JP2010199154A - 固体撮像素子 - Google Patents

固体撮像素子 Download PDF

Info

Publication number
JP2010199154A
JP2010199154A JP2009039755A JP2009039755A JP2010199154A JP 2010199154 A JP2010199154 A JP 2010199154A JP 2009039755 A JP2009039755 A JP 2009039755A JP 2009039755 A JP2009039755 A JP 2009039755A JP 2010199154 A JP2010199154 A JP 2010199154A
Authority
JP
Japan
Prior art keywords
region
electrode
floating diffusion
solid
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009039755A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010199154A5 (enExample
Inventor
Takanori Watanabe
高典 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009039755A priority Critical patent/JP2010199154A/ja
Priority to US12/697,408 priority patent/US20100214464A1/en
Publication of JP2010199154A publication Critical patent/JP2010199154A/ja
Publication of JP2010199154A5 publication Critical patent/JP2010199154A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2009039755A 2009-02-23 2009-02-23 固体撮像素子 Pending JP2010199154A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009039755A JP2010199154A (ja) 2009-02-23 2009-02-23 固体撮像素子
US12/697,408 US20100214464A1 (en) 2009-02-23 2010-02-01 Solid-state imaging apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009039755A JP2010199154A (ja) 2009-02-23 2009-02-23 固体撮像素子

Publications (2)

Publication Number Publication Date
JP2010199154A true JP2010199154A (ja) 2010-09-09
JP2010199154A5 JP2010199154A5 (enExample) 2012-03-08

Family

ID=42630655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009039755A Pending JP2010199154A (ja) 2009-02-23 2009-02-23 固体撮像素子

Country Status (2)

Country Link
US (1) US20100214464A1 (enExample)
JP (1) JP2010199154A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010206181A (ja) * 2009-02-06 2010-09-16 Canon Inc 光電変換装置及び撮像システム
JP5538922B2 (ja) * 2009-02-06 2014-07-02 キヤノン株式会社 固体撮像装置の製造方法
JP2010206178A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置、及び光電変換装置の製造方法
JP6016434B2 (ja) 2012-04-23 2016-10-26 キヤノン株式会社 固体撮像装置、その製造方法、及びカメラ
JP2016082306A (ja) 2014-10-10 2016-05-16 キヤノン株式会社 撮像装置、撮像システム及び撮像装置の駆動方法
US11425365B2 (en) 2018-12-14 2022-08-23 Canon Kabushiki Kaisha Photoelectric conversion device, method of manufacturing photoelectric conversion device, and method of manufacturing semiconductor device
US11922175B2 (en) 2022-07-29 2024-03-05 Arista Networks, Inc. Unplanned reboot expedited recovery for network devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003115580A (ja) * 2001-10-04 2003-04-18 Sony Corp 固体撮像素子およびその製造方法
JP2004134685A (ja) * 2002-10-15 2004-04-30 Toshiba Corp 固体撮像装置及びその製造方法
JP2005268814A (ja) * 2002-06-27 2005-09-29 Canon Inc 固体撮像装置及び固体撮像装置を用いたカメラシステム
JP2006310835A (ja) * 2005-04-28 2006-11-09 Samsung Electronics Co Ltd Cmosイメージセンサー及びその製造方法
JP2008124463A (ja) * 2006-11-08 2008-05-29 Samsung Electronics Co Ltd Cmosイメージセンサーのピクセル構造及び該回路

