JP2010283354A - 発光ダイオード及びその製造方法 - Google Patents
発光ダイオード及びその製造方法 Download PDFInfo
- Publication number
- JP2010283354A JP2010283354A JP2010129948A JP2010129948A JP2010283354A JP 2010283354 A JP2010283354 A JP 2010283354A JP 2010129948 A JP2010129948 A JP 2010129948A JP 2010129948 A JP2010129948 A JP 2010129948A JP 2010283354 A JP2010283354 A JP 2010283354A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- layer
- epitaxy
- growth condition
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098119155A TWI398966B (zh) | 2009-06-08 | 2009-06-08 | 發光元件及其製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015012090A Division JP2015097289A (ja) | 2009-06-08 | 2015-01-26 | 発光ダイオード及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010283354A true JP2010283354A (ja) | 2010-12-16 |
| JP2010283354A5 JP2010283354A5 (enExample) | 2013-07-11 |
Family
ID=43300111
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010129948A Pending JP2010283354A (ja) | 2009-06-08 | 2010-06-07 | 発光ダイオード及びその製造方法 |
| JP2015012090A Pending JP2015097289A (ja) | 2009-06-08 | 2015-01-26 | 発光ダイオード及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015012090A Pending JP2015097289A (ja) | 2009-06-08 | 2015-01-26 | 発光ダイオード及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8304787B2 (enExample) |
| JP (2) | JP2010283354A (enExample) |
| KR (1) | KR101380799B1 (enExample) |
| DE (1) | DE102010029803B4 (enExample) |
| TW (1) | TWI398966B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014007208A (ja) * | 2012-06-22 | 2014-01-16 | Nano Material Kenkyusho:Kk | 半導体デバイス |
| JP2017085137A (ja) * | 2012-11-12 | 2017-05-18 | 晶元光▲電▼股▲ふん▼有限公司 | 半導体発光素子及びその製造方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398966B (zh) | 2009-06-08 | 2013-06-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| CN103779374B (zh) * | 2014-01-29 | 2019-01-15 | 佛山市南海区联合广东新光源产业创新中心 | 发光整流芯片 |
| US10510800B2 (en) * | 2016-02-09 | 2019-12-17 | The Penn State Research Foundation | Device comprising a light-emitting diode and a Schottky barrier diode rectifier, and method of fabrication |
| US10879217B1 (en) * | 2019-09-11 | 2020-12-29 | Jade Bird Display (shanghai) Limited | Multi-color LED pixel unit and micro-LED display panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008140893A (ja) * | 2006-11-30 | 2008-06-19 | Sumitomo Electric Ind Ltd | 半導体デバイスおよびその製造方法 |
| JP2009016467A (ja) * | 2007-07-03 | 2009-01-22 | Sony Corp | 窒化ガリウム系半導体素子及びこれを用いた光学装置並びにこれを用いた画像表示装置 |
| JP2009519605A (ja) * | 2005-12-16 | 2009-05-14 | ソウル オプト デバイス カンパニー リミテッド | 複数の発光セルが配列された発光素子 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2890390B2 (ja) * | 1994-07-06 | 1999-05-10 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| JP3604205B2 (ja) * | 1995-09-18 | 2004-12-22 | 日亜化学工業株式会社 | 窒化物半導体の成長方法 |
| JP3448196B2 (ja) * | 1997-07-25 | 2003-09-16 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| JP3496512B2 (ja) * | 1997-06-30 | 2004-02-16 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3516433B2 (ja) * | 1997-12-19 | 2004-04-05 | 昭和電工株式会社 | 化合物半導体発光素子 |
