JP2010261100A - 蒸着装置 - Google Patents
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- JP2010261100A JP2010261100A JP2010062241A JP2010062241A JP2010261100A JP 2010261100 A JP2010261100 A JP 2010261100A JP 2010062241 A JP2010062241 A JP 2010062241A JP 2010062241 A JP2010062241 A JP 2010062241A JP 2010261100 A JP2010261100 A JP 2010261100A
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 115
- 230000008021 deposition Effects 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000000151 deposition Methods 0.000 claims abstract 24
- 238000005259 measurement Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 27
- 239000010408 film Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 5
- 238000004091 panning Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/52—Means for observation of the coating process
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】被処理体に蒸着物質を蒸着させる蒸着装置において、蒸着物質を被処理体に蒸着させる蒸着源と、被処理体と離隔されて配され、一面上に蒸着源が配されるベースと、蒸着源と被処理体との間に位置する第1補正部及び第2補正部とを具備し、第1補正部及び第2補正部は、互いに対向するように、蒸着源の外郭部にそれぞれ配され、第1補正部及び第2補正部は、それぞれ回転しつつ、被処理体に蒸着される蒸着物質の厚さを調節することを特徴とする蒸着装置を提供する。
【選択図】図1
Description
100 蒸着装置
110 ベース
120 蒸着源
120a 第1外郭部
120b 第2外郭部
121,122,123 線形蒸着源
130 第1補正部
131 第1補正板
132 第1回転棒
133 第1駆動部
140 第2補正部
141 第2補正板
142 第2回転棒
143 第2駆動部
C 基板の中央部
L 基板の左外郭部
R 基板の右外郭部
Claims (21)
- 被処理体に蒸着物質を蒸着させる蒸着装置において、
前記蒸着物質を前記被処理体に蒸着させる蒸着源と、
前記被処理体と離隔されて配され、一面上に前記蒸着源が配されるベースと、
前記蒸着源と前記被処理体との間に位置する第1補正部及び第2補正部とを具備し、
前記第1補正部及び前記第2補正部は、互いに対向するように、前記蒸着源の外郭部にそれぞれ配され、
前記第1補正部及び前記第2補正部は、それぞれ回転しつつ、前記被処理体に蒸着される前記蒸着物質の厚さを調節することを特徴とする蒸着装置。 - 前記蒸着源は、少なくとも一つ以上の線形蒸着源からなることを特徴とする請求項1に記載の蒸着装置。
- 前記第1補正部は、前記線形蒸着源の長手方向の一外側部一部を覆うように配されることを特徴とする請求項2に記載の蒸着装置。
- 前記第1補正部は、前記線形蒸着源と平行した状態で回転しうることを特徴とする請求項3に記載の蒸着装置。
- 前記第1補正部は、前記線形蒸着源に対してパニングされることを特徴とする請求項3に記載の蒸着装置。
- 前記第2補正部は、前記線形蒸着源の長手方向の他の外側部一部を覆うように配されることを特徴とする請求項3に記載の蒸着装置。
- 前記第2補正部は、前記線形蒸着源と平行した状態で回転しうることを特徴とする請求項6に記載の蒸着装置。
- 前記第2補正部は、前記線形蒸着源に対してパニングされることを特徴とする請求項6に記載の蒸着装置。
- 前記第1補正部及び前記第2補正部それぞれは、前記被処理体の両外郭部で蒸着される前記蒸着物質の厚さを均一に補正するために、前記被処理体と平行した状態でパニングされることを特徴とする請求項1に記載の蒸着装置。
- 前記被処理体に蒸着される蒸着物質の厚さを測定する膜厚測定部を、さらに具備することを特徴とする請求項1に記載の蒸着装置。
- 前記第1補正部及び前記第2補正部それぞれは、前記蒸着源の長手方向に沿って配されることを特徴とする請求項1に記載の蒸着装置。
- 前記第1補正部は、
前記線形蒸着源と前記被処理体との間に位置し、その長手方向の一側部が前記線形蒸着源の長手方向の一外側部の一部を覆うように配される第1補正板と、
一端が前記第1補正板と結合され、他端が前記ベースと結合されるように配され、前記第1補正板を回転させる第1回転棒と、
前記第1回転棒をその長手方向の軸を中心に回転させる第1駆動部とを具備することを特徴とする請求項2に記載の蒸着装置。 - 前記第1補正板は、その一面が前記被処理体に向かうように配されることを特徴とする請求項12に記載の蒸着装置。
- 前記第1補正板は、前記線形蒸着源の長手方向に沿って配されることを特徴とする請求項13に記載の蒸着装置。
- 前記第1補正板は、前記第1回転棒がその中心軸を中心に、時計回り方向または逆時計回り方向に回転することによって、時計回り方向または逆時計回り方向にパニングされることを特徴とする請求項14に記載の蒸着装置。
- 前記第1補正板は、前記被処理体と平行した状態で、時計回り方向または逆時計回り方向にパニングされることを特徴とする請求項15に記載の蒸着装置。
- 前記第2補正部は、
前記線形蒸着源と前記被処理体との間に位置し、その長手方向の一側部が前記線形蒸着源の長手方向の他の外側部の一部を覆うように配される第2補正板と、
一端が前記第2補正板と結合され、他端が前記ベースと結合されるように配され、前記第2補正板を回転させる第2回転棒と、
前記第2回転棒をその長手方向の軸を中心に回転させる第2駆動部とを具備することを特徴とする請求項12に記載の蒸着装置。 - 前記第2補正板は、その一面が前記被処理体に向かうように配されることを特徴とする請求項17に記載の蒸着装置。
- 前記第2補正板は、前記線形蒸着源の長手方向に沿って配されることを特徴とする請求項18に記載の蒸着装置。
- 前記第2補正板は、前記第2回転棒がその中心軸を中心に、時計回り方向または逆時計回り方向に回転することによって、時計回り方向または逆時計回り方向にパニングされることを特徴とする請求項19に記載の蒸着装置。
- 前記第2補正板は、前記被処理体と平行した状態で、時計回り方向または逆時計回り方向にパニングされることを特徴とする請求項20に記載の蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090038450A KR101108151B1 (ko) | 2009-04-30 | 2009-04-30 | 증착 장치 |
KR10-2009-0038450 | 2009-04-30 |
Publications (2)
Publication Number | Publication Date |
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JP2010261100A true JP2010261100A (ja) | 2010-11-18 |
JP5197663B2 JP5197663B2 (ja) | 2013-05-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010062241A Active JP5197663B2 (ja) | 2009-04-30 | 2010-03-18 | 蒸着装置 |
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US (1) | US8961692B2 (ja) |
JP (1) | JP5197663B2 (ja) |
KR (1) | KR101108151B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015120943A (ja) * | 2013-12-20 | 2015-07-02 | パナソニックIpマネジメント株式会社 | 蒸着方法及び蒸着装置 |
Families Citing this family (25)
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JP5328726B2 (ja) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
KR101146982B1 (ko) | 2009-11-20 | 2012-05-22 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 및 유기 발광 디스플레이 장치 제조 방법 |
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KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
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KR20100119368A (ko) | 2010-11-09 |
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US20100275842A1 (en) | 2010-11-04 |
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