボネート、ポリ(塩化ビニル)、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリ(フッ化ビニリデン)、ポリメタクリレート、及び液晶ポリマーの群より選択されるポリマーを含む、請求項16に記載の物品。
- 前記ポリマーフィルムが透明である、請求項16に記載の物品。
- 前記第1物質が、金、銀、パラジウム、白金、ロジウム、銅、ニッケル、鉄、インジウム、スズ、並びにそれらの混合物、合金、又は化合物からなる群より選択される金属を含む、請求項16に記載の物品。
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US11/550,542 | 2006-10-18 | ||
US11/550,542 US8764996B2 (en) | 2006-10-18 | 2006-10-18 | Methods of patterning a material on polymeric substrates |
PCT/US2007/081390 WO2008048928A2 (en) | 2006-10-18 | 2007-10-15 | Methods of patterning a material on polymeric substrates |
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JP2010507261A true JP2010507261A (ja) | 2010-03-04 |
JP2010507261A5 JP2010507261A5 (ja) | 2010-11-25 |
JP5437808B2 JP5437808B2 (ja) | 2014-03-12 |
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EP (1) | EP2082629A2 (ja) |
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Cited By (3)
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JP2011007875A (ja) * | 2009-06-23 | 2011-01-13 | Asahi Kasei E-Materials Corp | ワイヤグリッド偏光板 |
JP2014094467A (ja) * | 2012-11-08 | 2014-05-22 | Mitsubishi Plastics Inc | 透明導電膜基材用ポリエステルフィルムおよび透明導電フィルム |
KR20160063368A (ko) * | 2013-09-30 | 2016-06-03 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅 |
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US9164037B2 (en) * | 2007-01-26 | 2015-10-20 | Palo Alto Research Center Incorporated | Method and system for evaluation of signals received from spatially modulated excitation and emission to accurately determine particle positions and distances |
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US8764996B2 (en) | 2014-07-01 |
CN101530010A (zh) | 2009-09-09 |
US20080095985A1 (en) | 2008-04-24 |
EP2082629A2 (en) | 2009-07-29 |
WO2008048928A3 (en) | 2008-07-24 |
JP5437808B2 (ja) | 2014-03-12 |
WO2008048928A2 (en) | 2008-04-24 |
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