| JP3516434B2 (ja) * | 1997-12-25 | 2004-04-05 | 昭和電工株式会社 | 化合物半導体発光素子 |
| US7193246B1 (en) * | 1998-03-12 | 2007-03-20 | Nichia Corporation | Nitride semiconductor device |
| JP4431290B2 (ja) * | 2001-05-28 | 2010-03-10 | 昭和電工株式会社 | 半導体素子および半導体層 |
| DE60224681T2 (de) * | 2001-08-20 | 2009-01-08 | Showa Denko K.K. | Mehrfarben-lichtemissionslampe und lichtquelle |
| US7213942B2 (en) * | 2002-10-24 | 2007-05-08 | Ac Led Lighting, L.L.C. | Light emitting diodes for high AC voltage operation and general lighting |
| JP2006114886A (ja) * | 2004-09-14 | 2006-04-27 | Showa Denko Kk | n型III族窒化物半導体積層構造体 |
| TWI239666B (en) * | 2004-09-16 | 2005-09-11 | Chen-Lun Hsingchen | LED package with diode protection circuit |
| US7737459B2 (en) * | 2004-09-22 | 2010-06-15 | Cree, Inc. | High output group III nitride light emitting diodes |
| WO2006054737A1 (en) * | 2004-11-18 | 2006-05-26 | Showa Denko K.K. | Gallium nitride-based semiconductor stacked structure, method for fabrication thereof, gallium nitride-based semiconductor device and lamp using the device |
| JP2006344930A (ja) * | 2005-04-07 | 2006-12-21 | Showa Denko Kk | Iii族窒化物半導体素子の製造方法 |
| TW200723559A (en) * | 2005-12-13 | 2007-06-16 | Ind Tech Res Inst | Alternating current (AC) light emitting assembly and AC light emitting device |
| WO2006127030A1 (en) * | 2005-05-20 | 2006-11-30 | Cree, Inc. | High efficacy white led |
| JP3972943B2 (ja) * | 2005-07-19 | 2007-09-05 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| JP2007042751A (ja) * | 2005-08-01 | 2007-02-15 | Hitachi Cable Ltd | 半導体発光素子 |
| DE112006002403T5 (de) * | 2005-09-07 | 2008-07-10 | Showa Denko K.K. | Verbindungshalbleiter-Bauelement |
| JP4936277B2 (ja) * | 2006-07-13 | 2012-05-23 | 国立大学法人東京農工大学 | アルミニウム系iii族窒化物結晶の製造方法 |
| JP5139005B2 (ja) * | 2007-08-22 | 2013-02-06 | 株式会社東芝 | 半導体発光素子及び半導体発光装置 |
| KR20100046195A (ko) * | 2007-08-31 | 2010-05-06 | 라티스 파워(지앙시) 코포레이션 | 초고 역방향 항복 전압을 갖는 갈륨 니트라이드 발광 장치 |
| KR100889956B1 (ko) * | 2007-09-27 | 2009-03-20 | 서울옵토디바이스주식회사 | 교류용 발광다이오드 |
| JP2009200382A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | 半導体発光素子の製造方法 |
| TWI398966B (zh) | 2009-06-08 | 2013-06-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
-
2009
- 2009-06-08 TW TW098119155A patent/TWI398966B/zh not_active IP Right Cessation
-
2010
- 2010-06-07 US US12/795,169 patent/US8304787B2/en not_active Expired - Fee Related
- 2010-06-07 JP JP2010129948A patent/JP2010283354A/ja active Pending
- 2010-06-08 KR KR1020100053762A patent/KR101380799B1/ko not_active Expired - Fee Related
- 2010-06-08 DE DE102010029803.4A patent/DE102010029803B4/de not_active Expired - Fee Related
-
2015
- 2015-01-26 JP JP2015012090A patent/JP2015097289A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009519605A (ja) * | 2005-12-16 | 2009-05-14 | ソウル オプト デバイス カンパニー リミテッド | 複数の発光セルが配列された発光素子 |
| JP2008140893A (ja) * | 2006-11-30 | 2008-06-19 | Sumitomo Electric Ind Ltd | 半導体デバイスおよびその製造方法 |