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031787A (ja) * 2001-07-17 2003-01-31 Canon Inc 固体撮像素子及びその駆動方法
US7078745B2 (en) * 2003-03-05 2006-07-18 Micron Technology, Inc. CMOS imager with enhanced transfer of charge and low voltage operation
US7095075B2 (en) * 2003-07-01 2006-08-22 Micron Technology, Inc. Apparatus and method for split transistor memory having improved endurance
JP2005142470A (ja) * 2003-11-10 2005-06-02 Seiko Instruments Inc 光電変換装置及びイメージセンサーic
JP2006073736A (ja) * 2004-09-01 2006-03-16 Canon Inc 光電変換装置、固体撮像装置及び固体撮像システム
JP4916101B2 (ja) * 2004-09-01 2012-04-11 キヤノン株式会社 光電変換装置、固体撮像装置及び固体撮像システム
JP2006073885A (ja) * 2004-09-03 2006-03-16 Canon Inc 固体撮像装置、その製造方法、およびデジタルカメラ
JP5132102B2 (ja) * 2006-08-01 2013-01-30 キヤノン株式会社 光電変換装置および光電変換装置を用いた撮像システム
JP5110820B2 (ja) * 2006-08-02 2012-12-26 キヤノン株式会社 光電変換装置、光電変換装置の製造方法及び撮像システム
JP4350768B2 (ja) * 2007-04-16 2009-10-21 キヤノン株式会社 光電変換装置及び撮像装置
JP2009021809A (ja) * 2007-07-11 2009-01-29 Canon Inc 撮像装置の駆動方法、撮像装置、及び撮像システム
JP5153378B2 (ja) * 2008-02-15 2013-02-27 キヤノン株式会社 固体撮像装置及びその駆動方法
JP5335271B2 (ja) * 2008-04-09 2013-11-06 キヤノン株式会社 光電変換装置及びそれを用いた撮像システム
JP5188275B2 (ja) * 2008-06-06 2013-04-24 キヤノン株式会社 固体撮像装置、その駆動方法及び撮像システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003115580A (ja) * 2001-10-04 2003-04-18 Sony Corp 固体撮像素子およびその製造方法
JP2005268814A (ja) * 2002-06-27 2005-09-29 Canon Inc 固体撮像装置及び固体撮像装置を用いたカメラシステム
JP2004134685A (ja) * 2002-10-15 2004-04-30 Toshiba Corp 固体撮像装置及びその製造方法
JP2006310835A (ja) * 2005-04-28 2006-11-09 Samsung Electronics Co Ltd Cmosイメージセンサー及びその製造方法
JP2008124463A (ja) * 2006-11-08 2008-05-29 Samsung Electronics Co Ltd Cmosイメージセンサーのピクセル構造及び該回路

Also Published As

Publication number Publication date
US20100214464A1 (en) 2010-08-26

Similar Documents

Publication Publication Date Title
TWI497702B (zh) Solid state camera device
US8792035B2 (en) Solid-state imaging device and manufacturing method thereof, driving method of solid-state imaging device, and electronic equipment
KR101683307B1 (ko) 고체 촬상 장치, 고체 촬상 장치의 제조 방법, 및 전자 기기
JP4224036B2 (ja) フォトダイオード領域を埋め込んだイメージセンサ及びその製造方法
CN104981906B (zh) 固态图像传感器、其制造方法和电子设备
JP5651976B2 (ja) 固体撮像素子およびその製造方法、並びに電子機器
US20190088704A1 (en) Image sensors
CN102856334B (zh) 固体摄像装置、固体摄像装置的制造方法和电子设备
KR102290502B1 (ko) 이미지 센서 및 이의 제조 방법
US8669135B2 (en) System and method for fabricating a 3D image sensor structure
JP6186205B2 (ja) 撮像素子および撮像装置
JP2012199489A (ja) 固体撮像装置、固体撮像装置の製造方法、及び電子機器
JP2018160485A (ja) 撮像素子、電子機器
US9252185B2 (en) Back side illuminated image sensors with back side charge storage
JP2010199154A (ja) 固体撮像素子
KR101476035B1 (ko) 고체 촬상 장치의 제조 방법 및 고체 촬상 장치
US9257464B2 (en) Solid-state image device, method of fabricating the same, and electronic apparatus
JP4585964B2 (ja) 固体撮像装置
KR20140110844A (ko) 고체 촬상 소자 및 전자 기기
US20230133670A1 (en) Image sensing device
US9741758B2 (en) Methods of forming image sensors including deposited negative fixed charge layers on photoelectric conversion regions
TWI525801B (zh) 具有經摻雜之傳輸閘極的影像感測器
JP2010040997A (ja) 固体撮像素子
JP2006344914A (ja) 固体撮像装置およびその製造方法、並びにカメラ
KR20220116847A (ko) 이미지 센싱 장치

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120124

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120124

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130528

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130724

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131203

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140401