JP5437808B2 - ポリマー基材上で物質をパターニングする方法 - Google Patents
ポリマー基材上で物質をパターニングする方法 Download PDFInfo
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- JP5437808B2 JP5437808B2 JP2009533464A JP2009533464A JP5437808B2 JP 5437808 B2 JP5437808 B2 JP 5437808B2 JP 2009533464 A JP2009533464 A JP 2009533464A JP 2009533464 A JP2009533464 A JP 2009533464A JP 5437808 B2 JP5437808 B2 JP 5437808B2
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
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- H—ELECTRICITY
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/268—Monolayer with structurally defined element
Description
基材の調製
透明なポリカーボネートの250マイクロメートル厚のフィルム(コネチカット州フェアフィールド(Fairfield)のゼネラル・エレクトリック社(GE Plastics division)のGEプラスチックス事業部(General Electric Company)(マサチューセッツ州ピッツフィールド(Pittsfield))から商標名レキサン(Lexan)として入手可能)を、隆起した正方形で補完した凹部グリッドラインのレリーフパターンを用いて加熱エンボス加工に付した。エンボス加工用具は、直径10センチメートルの溶融石英の円形プレートから、光リソグラフィーと反応性イオンエッチング法とを用いて製造した。この用具は、幅が10マイクロメートル及び高さが約10マイクロメートルの隆起部であって、正方形グリッドのラインを200マイクロメートルピッチで画定する隆起部を含んでいた。エンボス加工は、モデル・オートM(Model AUTO M)積層プレス機(インディアナ州ウォバッシュ(Wabash)のカーバー社(Carver, Inc.)から入手可能)を用いて、エンボス加工用具をポリカーボネートフィルムに対して176℃で15分間10,000ニュートンの力で押圧することによって実施した。エンボス加工したフィルムには、幅が10マイクロメートル及び深さが約10マイクロメートルのチャネルであって、正方形グリッドのラインを200マイクロメートルピッチで画定するチャネルが含まれていた。エンボス加工した時点で、ポリカーボネートフィルムは、15オングストロームのチタン層を蒸着することによって先ず金属化して連結層を形成し、次いで加熱蒸発装置(ペンシルバニア州ピッバーグ(Pittsburgh)のカート・J・レスカー社(Kurt J. Lesker Co.)から入手可能)を用いて600オングストロームの金層を形成した。
ポリジメチルシロキサン(PDMS、ミシガン州ミッドランド(Midland)のダウ・コーニング社(Dow Corning Corporation)製のシルガード(Sylgard)(登録商標)184)の本質的に形状のないプレート2枚をシリコン単結晶に向けて投じた。プレートを飽和させるために、一方のプレートを、成型した平坦な面を大気に曝露しながら、5ミリモル濃度のオクタデカンチオールのエタノール溶液に2日間部分的に沈めた。続いて、二枚目のプレートを一枚目のプレートと手で接触させて、一枚目のプレートの上に30分間配置することで、二枚目のプレートのインク面を作製した。
SAM印刷された基材(機能化されていない10マイクロメートル幅の溝を有するもの)は、その後、液状エッチング液に15分間沈めることで、構造化された基材の凹部領域から金を取り除くことができる。金用の液状エッチング液は、例えば、0.02モル濃度の硝酸第二鉄と0.03モル濃度のチオ尿素との水溶液であり得る。
Claims (1)
- ポリマー基材上で第1物質をパターニングする方法であって、前記方法が、
底面及び側壁を有する凹部領域と、隣接する隆起領域と、を含むレリーフパターンの付いた主要表面を有する透明なポリマーフィルム基材を提供する工程と、
前記ポリマーフィルム基材の前記主要表面上に第1物質を堆積させて、コーティングされたポリマーフィルム基材を形成する工程であって、前記第1物質を堆積させる工程が、金属を前記ポリマーフィルム基材上に堆積することを含む、形成する工程と、
前記コーティングされたポリマーフィルム基材の前記隆起領域の上に、形状が無いエラストマープレートを用いて機能化材料を選択的に配置することで、前記機能化材料の層を形成して、機能化された隆起領域と機能化されていない凹部領域とを形成する工程であって、前記機能化材料が、前記隆起領域の上に選択的に形成された自己組織化単層であり、該自己組織化単層が、有機硫黄化合物、シラン、ホスホン酸、ベンゾトリアゾール、及びカルボン酸からなる群より選択される化学種を含み、かつ該形成する工程が、前記コーティングされたポリマーフィルム基材を支持体から巻戻すことと前記コーティングされたポリマーフィルム基材を支持体に巻き取ることとを含む、形成する工程と、
前記ポリマー基材の機能化されていない凹部領域の前記底面及び側壁から前記第1物質を選択的にエッチングして、第1物質のパターニングされたポリマー基材を形成する工程と、を含み、
ポリマーフィルム基材上で第1物質をパターニングする前記方法が、ロールツーロール加工装置を用いて実施され、かつ、第1物質を堆積する前記工程が、金属を前記ポリマーフィルム基材上に堆積することを含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/550,542 | 2006-10-18 | ||
US11/550,542 US8764996B2 (en) | 2006-10-18 | 2006-10-18 | Methods of patterning a material on polymeric substrates |
PCT/US2007/081390 WO2008048928A2 (en) | 2006-10-18 | 2007-10-15 | Methods of patterning a material on polymeric substrates |
Publications (3)
Publication Number | Publication Date |
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JP2010507261A JP2010507261A (ja) | 2010-03-04 |
JP2010507261A5 JP2010507261A5 (ja) | 2010-11-25 |
JP5437808B2 true JP5437808B2 (ja) | 2014-03-12 |
Family
ID=39166986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009533464A Expired - Fee Related JP5437808B2 (ja) | 2006-10-18 | 2007-10-15 | ポリマー基材上で物質をパターニングする方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8764996B2 (ja) |
EP (1) | EP2082629A2 (ja) |
JP (1) | JP5437808B2 (ja) |
CN (1) | CN101530010A (ja) |
WO (1) | WO2008048928A2 (ja) |
Cited By (1)
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Publication number | Priority date | Publication date | Assignee | Title |
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KR101757241B1 (ko) | 2010-12-29 | 2017-07-26 | 엘지디스플레이 주식회사 | 나노 와이어 그리드 편광판 및 그 제조방법과 이를 포함하는 액정표시장치 |
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WO2008048928A2 (en) | 2008-04-24 |
JP2010507261A (ja) | 2010-03-04 |
US8764996B2 (en) | 2014-07-01 |
CN101530010A (zh) | 2009-09-09 |
WO2008048928A3 (en) | 2008-07-24 |
EP2082629A2 (en) | 2009-07-29 |
US20080095985A1 (en) | 2008-04-24 |
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