| JP2009016467A (ja) * | 2007-07-03 | 2009-01-22 | Sony Corp | 窒化ガリウム系半導体素子及びこれを用いた光学装置並びにこれを用いた画像表示装置 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014007208A (ja) * | 2012-06-22 | 2014-01-16 | Nano Material Kenkyusho:Kk | 半導体デバイス |
| JP2017085137A (ja) * | 2012-11-12 | 2017-05-18 | 晶元光▲電▼股▲ふん▼有限公司 | 半導体発光素子及びその製造方法 |
| US10283669B2 (en) | 2012-11-12 | 2019-05-07 | Epistar Corporation | Semiconductor light emitting device and method of fabricating the same |
| US10651335B2 (en) | 2012-11-12 | 2020-05-12 | Epistar Corporation | Semiconductor light emitting device and method of fabricating the same |
| US11251328B2 (en) | 2012-11-12 | 2022-02-15 | Epistar Corporation | Semiconductor light emitting device and method of fabricating the same |
| US11791436B2 (en) | 2012-11-12 | 2023-10-17 | Epistar Corporation | Semiconductor light emitting device and method of fabricating the same |
| US12471412B2 (en) | 2012-11-12 | 2025-11-11 | Epistar Corporation | Semiconductor light emitting device and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100308348A1 (en) | 2010-12-09 |
| DE102010029803B4 (de) | 2021-01-28 |
| JP2015097289A (ja) | 2015-05-21 |
| TWI398966B (zh) | 2013-06-11 |
| US8304787B2 (en) | 2012-11-06 |
| TW201044631A (en) | 2010-12-16 |
| KR20100131948A (ko) | 2010-12-16 |
| KR101380799B1 (ko) | 2014-04-04 |
| DE102010029803A1 (de) | 2011-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5193048B2 (ja) | 垂直に積層された発光ダイオードを有する発光素子 | |
| CN100421266C (zh) | 具有多个发光元件的发光装置 | |
| JP2015097289A (ja) | 発光ダイオード及びその製造方法 | |
| CN100524857C (zh) | 结合有多个单元的发光元件、制造发光元件的方法和使用发光元件的发光装置 | |
| CN102097560A (zh) | 具有复合式双电流扩展层的氮化物发光二极管 | |
| JP2009071220A (ja) | Iii族窒化物系化合物半導体発光素子 | |
| JP2010034610A (ja) | 発光素子及びその製造方法並びにこれを用いた発光装置 | |
| JP2009182357A (ja) | 発光装置 | |
| CN105514232B (zh) | 一种发光二极管外延片、发光二极管及外延片的制作方法 | |
| JP5229048B2 (ja) | Iii族窒化物半導体発光素子およびその製造方法 | |
| JP2011018869A (ja) | 窒化物半導体素子 | |
| JP2016136594A (ja) | エピタキシャルウエハ、半導体発光素子、発光装置及びエピタキシャルウエハの製造方法 | |
| JP2006210949A (ja) | 発光装置 | |
| CN103311389A (zh) | 发光二极管外延片及其制造方法 | |
| JP5948767B2 (ja) | 窒化物半導体発光素子 | |
| CN101930987B (zh) | 发光元件及其制造方法 | |
| JP6434655B2 (ja) | 高電圧駆動発光素子及びその製造方法 | |
| TWI496318B (zh) | 發光元件及其製造方法 | |
| JP2015018840A (ja) | 半導体発光素子 | |
| JP2014003121A (ja) | 窒化物半導体発光素子 | |
| TWI478381B (zh) | 發光元件及其製造方法 | |
| JP2000012903A (ja) | 窒化物半導体素子 | |
| JP5862177B2 (ja) | 窒化物半導体素子 | |
| JP2007188942A (ja) | 整流回路を副キャリアに結合した発光ダイオードの発光装置及びその製造方法 | |
| KR101283972B1 (ko) | 3단자 발광 소자 및 이를 이용하는 조명 회로 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130528 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130528 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131225 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140107 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140404 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140930 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150126 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150202 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20150327 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150915 |